1. Field of the Invention
The invention relates to a heat dissipating device and a heat dissipating fin and, more particularly, to a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin.
2. Description of the Prior Art
Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
So far the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat dissipating fan, wherein one end of the heat pipe contacts the electronic component, which generates heat during operation, the other end of the heat pipe is connected to the heat dissipating fin, and the heat dissipating fan blows air to the heat dissipating fin, so as to dissipate heat. In the prior art, there are two methods for connecting the heat pipe and the heat dissipating fin, as follows. The first method is to fix the heat pipe in a through hole of the heat dissipating fin directly in a tight-fitting manner. However, when the heat pipe is inserted into the through hole by the first method, the heat pipe and the heat dissipating fin may pull and drag each other, such that a surface of the heat pipe may be scratched, the heat dissipating fin may deform or the through hole may crack. Accordingly, the yield rate of the first method is low. The second method is to connect the heat pipe and the through hole of the heat dissipating fin in a loose-fitting manner, wherein a thermal conductive adhesive or a solder paste is filled in a gap between the heat pipe and the heat dissipating fin. The second method has to form a groove on each of the heat dissipating fins to communicate with the through holes and then fill the thermal conductive adhesive or the solder paste in the groove. Afterward, the heat pipe is inserted into the through hole. Then, the thermal conductive adhesive or the solder paste are heated to be converted form solid into liquid and then cooled to be converted form liquid into solid, such that the thermal conductive adhesive or the solder paste is filled in the gap between the heat pipe and the heat dissipating fin. However, the process of the second method is complicated and additional thermal conductive adhesive or solder paste may be remained on the heat dissipating fin, such that the appearance is not good and the thermal impedance increases accordingly. Furthermore, the manufacturing time is long, so the manufacturing efficiency is low.
The invention provides a heat dissipating device utilizing a closed ring-shaped portion to fix a heat pipe on a heat dissipating fin, so as to solve the aforesaid problems.
According to an embodiment of the invention, a heat dissipating device comprises a heat dissipating fin and a heat pipe. The heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end, and the heat dissipating end is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.
According to another embodiment of the invention, a heat dissipating fin comprises a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening.
As mentioned in the above, the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process. An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Referring to
As shown in
In this embodiment, the closed ring-shaped portion 104 has a first U-shaped protruding ear 1040 and a second U-shaped protruding ear 1042, wherein the first U-shaped protruding ear 1040 is opposite to the second U-shaped protruding ear 1042. As shown in
The heat pipe 12 has a heat dissipating end 120 and a heat absorbing end 122, wherein the heat dissipating end 120 is opposite to the heat absorbing end 122. It should be noted that the structure and the principle of the heat pipe 12 are well known by one skilled in the art, so the related explanation will not be depicted herein.
As shown in
Referring to
As mentioned in the above, the invention utilizes the closed ring-shaped portion to fix the heat pipe on the heat dissipating fin through a punching process. An operator may insert the heat dissipating end of the heat pipe into the through hole and the closed ring-shaped portion of the heat dissipating fin in a loose-fitting manner and then punch the closed ring-shaped portion. After punching the closed ring-shaped portion, the opening of the U-shaped protruding ear of the closed ring-shaped portion shrinks, such that the closed ring-shaped portion fixes the heat dissipating end of the heat pipe in the tight-fitting manner. Accordingly, the invention can connect the heat pipe and the heat dissipating fin tightly and improve the yield rate and the efficiency of manufacturing the heat dissipating device.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
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201320751706.2 | Nov 2013 | CN | national |