HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING SAME

Abstract

A vacuum heat-dissipating device (300) includes a container (310), a top wall (320) coupled to the container, and working fluid sealed in the heat-dissipating device. The container includes a bottom wall (312) and a peripheral wall (314) perpendicular to the bottom wall. A catalyst layer (330) is disposed on an inner surface of the bottom wall. A plurality of CNTs (340) are formed on the catalyst layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present heat-dissipating device and method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat-dissipating device and method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a diagrammatic flow chart of a method for manufacturing a heat-dissipating device in accordance with an exemplary embodiment of the present invention;

FIGS. 2A to 2F illustrate successive stages of the method shown in FIG. 1;

FIG. 3 is a cross sectional schematic view of a heat-dissipating device in accordance with a preferred embodiment;

FIG. 4 is a cross sectional schematic view of a heat-dissipating device in accordance with another embodiment; and

FIG. 5 is a cross sectional schematic view of a typical heat-dissipating device.

Claims

1. A heat-dissipating device, comprising: a container comprisinga bottom wall, a top wall and a peripheral wall interconnecting the bottom wall and the top wall;a working fluid received in the container;a wick structure disposed on an inner surface of the peripheral wall;a catalyst layer disposed on an inner surface of the bottom wall; anda plurality of carbon nanotubes extending from the catalyst layer.

2. The heat-dissipating device as described in claim 1, wherein the container is a vacuum container.

3. The heat-dissipating device as described in claim 1, wherein the container is comprised of a material selected from the group consisting of iron, cobalt, nickel, copper, aluminum, titanium, and any alloy thereof.

4. The heat-dissipating device as described in claim 1, further comprising a plurality of fins arranged on an outer surface of the top wall of the container.

5. The heat-dissipating device as described in claim 1, wherein the catalyst layer is comprised of a material selected from the group consisting of iron, cobalt, nickel, and any combination thereof.

6. The heat-dissipating device as described in claim 1, wherein the catalyst layer is comprised of alloy of iron, cobalt, nickel and an alkaline earth metal.

7. The heat-dissipating device as described in claim 1, wherein the catalyst layer is comprised of iron-copper-nickel alloy and a rare earth metal.

8. The heat-dissipating device as described in claim 1, wherein the catalyst layer is comprised of copper.

9. The heat-dissipating device as described in claim 1, further comprising a copper layer formed on the bottom wall, wherein the carbon nanotubes are embedded in the copper layer.

10. The heat-dissipating device as described in claim 1, wherein the working fluid is selected from the group consisting of water, ammonia, methane, acetone, and heptane.

11. The heat-dissipating device as described in claim 9, wherein the working fluid further comprises nano-particles, the nano-particles are selected from the group consisting of carbon nanotubes, carbon nanocapsules, nano-sized copper particles, and any mixture thereof.

12. The heat-dissipating device as described in claim 1, further comprising a buffer layer sandwiched between the catalyst layer and the bottom wall, the buffer layer being configured for preventing the catalyst layer from diffusing into the bottom wall.

13. The heat-dissipating device as described in claim 11, wherein the buffer layer is comprised of a material selected from the group consisting of titanium, titanium oxide, molybdenum, and any combination thereof.

14. A method for manufacturing a heat-dissipating device, the method comprising the steps of: providing a container comprising a bottom wall and a peripheral wall extending therefrom;forming a catalyst layer on an inner surface of the bottom wall;growing carbon nanotubes on the catalyst layer;attaching a top wall to the container thereby obtaining a sealed container; andevacuating the container, andintroducing a working fluid into the container.

15. The method as described in claim 14, wherein the catalyst layer is formed on the inner surface of the bottom wall using a process selected from the group consisting of a thermal evaporation process, a sputtering process, or a thermal chemical vapor deposition process.

16. The method as described in claim 14, further comprising a step of heating the catalyst layer so as to obtain a desired catalyst particle size prior to growing the carbon nanotubes.

17. The method as described in claim 14, wherein the carbon nanotubes are grown on the catalyst layer using a chemical vapor deposition process or a plasma enhanced chemical vapor deposition process.

18. The method as described in claim 14, prior to evacuating step further comprising a step of forming a copper layer on the bottom wall thereby lower portions of the carbon nanotubes being embedded in the copper layer using an electro-deposition process.