Patent Application
20080179041
1. Field of the Invention
The invention relates to a heat dissipating device for an electronic component, more particularly to a heat dissipating device including a radiator having a coolant refilling opening covered by a cap.
2. Description of the Related Art
As shown in
When the pump 15 is operated, a coolant in the radiator 11 flows through the first conduit section 121, the second conduit section 122, the fluid inlet 141 and enters the heat sink 14. After conducting heat exchange to absorb heat from the heat source, the high-temperature coolant flows through the fluid outlet 142, the outlet conduit 13 and the coolant inlet 112 into the radiator 11 to complete a circulation cycle.
Although the conventional heat dissipating device has the heat dissipating effect, there is still a disadvantage: An undesired high coolant vaporizing rate due to connection between the pump 15 and the first and second conduit sections 121, 122 of the inlet conduit 12 occurs, which not only diminishes the heat dissipating effect, but also causes potential hazard in use when the amount of the coolant in the radiator 11 becomes too low.
Therefore, the object of the present invention is to provide a heat dissipating device that can overcome the aforesaid disadvantage associated with the prior art.
Accordingly, there is provided a heat dissipating device for heat dissipation of an electronic component. The heat dissipating device comprises: a heat sink adapted to be attached to the electronic component and having a fluid inlet and a fluid outlet; a pump connected to the fluid inlet of the heat sink; and a radiator formed with a coolant inlet connected to the fluid outlet of the heat sink, and a coolant outlet connected to the pump. The radiator includes spaced apart first and second side tanks. The second side tank defines an inner space therein and is formed with a coolant-refilling opening in fluid communication with the inner space. The radiator further includes a cap mounted removably on the second side tank for closing sealingly the coolant-refilling opening, a plurality of conduits interconnecting and in fluid communication with the first and second side tanks so as to permit fluid circulation through the first and second side tanks and the heat sink, and a fin structure disposed between the first and second side tanks and connected to the first and second side tanks and the conduits.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
Referring to
The coolant-refilling opening 31 in the second side tank 3 is defined by an opening-defining wall 36′ that is formed with an inner thread 36. The cap 5 has an outer thread 53 that extends into the coolant-refilling opening 31 and that engages threadedly the inner thread 36.
The opening-defining wall 36′ is further formed with a shoulder 361. The cap 5 further has a head 52 enlarged in diameter from the outer thread 53, and is formed with an elongate groove 54 in the head 52. The radiator 4 further includes an O-ring 6 seated on the shoulder 361 of the opening-defining wall 36′ and abutting sealingly against the shoulder 361 and the head 52 of the cap 5.
Each of the first and second side tanks 2, 3 is cylindrical in shape. The second side tank 3 has an open end 38 in which the coolant-refilling opening 31 is formed.
The first side tank 2 defines an inner space 20 therein, and is provided with first and second partitioning walls 241, 242 that cooperatively divide the inner space 20 in the first side tank 2 into first, second, and third chambers 25, 26, 27. The second side tank 3 is provided with a third partitioning wall 35 that divides the inner space 30 in the second side tank 3 into fourth and fifth chambers 33, 34. The coolant-refilling opening 31 is in fluid communication with the fourth chamber 33. The coolant inlet 21 is in fluid communication with the first chamber 25. The coolant outlet 22 is in fluid communication with the third chamber 27. The fourth chamber 33 is in fluid communication with the first chamber 25 through respective ones of the conduits 41. The second chamber 26 is in fluid communication with the fifth chamber 34 through respective ones of the conduits 41. The fifth chamber 34 is in fluid communication with the third chamber 27 through respective ones of the conduits 41.
In use, the coolant in the first side tank 2 of the radiator 4 is withdrawn by the pump 8 and is subsequently delivered into the heat sink 7 so as to absorb heat from the electronic component 9. The heated coolant is then returned to the first side tank 2 to be cooled by heat dissipation through the fin structure 42 of the radiator 4.
A liquid level sensor (not shown) is installed on the radiator 4 for monitoring the level of the coolant in the radiator 4.
By forming the coolant-refilling opening 31 in the second side tank 3 of the radiator 4 of the heat dissipating device of this invention, the radiator 4 can be refilled with the coolant when the level of the coolant in the radiator 4 is low, thereby eliminating the aforesaid drawback associated with the prior art.
While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
