Patent Application
20060137862
The present invention relates generally to a heat dissipating device, and more particularly to a heat dissipating device which can be suitably applied to remove heat from heat-generating electronic components.
As technological progress is continuously made in electronic industries, electronic devices such as central processing units (CPUs) of computers are becoming more and more powerful. Accordingly, the amount of heat generated by the CPUs increases noticeably. However, the performance and stability of the CPUs strongly depend on their ability to effectively remove the generated heat. To this regard, a variety of conventional heat dissipating devices have been designed for dissipating heat from the CPUs, by thermal conduction, convection, or radiation.
A conventional heat dissipating device generally includes a metal base for contacting and absorbing heat from a CPU, a heat pipe with one end thereof attached to the base, and a plurality of fins attached to the other end of the heat pipe. By this configuration, the heat generated by the CPU is removed by conducting to the base and further conducting by the heat pipe to the fins where the heat is dissipated. In the fabrication process of the heat dissipating device, an additional combination step is often required to combine the fins to the heat pipe, and in most cases, the fins are combined to the heat pipe by soldering process, or by the heat pipe interferentially engaging with the fins. However, the combination step will increase the manufacturing cost to the heat dissipating device additionally, and will inevitably result in between the fins and the heat pipe large thermal resistance which greatly reduce the heat transfer effect of the heat dissipating device. Furthermore, if the heat dissipating device is applied to a notebook computer, the number of fins and the total heat transfer surface area of the fins are extremely limited due to the limited space provided for installation of the heat dissipating device inside the notebook. In this situation, it may lead to the fact that the heat generated by the notebook cannot be effectively removed.
In view of the above-mentioned disadvantages of the conventional heat dissipating device, there is a need for providing a heat dissipating device capable of dissipating heat effectively from heat-generating electronic components.
The present invention relates to a heat dissipating device for removing heat from a heat-generating electronic component. In one embodiment, the heat dissipating device includes at least one heat transfer device and metal foams combined to the heat transfer device. The heat transfer device may be a heat pipe. The heat generated by the electronic component is transferred to the metal foams through the heat transfer device.
Compared with conventional heat dissipating devices, the heat dissipating device of the present invention has many advantages. The metal foams can be simultaneously combined to the heat transfer device when the metal foams are fabricated, thereby reducing undesirable thermal resistance between the metal foams and the heat transfer device. Furthermore, the metal foams can be made to have a compact structure meanwhile providing a large heat transfer area. This feature enables the heat dissipating device to be suitably applied to notebook computers in which limited spaces are provided for mounting the heat dissipating devices.
Other advantages and novel features of the present invention will become more apparent from the following detailed description of the preferred embodiment when taken in conjunction with the accompanying drawings, in which:
The metal foams 20 are combined to one end of the heat transfer device 10 by surrounding a periphery of the body portion 12 and extending outwardly from the periphery. As exaggeratingly shown, the metal foams 20 have a network of metal ligaments or wires forming numerous open cells 22 to provide porosity. The cells 22 may be randomly distributed throughout the metal foams 20. The metal foams. 20 have a compact structure in combination with large surface area. The maximum surface area of the metal foams 20 can approximately reach to 104 m2/m3 (ligaments surface area/metal foams volume).
The metal foams 20 are fabricated by expanding and solidifying a pool of liquid metal saturated with an inert gas under pressure. Density of the porous metal is varied by applying different levels of pressure. The porosity of the foam after solidification may be in a wide range with the open cells 20 randomly distributed over the metal foams 20. Electroforming is a typical method for fabricating metal foam, which generally involves steps of providing one kind of porous material such as polyurethane foam, then electrodepositing a layer of metal over the surface of the polyurethane foam and finally heating the resulting product at a high temperature to get rid of the polyurethane foam to thereby obtain porous metal foam. Another fabrication method for metal foam, called die-casting process, is also widely used, which generally includes steps of providing one kind of porous material such as polyurethane foam, filling ceramic slurry into the pores of the porous polyurethane foam and then solidifying the ceramic slurry therein, then heating the resulting product at a high temperature to get rid of the polyurethane foam to obtain a matrix of porous ceramic, then filling metal slurry into the pores of the ceramic matrix and finally getting rid of the ceramic material after solidification of the metal slurry to thereby obtain porous metal foam. However, there are still some other methods suitable for fabrication of metal foam. Fox example, the metal foams 20 can be made by steps of filling a kind of bubble-generating material such as metallic hydride into metal slurry to generate a large number of bubbles distributing randomly throughout the metal slurry and solidifying the metal slurry to thereby obtain metal foam with a plurality of pores therein. In order to reduce undesirable thermal resistance between the heat transfer device 10 and the metal foams 20, the metal foams 20 are preferably combined to the heat transfer device 10 simultaneously as the metal foams 20 are fabricated by foregoing methods.
In operation, the other end of the body portion 12 of the heat transfer device 10 may be thermally connected, whether directly or indirectly, to a heat-generating electronic component (not shown). Thus, the heat generated by the electronic component is transferred by the heat transfer device 10 to the metal foams 20 where the heat is finally dissipated to atmosphere. In this case, the metal foams 20 may be attached to the heat transfer device 10 in the fabrication process of the metal foams 20, thereby reducing undesirable thermal resistance between the heat transfer device 10 and the metal foams 20 and eliminating the additional combination step required to combine the heat transfer device 10 with the metal foams 20 if the metal foams 20 are individually fabricated. Further, the metal foams 20 can be made to have a compact structure in combination with large surface area, this feature enabling the heat dissipating device of the present invention to be suitably applied to notebook computers for heat dissipation purpose.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 93140461 | Dec 2004 | TW | national |
