Electrical and mechanical devices may generate heat during operation. The heat generated during operation of a device may damage the device or make the device too hot to safely handle. Various methods of reducing the impact of generated heat have been devised.
The following detailed description references the drawings, wherein:
Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.
A “heat dissipating element” may be used to dissipate heat generated in an electrical or mechanical device. Such devices may include multiple heat dissipating elements to dissipate generated heat. In such devices, a heat dissipating system may include multiple different components to operate together to dissipate heat. Some heat dissipating elements operate by absorbing heat from heat generating devices or components and dissipating the absorbed heat to a surrounding environment. For example, heat dissipating elements may include a large surface area from which heat may be dissipated. In some such heat dissipating elements, a protrusion(s) or fin(s) may be used to provide a larger surface area from which heat may be dissipated to the surrounding environment. Some heat dissipating systems may include fans and other air moving devices to introduce air to help dissipate heat and/or cool down heat generating elements. As electronic devices become smaller, there may be less room for different types heat dissipating elements within a device. For example, as computing devices become smaller and there is a desire for quieter devices, the use of a fan to dissipate heat may be disfavored. However, the use of fewer types of heat dissipating elements may increase the risk of a device overheating. To manage generated heat, such devices may need additional heat dissipation mechanisms to ensure that a device's internal temperature does not exceed operational thresholds.
To address these issues, in the examples described herein, a computing device is described which may selectively open a moveable member to move a heat dissipating element into an environment external to the chassis of the computing device. In examples, the computing device may move the heat dissipating element to protrude from a chassis when a threshold temperature is exceeded. In such examples, the heat dissipating element may be exposed to a larger external environment and may dissipate heat thereto rather than to an environment internal to the chassis of the computing device. In some examples, opening the moveable member may further expose components internal to the chassis to an air flow from the external environment. In this manner, examples described herein may manage heat dissipation within a chassis of a computing device.
Examples disclosed herein relate to a computing device. In examples, the computing device may include a chassis to house a heat generating element and a moveable member within the chassis in a closed state. In examples, the moveable member may transition from the closed state to an open state. In such examples, the computing device further may include a heat dissipating element coupled to the moveable member to be exposed to an external environment in the open state. In examples, the heat dissipating element may be thermally coupled to the heat generating element in a closed state of the moveable member. In examples, the computing device may also include a motor to move the moveable member from the closed state to the open state in response to a temperature within the chassis exceeding a threshold. In examples, the heat dissipating element includes a heat insulation layer to insulate a portion of the heat dissipating element. In some examples, the heat insulation layer may insulate a top surface of the heat dissipating element. In other examples, the heat insulation layer may insulate a bottom surface of the heat dissipating element. In some example computing devices, the heat dissipating element, in the open state, may be thermally coupled to the heat generating element. Some computing devices may further include a keyboard tray integrated into a surface of the chassis. In such an example, the surface the keyboard tray is integrated into may be parallel to the moveable member along a direction of ejection of the moveable member.
Examples disclosed herein relate to a computing device including a chassis to house a heat generating element and a first moveable member within the chassis in a closed state. In examples, the first moveable member may eject from a first surface of the chassis to transition from the closed state to an open state. In examples, the chassis may be open to an external environment in the open state of the first moveable member. In examples, the computing device may also include a first heat dissipating element coupled to the first moveable member to be exposed to the external environment in the open state of the first moveable member. In examples, the first heat dissipating element may be thermally coupled to the heat generating element in a closed state of the first moveable member. In examples, the computing device further includes a second moveable member within the chassis in a closed state of the second moveable member. In such examples, the second moveable member may eject from a second surface of the chassis in an open state of the second moveable member. In examples, the first surface of the computing device may be disposed opposite the second surface of the computing device. In examples, the chassis may open to the external environment in the open state of the second moveable member. In examples, the computing device additionally includes a motor to eject the first moveable member from the chassis in response to a temperature within the chassis exceeding a first threshold. In some such examples, the motor is to move the second moveable member into the open state of the second moveable member in response to a temperature within the chassis exceeding a second threshold. In some examples, the first heat dissipating element includes a plurality of fins extending upwards from the first moveable member. In other examples, the first heat dissipating element includes a plurality of fins extending downwards from the first moveable member. In some examples, the first heat dissipating element includes a heat insulation layer to insulate a portion of the first heat dissipating element.
Another example computing device includes a chassis to house a heat generating element, a first moveable member, a first heat dissipating element, a second moveable member, a second heat dissipating element, and a motor. In such example computing devices, the first moveable member may be within the chassis in a closed state. In examples, the first moveable member is to eject from the chassis to transition from the closed state to an open state. In examples, the chassis may be open to an external environment in the open state of the first moveable member. In such example computing devices, the first heat dissipating element is coupled to the first moveable member to be exposed to the external environment in the open state of the first moveable member. In examples, the first heat dissipating element is to be thermally coupled to the heat generating element. Further in such example computing devices, the second moveable member may be within the chassis in a closed state of the second moveable member. In examples, the second moveable member may eject from the chassis to transition from the closed state of the second moveable member to an open state of the second moveable member. In such examples. the chassis may be open to the external environment in the open state of the second moveable member. In examples, the second heat dissipating element may be coupled to the second moveable member to be exposed to the external environment in the open state of the second moveable member. In examples, the second heat dissipating element may be thermally coupled to the heat generating element. In example computing devices, the motor may eject the first moveable member and the second moveable member from the chassis in response to a temperature within the chassis exceeding a first threshold temperature.
In some example computing devices, the first heat dissipating element and the second heat dissipating element include a plurality of fins and a heat insulation layer. In some example, the motor is to eject the second moveable member into the open states of the second moveable member in response to a temperature within the chassis exceeding a second threshold temperature. In some examples, the second threshold temperature may differ from the first threshold temperature of the computing device. In example computing devices, the first heat dissipating element and the second heat dissipating element may be thermally isolated from the heat generating component in the open state.
Referring now to the drawings,
In examples, chassis 100 may house a heat generating element 110 and a motor 170. In examples, moveable member 120 may be coupled to first heat dissipating element 140. In examples, the term “couple,” “coupled,” and/or “couples” is intended to include suitable indirect and/or direct connections. Thus, if a first component is described as being coupled to a second component, that coupling may, for example, be: (1) through a direct electrical and/or mechanical connection, (2) through an indirect electrical and/or mechanical connection via other devices and connections, (3) through an optical electrical connection, (4) through a wireless electrical connection, (5) a communicative connection, and/or (6) another suitable coupling. In examples, chassis 100 may house moveable member 120 and heat dissipating element 140 in a closed state. In contrast, in an open state, moveable member 120 and heat dissipating element 140 may be disposed outside a chassis 100.
In examples, heat generating element 110 may be any electrical or mechanical component which may generate heat in a computing device. In some examples, heat generating element 110 may include a central processing unit (CPU), a printed circuit board (PCB), a processor, a memory, a battery, etc. In examples, heat generating element 110 may be disposed in any location within chassis 100 of computing device 10. In examples, heat generating element 110 may be thermally coupled to heat dissipating element 140. As used herein, if a first component is described as being “thermally coupled” to a second component, that coupling may be any coupling to provide heat or excess energy of the first component to the second component. In such examples, any number of elements may be used to facilitate the transfer of heat from the first component to the second component, such as, a fluid (such as air), a heat absorbing material, a heat transporting conduit, etc.
In examples, moveable member 120 may be a component to couple to computing device 10. In examples, moveable member 120 may be a component that may be moved from a closed state to an open state. As used herein, a “closed state” refers to a state in which a component is disposed substantially within chassis 100. For examples, in a closed state, a first surface of a component may be a part of an outer surface of computing device 10. In contrast, an “open state” refers to a state in which a component is disposed substantially outside chassis 100. In other words, in an open state, the component may extend beyond an outer surface of chassis 100 as defined in the closed state. In examples, moveable member 120 may be disposed substantially within chassis 100 in a closed state and may substantially protrude from chassis 100 in an open state. In some examples, in the open state, moveable member 120 may be disposed to allow for air flow into an internal environment of chassis 100.
In the example of
In examples, moveable member 120 may include a frame to couple to computing device 10. In some such examples, a frame of moveable member 120 may be composed of a thermally insulating material to insulate moveable member 120 from heat dissipated by heat dissipating element 140. In such an example, the frame of moveable member 120 may extend around a portion of heat dissipating element 140 to protect a user from harm by touching a hot portion of heat dissipating element 140. In some examples, the insulating material may be at least one of fiberglass; mineral wool, mineral fiber, mineral cotton, mineral fibre, man-made mineral fibre (MMMF), man-made vitreous fiber (MMVF), glass wool, ceramic fibers, cellulose, calcium silicate, cellular glass, elastomeric foam, phenolic foam, vermiculite, polyurethane foam, polystyrene foam in polymeric resins (thermoplastic or thermoset resins), etc.
In examples, heat dissipating element 140 may be any element to dissipate heat. In examples, heat dissipating element 140 may be coupled to moveable member 120 to be exposed to an environment external to chassis 100 in the open state. In some examples, heat dissipating element 140 may be a heat sink. A “heat sink” refers to an element to absorb and dissipate heat. In examples, a heat sink may be used to absorb and dissipate heat generated in an electrical or mechanical device. Some heat sinks operate by absorbing heat from heat generating devices or components and providing a surface area from which the heat may be dissipated to a surrounding environment. In some heat sinks, a single or series of protrusions or fins may be used to increase the surface area from which heat may be dissipated to the surrounding environment. In some examples, fins may be integrated into heat dissipating element 140. In other examples, fins may be coupled to heat dissipating element 140 via any thermally conductive coupling. In examples, an insulating layer may be formed or disposed on heat dissipating element 140 to insulate a portion thereof. In such examples, the insulated portion of a heat dissipating element may remain within a temperature range safe for human usage.
As the environment or area surrounding a heat dissipating element absorbs dissipated heat, the temperature of that environment may increase. In examples, heat dissipating elements may be disposed in a device in a manner to dissipate heat to an area within the device or surrounding the device which may not be damaged or as readily damaged by the dissipated heat or may not cause injury to an operator. However, as discussed above, as computing devices become smaller, there are fewer areas of the device or surrounding the device which may not be damaged by dissipated heat or cause injury to an operator. In the example of
In an example, heat dissipating element 140 may be thermally coupled to heat generating element 110 to absorb and dissipate heat therefrom. In some examples, heat dissipating element 140 may be thermally coupled to heat generating element 110 in a closed state of moveable member 120. In such examples, heat dissipating element 140 may be thermally isolated from heat generating element 110 when in the open state. In such an example, in operation, transitioning heat dissipating element 140 from a closed state to an open state may allow heat dissipating element 140 to cool down by dissipating heat to an environment surrounding chassis 100, In some examples, heat dissipating element 140, once cooled, may be transitioned to a closed state to thermally couple with heat generating element 110 to absorb and dissipate heat therefrom. In other examples, heat dissipating element 140 may be thermally coupled to heat generating element 110 in an open state of moveable member 120. In such an example, in operation, transitioning heat dissipating element 140 from a closed state to an open state may allow heat dissipating element 140 to dissipate heat received from heat generating element 110 while in the open state.
In examples, motor 170 may be any type of motor to be housed in chassis 100 of computing device 10. As used herein, a “motor” may be any mechanical or electrical component to provide mechanical energy to another component. In examples, motor 170 may be coupled to moveable member 120 to provide mechanical energy to move moveable member 120 from the closed state to the open state. In examples, motor 170 may move, transition, or eject moveable member 120 from the closed state to the open state in response to a temperature within chassis 100 exceeding a threshold. In examples, computing device 10 may include a temperature sensor to determine a temperature within chassis 100. In some examples, a temperature within chassis 100 may be a temperature at any location within chassis 100. In other examples, a temperature within chassis 100 may be a temperature at a specific location within chassis 100. In examples, in operation, when moveable member 120 is moved to the open state by motor 170, heat dissipating element 140 is moved outside of chassis 100 and exposed to an external environment. In such an example, heat dissipating element 140 may dissipate any heat therefrom to the external environment around computing device 10 rather than to an environment internal to chassis 100. In examples, the threshold temperature may be determined according to the heat sensitivity of different components housed within chassis 100 of computing device 10. In some such examples, the heat sensitivity of different components housed within chassis 100 may vary according the usage of the components. In such an example, the threshold temperature may dynamically change according to usage conditions of computing device 10. In examples, computing device 10 may include a processing resource to determine a threshold temperature.
In examples, chassis 200 may house a heat generating element 210 and a motor 270. In examples, first moveable member 220 may be coupled to first heat dissipating element 240. In examples, chassis 200 may house first moveable member 220 and first heat dissipating element 240 in a closed state. In contrast, in an open state, first moveable member 220 and first heat dissipating element 240 may be disposed outside chassis 200.
In examples, first heat generating element 210 may be any electrical or mechanical component which may generate heat in a computing device as described above with respect to
In examples, first moveable member 220 may be a component to couple to computing device 20. In examples, first moveable member 220 may be a component that may be moved from a closed state to an open state. In examples, first moveable member 220 may be disposed substantially within chassis 200 in a closed state. In examples, first moveable member 220 may substantially protrude from chassis 200 in an open state. In some examples, in the open state, moveable member 220 may be disposed to allow for air flow into an internal environment of chassis 200.
In the example of
In examples, first moveable member 220 may include a frame to couple to computing device 20. In some such examples, a frame of first moveable member 220 may be composed of a thermally insulating material to insulate first moveable member 220 from heat dissipated by first heat dissipating element 240. In such an example, the frame of first moveable member 220 may extend around a portion of first heat dissipating element 240 to protect a user from harm by touching a hot portion of first heat dissipating element 240. In some examples, the insulating material may be any insulating material described above with reference to
In examples, first heat dissipating element 240 may be any element to dissipate heat. In examples, first heat dissipating element 240 may be coupled to first moveable member 220 to be exposed to an environment external to chassis 200 in the open state. In some examples, first heat dissipating element 240 may be a heat sink. In some examples, fins may be integrated into first heat dissipating element 240. In other examples, fins may be coupled to first heat dissipating element 240 via any thermally conductive coupling. In examples, an insulating layer may be formed or disposed on first heat dissipating element 240 to insulate a portion thereof. In such examples, the insulated portion of a heat dissipating element may remain within a temperature range safe for human usage.
In the example of
In an example, first heat dissipating element 240 may be thermally coupled to heat generating element 210 to absorb and dissipate heat therefrom. In some examples, first heat dissipating element 240 may be thermally coupled to heat generating element 210 in a closed state of first moveable member 220. In such examples, first heat dissipating element 240 may be thermally isolated from heat generating element 210 when in the open state. In such an example, in operation, transitioning first heat dissipating element 240 from a closed state to an open state may allow first heat dissipating element 240 to cool down by dissipating heat to an environment surrounding chassis 200. In some examples, first heat dissipating element 240, once cooled, may be transitioned to a closed state to thermally couple with heat generating element 210 to absorb and dissipate heat therefrom. In other examples, first heat dissipating element 240 may be thermally coupled to first heat generating element 210 in an open state of first moveable member 220. In such an example, in operation, transitioning first heat dissipating element 240 from a closed state to an open state may allow first heat dissipating element 240 to dissipate heat received from heat generating element 210 while in the open state.
In examples, motor 270 may be any type of motor to be housed in chassis 200 of computing device 20. In examples, motor 270 may be coupled to first moveable member 220 to provide mechanical energy to move first moveable member 220 from the closed state to the open state. In examples, motor 270 may move, transition, or eject first moveable member 220 from the closed state to the open state in response to a temperature within chassis 200 exceeding a threshold. In examples, computing device 20 may include a temperature sensor to determine a temperature within chassis 200. In some examples, a temperature within chassis 200 may be a temperature at any location within chassis 200. In other examples, a temperature within chassis 200 may be a temperature at a specific location within chassis 200. In examples, in operation, when first moveable member 220 is moved to the open state by motor 270, first heat dissipating element 240 is moved outside of chassis 200 and exposed to an external environment. In such an example, first heat dissipating element 240 may dissipate any heat therefrom to the external environment around computing device 20 rather than to an environment internal to chassis 200. In examples, the threshold temperature may be determined according to the heat sensitivity of different components housed within chassis 200 of computing device 20. In some such examples, the heat sensitivity of different components housed within chassis 200 may vary according the usage of the components. In such an example, the threshold temperature may dynamically change according to usage conditions of computing device 20. In examples, computing device 20 may include a processing resource to determine a threshold temperature.
A second moveable member 230 may be a component to couple to computing device 20. In examples, second moveable member 230 may be a component that may be moved from a closed state to an open state. In examples, second moveable member 230 may be disposed substantially within chassis 200 in a closed state. In examples, second moveable member 230 may substantially protrude from chassis 200 in an open state. In some examples, in an open state, second moveable member 230 may disposed to allow for air flow into an internal environment of chassis 200. In the example of
In examples, second heat dissipating element 250 may be any element to dissipate heat. In some examples, second heat dissipating element 250 may be a heat sink. In the example of
In the example of
In examples, second moveable member 230 may be disposed to extend from a surface of chassis 200 opposite to the surface of chassis 200 from which first moveable member 220 may extend. In such an example, an air flow path may be established through chassis 200 between second moveable member 230 and first moveable member 220 along a directional arrow 202A. In other such examples, an air flow path may be established through chassis 200 between second moveable member 230 and first moveable member 220 along a directional arrow 202B.
In the example of
In the example of
In an example, the transition, ejection, or movement of moveable member 320 to the open state may result in an internal temperature of chassis 300 being reduced as heat dissipating element 340 dissipates heat to the environment outside chassis 300. For example, an internal temperature of chassis 300 may be reduced by cooler external air entering chassis 300 when moveable member 320 is in the open state. In some examples, motor 370 may eject, transition, or move moveable member 320 from an open state to a closed state when a temperature inside chassis 300 falls below the threshold temperature. In other examples, motor 370 may eject, transition, or move moveable member 320 from an open state to a closed state after a specific duration of time. For example, the duration of time may be a chosen to allow computing device 30 to reduce an internal temperature thereof by a specific amount.
In an example, an air flow path may be established through chassis 400 along a directional arrow 402 to provide ambient air to internal compartment(s) of chassis 400. Although depicted as traveling from second moveable member 430 to first moveable member 420, it will be appreciated that an air flow path may be established in a reverse direction or any other direction according to the movement of air in an environment external to chassis 400. In the example of
In the example of
In examples, first moveable member 820 and second moveable member 830 are coupled to chassis 800 to eject, transition, or move rotationally about respective axes to enter the open state. In the example of
In the examples described herein, a computing device may include a heat dissipating element to thermally couple to a heat generating element. In examples, when a threshold temperature inside a chassis of the computing device is exceed, the heat dissipating element is moved to outside the chassis to dissipate heat to an external environment and may introduce external air to an internal volume of the chassis. As will be appreciated, in the examples described herein, heat may be dissipated from computing devices under the principles of heat radiation, heat convection, and thermal conduction. In such examples, the movement of the heat dissipating element to outside the chassis may protect the computing device from damage due to overheating while allowing a smaller form factor to be used for the chassis, for example, by eliminating other heat dissipating elements, such as a fan. Although depicted with a notebook or clam shell style computing device, the examples are not limited thereto, and the heat dissipating elements may be disposed in any type of computing device.
All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), may be combined in any combination, except combinations where at least some of such features are mutually exclusive.
Filing Document | Filing Date | Country | Kind |
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PCT/US2018/023196 | 3/19/2018 | WO | 00 |