characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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CPC
H05K7/2039

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cooling device and cooling method
- Patent number 12,178,014
- Issue date Dec 24, 2024
- TMEIC Corporation
- Kento Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device for electronic element
- Patent number 12,178,015
- Issue date Dec 24, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive thermal-control system of an electronic speaker device and...
- Patent number 12,176,260
- Issue date Dec 24, 2024
- Google LLC
- Ihab A. Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 12,178,021
- Issue date Dec 24, 2024
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat diffuser in wrist worn wireless power and data system
- Patent number 12,170,549
- Issue date Dec 17, 2024
- NuCurrent, Inc.
- Pratik Halyal
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cold plates incorporating S-cells
- Patent number 12,165,954
- Issue date Dec 10, 2024
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic shielding of thermal fin packs
- Patent number 12,167,572
- Issue date Dec 10, 2024
- Microsoft Technology Licensing, LLC
- Jason A. Harrigan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an uneven thickness heat spreader
- Patent number 12,167,573
- Issue date Dec 10, 2024
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Active heat sink
- Patent number 12,167,574
- Issue date Dec 10, 2024
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pluggable module and cage for improving airflow in network switch s...
- Patent number 12,167,577
- Issue date Dec 10, 2024
- Arista Networks, Inc.
- Youngbae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-welded cooling plate
- Patent number 12,167,575
- Issue date Dec 10, 2024
- STAFL SYSTEMS, LLC
- Benjamin Michael Levy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Two-phase immersion-type heat dissipation structure having porous s...
- Patent number 12,156,376
- Issue date Nov 26, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber for cooling an electronic component, electronic arran...
- Patent number 12,156,378
- Issue date Nov 26, 2024
- ABB Schweiz AG
- Bruno Agostini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microchannel heat sink and method of manufacturing the same
- Patent number 12,151,279
- Issue date Nov 26, 2024
- FOSHAN HUAZHI ADVANCED MATERIALS CO., LTD.
- Zheng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device
- Patent number 12,156,379
- Issue date Nov 26, 2024
- Kioxia Corporation
- Seiichi Tajima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipating apparatus for electronic elements
- Patent number 12,150,278
- Issue date Nov 19, 2024
- KMW Inc.
- Kyo Sung Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase cold plate
- Patent number 12,146,506
- Issue date Nov 19, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cooling assembly for a data center rack and method for assembling a...
- Patent number 12,150,283
- Issue date Nov 19, 2024
- OVH
- Gregory Francis Louis Bauchart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent adaptable fins for cooling datacenter devices
- Patent number 12,141,005
- Issue date Nov 12, 2024
- NVIDIA Corporation
- Xiaozhuo Cai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device
- Patent number 12,144,152
- Issue date Nov 12, 2024
- NEC Corporation
- Shingo Kameda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating and heat-radiating coating composition, and insulating a...
- Patent number 12,139,640
- Issue date Nov 12, 2024
- AMOSENSE CO., LTD.
- Hwan Ku Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Foldable display device having support structure with multiple layers
- Patent number 12,144,126
- Issue date Nov 12, 2024
- Samsung Display Co., Ltd.
- Changmin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,133,321
- Issue date Oct 29, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Junpeng Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leaf spring for an integrated circuit heat sink
- Patent number 12,129,901
- Issue date Oct 29, 2024
- NVIDIA Corporation
- Shenglei Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Heat exchanger
- Patent number 12,133,358
- Issue date Oct 29, 2024
- Denso Corporation
- Yuya Saito
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BEAUTY CARE APPARATUS
- Publication number 20240431076
- Publication date Dec 26, 2024
- ASTERASYS CO., LTD.
- Eun Taek SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA-ANALYSIS-BASED FEEDBACK OF COMPONENT POSITIONING WITHIN AN ELE...
- Publication number 20240431086
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Quantum Processing Circuitry Cooling Systems and Methods
- Publication number 20240431074
- Publication date Dec 26, 2024
- Montana Instruments Corporation
- Josh DOHERTY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INJECTABLE THERMALLY CONDUCTIVE CURABLE COMPOSITION
- Publication number 20240417534
- Publication date Dec 19, 2024
- Sika Technology AG
- David HOFSTETTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION
- Publication number 20240422943
- Publication date Dec 19, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Darin J. Sharar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EMBEDDED THERMAL INTERFACE FOR CAGE MOUNTED ELECTRONIC DEVICES
- Publication number 20240422945
- Publication date Dec 19, 2024
- AirBorn, Inc.
- Andrew Tarnow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVER FOR HEAT GENERATING ELECTRONIC COMPONENT
- Publication number 20240422944
- Publication date Dec 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuuki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED GRAPHITE FINS FOR HEATSINKS
- Publication number 20240422946
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Luke Thomas GREGORY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-SINK FIXING STRUCTURE
- Publication number 20240414884
- Publication date Dec 12, 2024
- JVCKENWOOD CORPORATION
- Daisuke Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240414248
- Publication date Dec 12, 2024
- Honor Device Co., Ltd.
- Bin Yan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...
- Publication number 20240409798
- Publication date Dec 12, 2024
- WACKER CHEMIE AG
- Shunsuke YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TUNABLE HEXAGONAL BORON CARBON NITRIDE HEAT SPREADER AND METHOD OF...
- Publication number 20240414883
- Publication date Dec 12, 2024
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- ZHENGTANG LUO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINKS AND THERMAL ARCHITECTURE OF AN IMAGE CAPTURE DEVICE
- Publication number 20240414422
- Publication date Dec 12, 2024
- GoPro, Inc.
- Nicholas Vitale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20240407137
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUILDING LIQUID FLOW-THROUGH PLATES
- Publication number 20240399480
- Publication date Dec 5, 2024
- Raytheon Company
- Trae M. Blain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR
- Publication number 20240407127
- Publication date Dec 5, 2024
- Intel Corporation
- Douglas HEYMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREW FIXING STRUCTURE FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATI...
- Publication number 20240401632
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
LAMINATED GRAPHENE-BASED THERMALLY CONDUCTIVE FILM AND PAD AND METH...
- Publication number 20240407135
- Publication date Dec 5, 2024
- SHT SMART HIGH TECH AB
- Johan LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
An Electronic Component Assembly, an Antenna Array System, and Elec...
- Publication number 20240407136
- Publication date Dec 5, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE
- Publication number 20240400789
- Publication date Dec 5, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING ELEMENT AND HEAT DISSIPATION UNIT USING SAME
- Publication number 20240401633
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
BUILDING LIQUID FLOW-THROUGH PLATES
- Publication number 20240391008
- Publication date Nov 28, 2024
- Raytheon Company
- Trae M. Blain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF
- Publication number 20240397668
- Publication date Nov 28, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-SMALL FORM FACTOR (USFF) STARING RECEIVER AS A PASSIVE SENSOR
- Publication number 20240396574
- Publication date Nov 28, 2024
- Rockwell Collins, Inc.
- Chenggang Xie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPUTER DATA CENTER RACK ASSEMBLY
- Publication number 20240397658
- Publication date Nov 28, 2024
- MacStadium, Inc.
- Corey Layton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING
- Publication number 20240397667
- Publication date Nov 28, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER MEMBER
- Publication number 20240389271
- Publication date Nov 21, 2024
- YazakiCorporation
- Junya HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240385665
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Joseph AHN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20240380191
- Publication date Nov 14, 2024
- YAZAKI CORPORATION
- Hiroyuki Tanaka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling device and cooling method

Heat dissipation device for electronic element

Passive thermal-control system of an electronic speaker device and...

Airflow in a card-based computing device

Welding-type power supplies with expandable thermal interfaces

Heat diffuser in wrist worn wireless power and data system

Cold plates incorporating S-cells

Systems and methods for electromagnetic shielding of thermal fin packs

Method and apparatus for an uneven thickness heat spreader

Active heat sink

Pluggable module and cage for improving airflow in network switch s...

Laser-welded cooling plate

Two-phase immersion-type heat dissipation structure having porous s...

Vapor chamber for cooling an electronic component, electronic arran...

Devices, systems, and methods for a hybrid cooling system

Microchannel heat sink and method of manufacturing the same

Semiconductor storage device

Heat dissipating apparatus for electronic elements

Cooling device, a receptacle assembly, a system and a printed board...

Two-phase cold plate

Cooling assembly for a data center rack and method for assembling a...

Voltage regulator module with inductor-cooled power stage

Intelligent adaptable fins for cooling datacenter devices

Embedded system module thermal installation verification

Electric device

Insulating and heat-radiating coating composition, and insulating a...

Foldable display device having support structure with multiple layers

Electronic device

Leaf spring for an integrated circuit heat sink

Heat exchanger

Patents Applicationslast 30 patents

BEAUTY CARE APPARATUS

DATA-ANALYSIS-BASED FEEDBACK OF COMPONENT POSITIONING WITHIN AN ELE...

Quantum Processing Circuitry Cooling Systems and Methods

INJECTABLE THERMALLY CONDUCTIVE CURABLE COMPOSITION

SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION

EMBEDDED THERMAL INTERFACE FOR CAGE MOUNTED ELECTRONIC DEVICES

COVER FOR HEAT GENERATING ELECTRONIC COMPONENT

FOLDED GRAPHITE FINS FOR HEATSINKS

HEAT-SINK FIXING STRUCTURE

ELECTRONIC DEVICE

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...

TUNABLE HEXAGONAL BORON CARBON NITRIDE HEAT SPREADER AND METHOD OF...

HEAT DISSIPATION MEMBER

HEATSINKS AND THERMAL ARCHITECTURE OF AN IMAGE CAPTURE DEVICE

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

BUILDING LIQUID FLOW-THROUGH PLATES

AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR

SCREW FIXING STRUCTURE FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATI...

LAMINATED GRAPHENE-BASED THERMALLY CONDUCTIVE FILM AND PAD AND METH...

An Electronic Component Assembly, an Antenna Array System, and Elec...

HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE

FIXING ELEMENT AND HEAT DISSIPATION UNIT USING SAME

BUILDING LIQUID FLOW-THROUGH PLATES

VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF

MICRO-SMALL FORM FACTOR (USFF) STARING RECEIVER AS A PASSIVE SENSOR

COMPUTER DATA CENTER RACK ASSEMBLY

ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING

HEAT TRANSFER MEMBER

HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

ELECTRICAL JUNCTION BOX AND WIRE HARNESS