TREA

characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • H05K7/2039
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WEARABLE DEVICE WITH HEAT TRANSFER PATHWAY
    • Publication number 20250147336
    • Publication date May 8, 2025
    • Snap Inc.
    • Andrea Ashwood
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Apparatus and Method for Improving Micro-Inverter Longevity
    • Publication number 20250151199
    • Publication date May 8, 2025
    • AA Power Inc.
    • Qun Lu
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    HEATSINK DESIGN WITH VARIABLE EFFECTIVE HEAT TRANSFER COEFFICIENT
    • Publication number 20250151236
    • Publication date May 8, 2025
    • ALLIANCE FOR SUSTAINABLE ENERGY, LLC
    • Bidzina KEKELIA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATED GRAPHENE BASED THERMALLY CONDUCTIVE FILM AND METHOD FOR M...
    • Publication number 20250144912
    • Publication date May 8, 2025
    • SHT SMART HIGH TECH AB
    • Johan LIU
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    HOUSING FOR AN ELECTRIC OR ELECTRONIC DEVICE
    • Publication number 20250151237
    • Publication date May 8, 2025
    • HELLA GmbH & Co. KGaA
    • Frank Brinkmeier
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAF SPRING FOR AN INTEGRATED CIRCUIT HEAT SINK
    • Publication number 20250146551
    • Publication date May 8, 2025
    • NVIDIA Corporation
    • Shengli WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BATTERY PACK
    • Publication number 20250149674
    • Publication date May 8, 2025
    • TECHTRONIC FLOOR CARE TECHNOLOGY LIMITED
    • Patrick Diana
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM AND METHOD FOR COOLING DATA CENTER, AND COMPUTER ROOM
    • Publication number 20250142786
    • Publication date May 1, 2025
    • Beijing Youzhuju Network Technology Co., Ltd.
    • Yuanlin REN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    M.2 CARD ADAPTER AND HEATSINK
    • Publication number 20250138599
    • Publication date May 1, 2025
    • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
    • Shou-Jen Yang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    LASER-WELDED COOLING PLATE
    • Publication number 20250142782
    • Publication date May 1, 2025
    • Stafl Systems, LLC
    • Benjamin Michael Levy
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    COOLING SYSTEM ASSEMBLY
    • Publication number 20250142773
    • Publication date May 1, 2025
    • Cooler Master Co., Ltd.
    • Tsung-Wei LIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEARABLE DEVICE ANTENNA SYSTEM
    • Publication number 20250141096
    • Publication date May 1, 2025
    • Snap Inc.
    • Andrea Ashwood
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT SINK
    • Publication number 20250142780
    • Publication date May 1, 2025
    • Cooler Master Co., Ltd.
    • Hao-Jun CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER-WELDED COOLING PLATE
    • Publication number 20250142779
    • Publication date May 1, 2025
    • Stafl Systems, LLC
    • Benjamin Michael Levy
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    System For Utilizing Heating and Cooling Pads
    • Publication number 20250142781
    • Publication date May 1, 2025
    • I-SYST inc.
    • Nguyen Hoan Hoang
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250133700
    • Publication date Apr 24, 2025
    • Compal Electronics, Inc.
    • Chih-Yuan Chuang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    HEAT DISSIPATION EQUIPMENT CABINET
    • Publication number 20250132541
    • Publication date Apr 24, 2025
    • Schneider Electric (China) Co., Ltd.
    • Ning Li
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    HEAT DISSIPATION MODULE
    • Publication number 20250133649
    • Publication date Apr 24, 2025
    • ASUSTek COMPUTER INC.
    • Kuan-Chuan Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL CONNECTOR FOR BETTER ELECTRONICS COOLING
    • Publication number 20250133701
    • Publication date Apr 24, 2025
    • Harting International Innovation AG
    • Pei Sin Ng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE
    • Publication number 20250133688
    • Publication date Apr 24, 2025
    • MICRO-STAR INT'L CO., LTD.
    • Chia-Ming CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250133699
    • Publication date Apr 24, 2025
    • Compal Electronics, Inc.
    • Chien-Sheng Lan
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    OPTICAL TRANSCEIVER HEAT SINK
    • Publication number 20250130382
    • Publication date Apr 24, 2025
    • VECIMA NETWORKS INC.
    • Clinton Wade BINKLEY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
    • Publication number 20250133708
    • Publication date Apr 24, 2025
    • BorgWarner US Technologies LLC
    • Seyed R. Zarabadi
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    An attenuator or a dissipating element
    • Publication number 20250132482
    • Publication date Apr 24, 2025
    • Teknologian Tutkimuskeskus VTT Oy
    • Janne Lehtinen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    COMPUTER-IMPLEMENTED METHOD FOR CUSTOM DESIGNING A HEAT SINK
    • Publication number 20250131136
    • Publication date Apr 24, 2025
    • DIABATIX NV
    • Lieven Vervecken
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SERVER MODULE AND SERVER
    • Publication number 20250126753
    • Publication date Apr 17, 2025
    • Fulian Precision Electronics (Tianjin) Co., LTD.
    • YA-TING ZHAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
    • Publication number 20250126762
    • Publication date Apr 17, 2025
    • BorgWarner US Technologies LLC
    • Mark Wendell Gose
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    HEAD-UP DISPLAY APPARATUS
    • Publication number 20250123487
    • Publication date Apr 17, 2025
    • Maxell, Ltd.
    • Akio MISAWA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMI-SOLID ALLOY THERMAL INTERFACE COMPOSITION AND METHOD FOR DISSI...
    • Publication number 20250126754
    • Publication date Apr 17, 2025
    • National Cheng Kung University
    • Shih-kang LIN
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Mounting Tool and Method
    • Publication number 20250126752
    • Publication date Apr 17, 2025
    • ABB Schweiz AG
    • Henri Hakkarainen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR