1. Technical Field
The disclosure generally relates to heat dissipation, and more particularly to a heat dissipation apparatus which can dissipate heat from two or more electronic components. 2. Description of Related Art
With the continuing development of electronic technology, processors of electronic devices such as notebook computers have become faster and faster, which causes the processors to generate more redundant heat. Heat dissipation apparatuses are traditionally disposed in the electronic devices to help transfer of the heat from the processor to the outside of the electronic device. Thus a normal, stable operating temperature of the processor is maintained.
Generally, a heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of parallel fins. The heat sink is attached to the processor for absorbing heat therefrom. The fan is disposed beside or on top of the heat sink to dissipate heat transferred to the fins of the heat sink from the processor. However, in many electronic devices, some other electronic components also generate a great amount of heat. Such electronic components are typically located in a region with sluggish airflow. The heat dissipation apparatus cannot dissipate heat from these electronic components effectively.
What is needed, therefore, is a means to overcome the described limitations.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The casing 30 is a thin, hollow shell. The casing 30 includes a rectangular bottom plate 31, a rectangular top plate 34 opposite to the bottom plate 31, and a sidewall between the bottom plate 31 and the top plate 34. The sidewall extends up from a periphery of the bottom plate 31, and includes two opposite first side plates 32 (i.e., a front side plate 32 and a rear side plate 32) and two opposite second side plates 33. The rear side plate 32 defines a plurality of through holes 321 therein. The through holes 321 are distributed along a longitudinal direction of the rear side plate 32 and are spaced apart from each other. Some of the through holes 321 function as air intakes 322 for allowing airflow into the casing 30, and the other through holes 321 function as exhaust vents 323 for allowing airflow out of the casing 30.
The heat dissipation apparatus 10 includes a heat pipe 11, a fin assembly 13 attached on the heat pipe 11, an air guiding plate 14 locate at a side of the fin assembly 13 and fixed to the heat pipe 11, and a centrifugal fan 12.
Referring also to
The centrifugal fan 12 includes a housing 121, and an impeller 122 rotatably mounted in the housing 121. The housing 121 defines an axial air inlet 1211 in a top side thereof and an air outlet 1212 in a lateral side thereof. A thickness of the housing 121 is smaller than that of the casing 30.
Referring also to
The air guiding plate 14 is elongated, and includes a first end 141 adjacent to the air outlet 1212 of the centrifugal fan 12, and a second end 142 far from the air outlet 1212 of the centrifugal fan 12. The air guiding plate 14 is located at a side of the fin assembly 13 adjacent to the connecting section 113 of the heat pipe 11. The first end 141 of the air guiding plate 14 is coupled to the fin assembly 13 and fixed to the condensing section 111 of the heat pipe 11. The air guiding plate 14 can be formed with one outermost fin 131 of the fin assembly 13. The air guiding plate 14 extends along a longitudinal direction of the connecting section 113 of the heat pipe 11 and beyond the connecting section 113. In other words, a length of the air guiding plate 14 is longer than that of the connecting section 113 of the heat pipe 11. In this embodiment, the air guiding plate 14 is parallel to the connecting section 113 of the heat pipe 11. The second end 142 of the air guiding plate 14 extends beyond a side of the centrifugal fan 12 opposite to the air outlet 1212. A bottom edge of the air guiding plate 14 abuts against the bottom plate 31. A top edge of the air guiding plate 14 is higher than the top side of the housing 121 of the centrifugal fan 12.
The circuit board 20 is mounted on the bottom plate 31 of the casing 30 and located adjacent to the rear side plate 32 of the casing 30. A height of the circuit board 20 is lower than that of the rear side plate 32 of the casing 30. The CPU 21 and the south bridge chipset 22 are aligned with the air intakes 322 defined in the rear first side plate 32 of the casing 30. The memory card 23 is located at a front side of the CPU 21 (see
Referring also to
Referring particularly to
In the electronic device 100, due to the presence of the air guiding plate 14, airflow in the drawing passage 35 flows along the drawing passage 35 to the second end 142 of the air guiding plate 14, for dissipating heat of the electronic components such as the CPU 21, the south bridge chipset 22 and the memory card 23 which are located in the drawing passage 35. The air guiding plate 14 guides the airflow to a region in which the speed of the airflow is otherwise sluggish. At least one electronic component (i.e., the memory card 23) is located in such region. Thus, the heat dissipation apparatus 10 can dissipate heat from a total of two or more electronic components.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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99129956 | Sep 2010 | TW | national |