within server blades for removing heat from heat source

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H05K7/20809

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20809within server blades for removing heat from heat source

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual-stacked motherboards for fluid immersion cooling
- Patent number 12,309,971
- Issue date May 20, 2025
- Super Micro Computer, Inc.
- Yueh Ming Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid immersion cooling system
- Patent number 12,295,118
- Issue date May 6, 2025
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water-cooled electronic system
- Patent number 12,255,122
- Issue date Mar 18, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for centralized and scalable vapor management s...
- Patent number 12,200,907
- Issue date Jan 14, 2025
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full system self-regulating architecture
- Patent number 12,193,197
- Issue date Jan 7, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular, two-phase cooling systems
- Patent number 12,185,498
- Issue date Dec 31, 2024
- Coolit Systems, Inc.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Immersed cabinet and heat dissipation system thereof
- Patent number 12,150,276
- Issue date Nov 19, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- PengFei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pressure based phase immersion cooling system
- Patent number 12,144,148
- Issue date Nov 12, 2024
- Microsoft Technology Licensing, LLC
- Vaidehi Oruganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing computational bursting on server nodes
- Patent number 12,135,998
- Issue date Nov 5, 2024
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-availability liquid cooling system for chip and server
- Patent number 12,114,468
- Issue date Oct 8, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling plate for CPU
- Patent number 12,089,367
- Issue date Sep 10, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiangjun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber, heat sink, and terminal
- Patent number 12,082,381
- Issue date Sep 3, 2024
- Huawei Technologies Co., Ltd.
- Denis Yurchenko
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Distribution hardware for two phase system recirculation
- Patent number 12,048,127
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip to server packaging design for immersion systems
- Patent number 12,010,815
- Issue date Jun 11, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for immersion-cooled datacenters
- Patent number 12,004,328
- Issue date Jun 4, 2024
- Microsoft Technology Licensing, LLC
- Eric C. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for cooling server boards in a data center
- Patent number 11,997,832
- Issue date May 28, 2024
- CALYOS SA
- Vincent Dupont
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system
- Patent number 11,997,835
- Issue date May 28, 2024
- BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
- Zhihua Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for multiphase thermal management
- Patent number 11,985,800
- Issue date May 14, 2024
- Microsoft Tech nology Licensing, LLC
- Luke Thomas Gregory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak protection for cold plate liquid cooling
- Patent number 11,963,340
- Issue date Apr 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system providing cooling to an infrastructure having a plur...
- Patent number 11,937,406
- Issue date Mar 19, 2024
- OVH
- Ali Chehade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power density chips based two-phase loop recirculation
- Patent number 11,925,001
- Issue date Mar 5, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for modular liquid spray cooling of electronic devices
- Patent number 11,903,171
- Issue date Feb 13, 2024
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure relief valve and adsorbent chamber for two-phase immersion...
- Patent number 11,894,288
- Issue date Feb 6, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system of electronic systems, in particular for data centre
- Patent number 11,871,546
- Issue date Jan 9, 2024
- WIELAND PROVIDES SRL
- Franco Provenziani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20250169044
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR, TWO-PHASE COOLING SYSTEMS
- Publication number 20250142777
- Publication date May 1, 2025
- COOLIT SYSTEMS, INC.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER ASSEMBLY WITH CLOSED CONDENSING CIRCUIT AND COOLING APPARATU...
- Publication number 20250107049
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLEVAPOR MANAGEMENT SY...
- Publication number 20250098115
- Publication date Mar 20, 2025
- Microsoft Technology Licensing, LLC
- Ioannis MANOUSAKIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20250081391
- Publication date Mar 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jingnan ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Implementation of Two-Phase Cold Plate Loops with Design Features t...
- Publication number 20250081405
- Publication date Mar 6, 2025
- Seguente, Inc.
- Ryan Enright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250063700
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250062189
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CONDITIONING SYSTEM FOR DATA CENTER
- Publication number 20250063698
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...
- Publication number 20250063701
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM AND TANK STRUCTURE THEREOF
- Publication number 20250040093
- Publication date Jan 30, 2025
- KENMEC MECHANICAL ENGINEERING CO., LTD.
- Kuei-Yuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRY COOLING ARRANGEMENT FOR A DATACENTER
- Publication number 20250008701
- Publication date Jan 2, 2025
- OVH
- Ali CHEHADE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING DEVICE
- Publication number 20240334649
- Publication date Oct 3, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
- Publication number 20240284641
- Publication date Aug 22, 2024
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...
- Publication number 20240276676
- Publication date Aug 15, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...
- Publication number 20240244800
- Publication date Jul 18, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...
- Publication number 20240179877
- Publication date May 30, 2024
- CIENA CORPORATION
- Daniel Rivaud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for the Reuse of Heat in a Data Center
- Publication number 20240164065
- Publication date May 16, 2024
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER HEAT DISSIPATION SYSTEM BASED ON GRAVITY HEAT PIPE
- Publication number 20240130090
- Publication date Apr 18, 2024
- Shanghai Neogenint Technology Co., Ltd
- Lei NIE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSED CABINET AND HEAT DISSIPATION SYSTEM THEREOF
- Publication number 20240107709
- Publication date Mar 28, 2024
- Luxshare Thermal Technologies (HuiZhou) Co., Ltd
- PengFei WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SERVER SYSTEM WITH AI ACCELERATOR APPARATUSES USI...
- Publication number 20240090181
- Publication date Mar 14, 2024
- d-MATRIX CORPORATION
- Jayaprakash BALACHANDRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION CO...
- Publication number 20240074108
- Publication date Feb 29, 2024
- OVH
- Ali CHEHADE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20240057296
- Publication date Feb 15, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...
- Publication number 20240057291
- Publication date Feb 15, 2024
- Wiwynn Corporation
- Tai-Ying Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
- Publication number 20240032248
- Publication date Jan 25, 2024
- Intel Corporation
- Sandeep AHUJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240015929
- Publication date Jan 11, 2024
- Wiwynn Corporation
- Tai-Ying TU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

within server blades for removing heat from heat source

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual-stacked motherboards for fluid immersion cooling

Liquid immersion cooling system

Water-cooled electronic system

Method and extraction system for extracting an electronic device fr...

Systems and methods for centralized and scalable vapor management s...

Full system self-regulating architecture

Modular, two-phase cooling systems

Rack system for housing at least one immersion case

Devices, systems, and methods for a hybrid cooling system

Rack system for housing an electronic device

Immersed cabinet and heat dissipation system thereof

Data center rack system with integrated liquid and dielectric immer...

Pressure based phase immersion cooling system

Managing computational bursting on server nodes

High-availability liquid cooling system for chip and server

Server and cooling system for enhanced immersion cooling

Liquid-cooling plate for CPU

Vapor chamber, heat sink, and terminal

Distribution hardware for two phase system recirculation

Chip to server packaging design for immersion systems

Systems and methods for immersion-cooled datacenters

System for cooling server boards in a data center

Cooling system

Systems and methods for multiphase thermal management

Leak protection for cold plate liquid cooling

Cooling system providing cooling to an infrastructure having a plur...

High power density chips based two-phase loop recirculation

System for modular liquid spray cooling of electronic devices

Pressure relief valve and adsorbent chamber for two-phase immersion...

Cooling system of electronic systems, in particular for data centre

Patents Applicationslast 30 patents

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

MODULAR, TWO-PHASE COOLING SYSTEMS

SERVER ASSEMBLY WITH CLOSED CONDENSING CIRCUIT AND COOLING APPARATU...

SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLEVAPOR MANAGEMENT SY...

LIQUID COOLING PLATE ASSEMBLY AND SERVER

Implementation of Two-Phase Cold Plate Loops with Design Features t...

OPTIMIZED CHIP COOLING INFRASTRUCTURE

OPTIMIZED CHIP COOLING INFRASTRUCTURE

AIR-CONDITIONING SYSTEM FOR DATA CENTER

LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...

IMMERSION COOLING SYSTEM AND TANK STRUCTURE THEREOF

DRY COOLING ARRANGEMENT FOR A DATACENTER

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

IMMERSION COOLING DEVICE

IMMERSION LIQUID COOLING DEVICE

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...

HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...

ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...

System for the Reuse of Heat in a Data Center

SERVER HEAT DISSIPATION SYSTEM BASED ON GRAVITY HEAT PIPE

IMMERSED CABINET AND HEAT DISSIPATION SYSTEM THEREOF

IMMERSION COOLING SERVER SYSTEM WITH AI ACCELERATOR APPARATUSES USI...

HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION CO...

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...

IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS

IMMERSION COOLING SYSTEM