Patent Application
20090133855
1. Field of the Disclosure
The disclosure generally relates to heat dissipation, and particularly to a heat dissipation device incorporating a heat pipe and fins and an assembly method thereof.
2. Description of Related Art
It is well-known that heat is generated by electronic components such as central processing units (CPUs). If the generated heat is not rapidly and efficiently removed, the electronic component may overheat and the performance thereof may be significantly degraded. Generally, a heat dissipation device including a heat pipe and a plurality of fins is used for cooling a CPU. The heat pipe has low thermal resistance in heat transfer due to a phase change mechanism employing working fluid in the heat pipe. The heat pipe includes an evaporator section thermally contacting the CPU and a condenser section. The fins are connected to the condenser section, dissipating heat transferred from the CPU by the heat pipe. However, an air gap occurs between the heat pipe and the fins, reducing heat transmission efficiency from the heat pipe to the fins.
To overcome such occurrence, thermal medium material, material with high thermal conductivity, is filled between the fins and the heat pipe, soldering the heat pipe and the fins together. Generally, the thermal medium material used is in the form of viscous solder paste, composed of particles of a metal alloy such as tin (Sn) or silver (Ag) together with a flux agent. A long tunnel is formed in the resulting fin assembly for receiving the heat pipe. After solder paste is spread on an inner surface of the tunnel, the heat pipe is inserted thereinto. However, due to its viscosity at normal temperatures, it is difficult for the solder paste to spread evenly throughout the length of the tunnel, with particles of the metal alloy of the solder paste becoming more unevenly distributed after the heat pipe is received. The quality of the join between the heat pipe and the metal fins is affected, which reduces heat exchange efficiency. Further, the solder paste is easily forced out of the tunnel of the fin assembly when the heat pipe is inserted, wasting the solder paste.
What is needed, therefore, is a heat dissipation device which overcomes the described limitations.
A heat dissipation device and an assembly method thereof are disclosed. The method includes providing a heat pipe having a condenser section, coating a layer of solid-state solder film on an exterior surface thereof, providing a heat sink having a plurality of spaced fins, each defining an aperture, inserting the condenser section of the heat pipe into the apertures, heating the heat sink with the condensing section of the heat pipe therein to melt the solid-state solder film and fill gaps between the heat pipe and the fins of the heat sink, and cooling the assembly.
Referring to
The heat sink 10 includes a plurality of stacked parallel fins 12. A plurality of air passages 13 are formed between the fins 12 through which cooling air flows. Each of the fins 12 is substantially rectangular and defines a substantially elliptical aperture 16 in a center portion thereof, receiving the heat pipe 20.
The heat pipe 20 is L-shaped and includes an evaporator section 22 thermally contacting an electronic component (not shown), and a condenser section 24 with a layer of solid-state solder film 30 coated thereon. The solid-state solder film 30 is coated on an exterior surface of the condenser section 24 before the heat pipe 20 is inserted into the heat sink 10. The solid-state solder film 30 is formed by following steps. A tin alloy such as Sn—Bi (tin-bismuth) bar/ingot, is provided. The tin alloy bar/ingot is arranged in a container (not shown) and heated to about 139° C. to melt. After melting is complete, the condenser section 24 of the heat pipe 20 is immersed in the molten tin alloy. Condenser section 24 of the heat pipe 20 removed and cooled. A layer of tin alloy adhering to an exterior surface of the condenser section 24 forms the solid-state solder film 30, which can be about 0.1 millimeter (mm) to 0.2 mm thick, considerably thinner than a solder paste layer. Thus, an inside dimension of the apertures 16 of the fins 12 is substantially equal to an outside dimension of the condenser section 24 of the heat pipe 20.
After the solid-state solder film 30 on the condenser section 24 is fully cooled, the condenser section 24 of the heat pipe 20 is inserted into the fins 12 of the heat sink 10. The heat sink 10 and the heat pipe 20 are placed into a heating apparatus (not shown) such as a reflow oven or a soldering furnace. Since the solid-state solder film 30 has a lower melting point than the heat pipe 20 and the fins 12 of the heat sink 10, at high temperatures, such as 139° C., the solid-state solder film 30 melts and flows evenly into gaps between the exterior surface of the condenser section 24 of the heat pipe 20 and interior surfaces of the apertures 16 of the fins 12. The time needed to seal the fins 12 of the heat sink 10 and heat pipe 20 in the heating apparatus depends on the temperature of the heating apparatus, the size of the heat pipe 20, and heat sink 10, and the volume of the solid-state solder film 30. After the melted solid-state solder film 30 fully fills the gaps of the heat sink 10 and the heat pipe 20, the apparatus is cooled and the solder layer 40 is formed, securely combining the heat sink 10 and the condenser section 24 of the heat pipe 20.
In this embodiment of the heat dissipation device, the solid-state solder film 30 is evenly coated on the condenser section 24 of the heat pipe 20 before the heat pipe 20 is inserted between fins 12 of the heat sink 10. When the heat pipe 20 is inserted into the apertures 16 of the fins 12, little of the solid-state solder film 30 is scraped from the heat pipe 20 by the fins 12. Solder material wastage is thus avoided. Additionally, when assembled heat sink 10 and heat pipe 20 are heated, the solid-state solder film 30 flows evenly into gaps between the exterior surface of the heat pipe 20 and interior surfaces of the apertures 16 of the fins 12, enhancing the integrity of the join therebetween and increasing heat exchange efficiency thereof commensurately. Further, since the tin alloy material used needs only be provided in bar/ingot form, rather than milled into particles and integrated into solder paste, material costs of the heat dissipation are additionally conserved.
Referring to
It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200710124770.7 | Nov 2007 | CN | national |
