1. Technical Field
The disclosure relates to heat dissipation devices and, more particularly, to a heat dissipation device with a fastener for fastening the heat dissipation device on a printed circuit board.
2. Description of Related Art
It is well known that, during operation of a computer, electronic devices such as central processing units (CPUs) frequently generate large amounts of heat. The heat must be quickly removed from the electronic device to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the electronic device to absorb heat from the electronic device. The heat absorbed by the heat sink is then dissipated to ambient air.
In order to keep the heat sink in intimate contact with the electronic device, a fastener extends through the heat sink and a printed circuit board where the electronic device is located to fasten the heat sink to the electronic device. However, before the heat sink mounted on the electronic device, the fastener is usually pre-assembled on the heat sink by an annular collar which snaps with an end of the fastener extending beyond the heat sink, for facilitating transportation. However, the collar is prone to disengage from the fastener when subjected to an outer force during transportation, resulting in falling of the fastener from the heat sink.
What is needed, therefore, is a heat dissipation device with a fastener which can overcome the limitations described.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Also referring to
The fin group 30 is made of metal such as aluminum, copper or an alloy thereof. The fin group 30 is connected to a top face of the body 11 of the conductive plate 10, and comprises a plurality of fins 31 connected together.
Each of the fasteners 20 comprises a fastening element 21, a spring 23 circling the fastening element 21, and a fixture 22.
The fastening element 21 comprises a cylindrical pole portion 212, a head portion 211 extending from a top end of the pole portion 212, and a cylindrical engaging portion 210 extending from an opposite bottom end of the pole portion 212. The engaging portion 210 is cylindrical and defines a plurality of threads on a periphery thereof. The pole portion 212 has a diameter larger than that of the engaging portion 210. The diameter of the pole portion 212 is smaller than an inner diameter of the spring 23, so that the spring 23 can encircle the pole portion 212. The head portion 211 defines an operating groove 214 in a top face thereof for facilitating operation of a tool such as a screwdriver to fasten the fastener 20 to the printed circuit board. Three rectangular blocks 215 protrude outwardly and radially from a periphery of the head portion 211. The blocks 215 are spaced from each other with a same interval. The pole portion 212 forms a circumferential flange 213 adjacent to the engaging portion 211. The flange 213 has a diameter larger than that of the through hole 13 of the conductive plate 10.
Also referring to
In assembly, the head portion 211 of the fastening element 21 extends through the through hole 13 of the conductive plate 10 from bottom to top of a corresponding arm 12 of the conducting plate 10. The spring 23 is sleeved on the pole portion 212 of the fastening element 21 and rests on the arm 12. The flange 213 and the spring 23 are respectively located at two sides of the conductive plate 10. The blocks 215 of the fastening element 21 extend through the cutouts 2211 of the fixture 22. The fixture 22 is rotated an angle, so that the blocks 215 of the fastening element 21 are buckled in the buckling grooves 2212 of the fixture 22. The spring 23 is compressed between the conductive plate 10 and the locating portion 221. Thus, the fastener 20 is fastened on the conductive plate 10 of the heat dissipation device.
It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Number | Date | Country | Kind |
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201110160324.8 | Jun 2011 | CN | national |