1. Field of the Invention
The present invention relates to heat dissipation devices for removing heat from electronic devices, and more particularly to a heat dissipation device including a plurality of individual fin plates that are interlocked together.
2. Description of Prior Art
Conventional heat dissipation devices used for removing heat from electronic devices are mostly formed by extrusion of metallic material.
With the continuing boom in electronics technology, numerous modern electronic devices such as central processing units (CPUs) of computers can operate at very high speeds and thus generate large amounts of heat. The heat must be efficiently removed from the CPU; otherwise, abnormal operation or damage may result. Conventional extruded heat dissipation devices are increasingly no longer able to adequately remove heat from these contemporary electronic devices.
In order to keep pace with these developments in electronics technology, assembled heat dissipation devices have been gaining in popularity. For example, China Patent No. 2462641Y provides an assembled heat dissipation device having a plurality of uniformly dimensioned individual plate fins evenly stacked together. Each fin forms top and bottom flanges. Each flange defines a pair of indents in communication with a main body of the fin, and forms a pair of tabs extending from outer peripheries of the indents respectively. The tabs of each fin are attached on the corresponding flanges of an adjacent fin in the indents. Thus, all the fins are connected together to form the heat dissipation device. However, the fins are connected together only by the attachment of the tabs of each fin in the indents of the adjacent fin. The fins are prone to be disengaged from each other when the heat dissipation device is subjected to shock or vibration during transportation or in operation. Part of or even the entire the stack of fins may collapse.
Accordingly, an object of the present invention is to provide a heat dissipation device including a plurality of individual fin plates that yield a relatively large total heat dissipation area.
Another object of the present invention is to provide a heat dissipation device including a plurality of individual fin plates attached together so that the heat dissipation device is stable and sturdy.
In order to achieve the objects set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a base and a plurality of individual fin plates standing side by side on the base. Each fin plate includes a main body, a flange stamped therefrom and a pair of tabs distal from the flange. Each tab defines a split in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue surrounded on three sides by the split. The tongue is coplanar with the fin plate while the flange and the tabs are perpendicular to the fin plate. A slot is defined in each tab adjacent a distal end thereof and isolated from the split. Each flange has a width substantially same as a distance from the tongue to the slot. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of a corresponding adjoining preceding fin plate. The fin plates are formed by successively stamping a moving metal sheet.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Referring to
A flange 43 is perpendicularly bent from a bottom edge portion of the body 41, the flange 43 extending in said same direction and being parallel to the tabs 45. A width of the flange 43 is equal to a distance from each tongue 47 to its corresponding slot 49.
In assembly of the fin plates 40, the flange 43 of a first fin plate 40 is aligned with the flange 43 of an adjacent second fin plate 40. The body 41 of the second fin plate 40 is pressed toward the first fin plate 40, so that the slots 49 of the tabs 45 of the second fin plate 40 receive the tongues 47 of the first fin plate 40. Thus, the second fin plate 40 is attached to the first fin plate 40. In similar fashion, all the fin plates 40 are assembled together, with the flanges 43 thereof being coplanar with each other. Finally, this subassembly of fin plates 40 is mounted on a top surface of the base 50, with the flanges 43 in contact with the top surface. The heat dissipation device 30 is thus formed.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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91221276 U | Dec 2002 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
5886873 | Ahn | Mar 1999 | A |
6607023 | Ho et al. | Aug 2003 | B2 |
6644386 | Hsu | Nov 2003 | B1 |
6672379 | Wang et al. | Jan 2004 | B1 |
Number | Date | Country |
---|---|---|
2386482 | Jul 2000 | CN |
2415390 | Jan 2001 | CN |
2487019 | Apr 2002 | CN |
3094553 | Jun 2003 | JP |
460110 | Oct 2001 | TW |
526949 | Apr 2003 | TW |
Number | Date | Country | |
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20040194922 A1 | Oct 2004 | US |