Foil-like cooling fins or heat sinks

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H01L23/3672

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3672Foil-like cooling fins or heat sinks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate comprising diamond and semiconductor int...
- Patent number 12,191,227
- Issue date Jan 7, 2025
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 12,178,021
- Issue date Dec 24, 2024
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat dissipation structures for three-dimensional system on integra...
- Patent number 12,154,842
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 12,131,973
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,100,636
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Tao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cleaning heatsink for electronic components
- Patent number 12,074,080
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Maksim Kuzmenka
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,057,414
- Issue date Aug 6, 2024
- Mitsubishi Electric Corporation
- Yusuke Yamakaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of heat-sinked power semiconductors
- Patent number 12,046,529
- Issue date Jul 23, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. Ronning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer device
- Patent number 12,009,275
- Issue date Jun 11, 2024
- ASUSTeK COMPUTER Inc.
- Hsin-Chen Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package including lid with integrated heat pipe for t...
- Patent number 12,009,276
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radiator having temperature gradient
- Patent number 12,002,728
- Issue date Jun 4, 2024
- QKM TECHNOLOGY (DONG GUAN) CO., LTD
- Jiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible transistors with near-junction heat dissipation
- Patent number 11,996,473
- Issue date May 28, 2024
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...
- Publication number 20240421033
- Publication date Dec 19, 2024
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240413052
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE
- Publication number 20240387334
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Vertical Interconnect Architecture and Methods Fo...
- Publication number 20240387458
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240379608
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Yuta TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS
- Publication number 20240339374
- Publication date Oct 10, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. RONNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...
- Publication number 20240334641
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATOR AND ELECTRONIC COMPONENT MODULE
- Publication number 20240321671
- Publication date Sep 26, 2024
- Molex, LLC
- Tetsunori Tsumuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...
- Publication number 20240306348
- Publication date Sep 12, 2024
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304513
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF
- Publication number 20240290681
- Publication date Aug 29, 2024
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240282662
- Publication date Aug 22, 2024
- UT-Battelle, LLC
- Md Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20240282663
- Publication date Aug 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK
- Publication number 20240274488
- Publication date Aug 15, 2024
- The ESAB Group Inc.
- Secundino Miguel Baldonado
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240274490
- Publication date Aug 15, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Yujiro Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...
- Publication number 20240274491
- Publication date Aug 15, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device, Method for Manufacturing Same, and Powe...
- Publication number 20240274489
- Publication date Aug 15, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Haruna TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240266244
- Publication date Aug 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240266285
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Foil-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including surface pressure absorbing member fo...

Heat dissipating substrate comprising diamond and semiconductor int...

Systems and methods for single channel fault encoding for inverter...

Thermally conductive sheet and method of manufacturing semiconducto...

Welding-type power supplies with expandable thermal interfaces

Semiconductor device and manufacturing method thereof

Systems and methods for phase switch timing controller for inverter...

Heat dissipation structures for three-dimensional system on integra...

Method of forming a chip package, method of forming a semiconductor...

Semiconductor device and method forming the same

Systems and methods for bidirectional message architecture for inve...

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Heatsink with increased air flow

Power module with graphite plate

Systems and methods for integrated gate driver for inverter for ele...

Chip heat dissipating structure, chip structure, circuit board and...

Hybrid system including photonic and electronic integrated circuits...

Manufacturing method of insulated metal substrate

Self-cleaning heatsink for electronic components

Arrangement of a power semiconductor module and a cooler

Printed circuit board

Electronic component and semiconductor device

Array of heat-sinked power semiconductors

Thermal management in integrated circuit packages

Heat transfer device

Semiconductor package including lid with integrated heat pipe for t...

Integrated radiator having temperature gradient

Flexible transistors with near-junction heat dissipation

Heat dissipation for semiconductor devices and methods of manufacture

Power semiconductor module arrangement

Patents Applicationslast 30 patents

COOLING SYSTEM BLOCK ASSEMBLY

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

Heat Dissipation Structures

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

EMITTERS FOR INTEGRATED POWER CARD COOLING

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE

Three-Dimensional Vertical Interconnect Architecture and Methods Fo...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS

ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...

HEAT RADIATOR AND ELECTRONIC COMPONENT MODULE

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

POWER MODULE

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK

SEMICONDUCTOR MODULE

PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...

Power Semiconductor Device, Method for Manufacturing Same, and Powe...

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE