Foil-like cooling fins or heat sinks

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H01L23/3672

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3672Foil-like cooling fins or heat sinks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal management solution for power stage comprising top-cooled p...
- Patent number 12,336,148
- Issue date Jun 17, 2025
- GaN Systems Inc.
- Ruoyu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 12,327,820
- Issue date Jun 10, 2025
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems for a heat exchanger with a biasing bracket and mounting plate
- Patent number 12,317,457
- Issue date May 27, 2025
- Dana Canada Corporation
- Andrei Catuneanu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated device package with an integrated heat sink
- Patent number 12,315,776
- Issue date May 27, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 12,283,535
- Issue date Apr 22, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat radiator and electronic component module
- Patent number 12,278,157
- Issue date Apr 15, 2025
- Molex, LLC
- Tetsunori Tsumuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener
- Patent number 12,272,610
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with turbulent structures
- Patent number 12,255,117
- Issue date Mar 18, 2025
- Google LLC
- Xu Zuo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,255,118
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor cooling assembly
- Patent number 12,255,121
- Issue date Mar 18, 2025
- Hamilton Sundstrand Corporation
- Sebastian Pedro Rosado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inverter device
- Patent number 12,243,790
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Yosuke Miyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,237,245
- Issue date Feb 25, 2025
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK WITH HEAT PIPE HANDLE PORTION
- Publication number 20250239503
- Publication date Jul 24, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERTER
- Publication number 20250233080
- Publication date Jul 17, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Shibo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250218890
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210487
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE
- Publication number 20250210492
- Publication date Jun 26, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qipeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20250210445
- Publication date Jun 26, 2025
- NIDEC CORPORATION
- Yuki YANAGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250210476
- Publication date Jun 26, 2025
- FUJI ELECTRIC CO., LTD.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH ring structure AND METHOD FOR FORMING T...
- Publication number 20250210541
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH STACKED STRUCTURE AND CAPACITOR ASSEMBLY LAYER
- Publication number 20250210596
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC PACKAGE
- Publication number 20250201643
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD WITH INTEGRATED HEAT SINK, AND ELECTRONIC D...
- Publication number 20250193993
- Publication date Jun 12, 2025
- MITSUBISHI MATERIALS CORPORATION
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BYPASS CHIPLETS FOR MEMORY-LOGIC STACK
- Publication number 20250183229
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183146
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK
- Publication number 20250167067
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE
- Publication number 20250167068
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinkyu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250149415
- Publication date May 8, 2025
- JCET Group Co., LTD.
- Yun GAO
- H01 - BASIC ELECTRIC ELEMENTS

Foil-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for power module for inverter for electric vehicle

Chip package assembly, electronic device, and preparation method of...

Systems and methods for power module for inverter for electric vehicle

Systems and methods for multiple output integrated gate driver for...

Thermal management solution for power stage comprising top-cooled p...

Systems and methods for galvanic isolation for inverter for electri...

ASIC package with photonics and vertical power delivery

Thermal management of three-dimensional integrated circuits

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Systems for a heat exchanger with a biasing bracket and mounting plate

Integrated device package with an integrated heat sink

Solid metal foam thermal interface material

Systems and methods for cooling system and power module for inverte...

IC die and heat spreaders with solderable thermal interface structu...

Systems and methods for parameter drift correction for inverter for...

Heat radiator and electronic component module

Semiconductor package with stiffener

Systems and methods for cooling system and power module for inverte...

Heat sinks with beyond-board fins

Bonding passive devices on active dies to form 3D packages

Antenna modules employing three-dimensional (3D) build-up on mold p...

Nitride-based semiconductor module and method for manufacturing the...

Heat sink with turbulent structures

Package structure and method of fabricating the same

Power semiconductor cooling assembly

Semiconductor device and inverter device

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Systems and methods for low inductance phase switch for inverter fo...

Patents Applicationslast 30 patents

HEAT SINK WITH HEAT PIPE HANDLE PORTION

POWER MODULE AND POWER CONVERTER

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR PACKAGE

POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE

MONITORING OF ELECTRONIC PACKAGES

HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

CHIP PACKAGE STRUCTURE WITH ring structure AND METHOD FOR FORMING T...

POWER MODULE WITH STACKED STRUCTURE AND CAPACITOR ASSEMBLY LAYER

STACKED IC PACKAGE

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

INSULATED CIRCUIT BOARD WITH INTEGRATED HEAT SINK, AND ELECTRONIC D...

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

BYPASS CHIPLETS FOR MEMORY-LOGIC STACK

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

POWER MODULES

MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME