Patent Application
20190264986
The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device for dissipating heat through two phase changes.
With increasing development of computers and various electronic devices, people in the modern societies are used to using the computers and the electronic devices for a long time. During operations of the computers and the electronic devices, a great deal of heat is generated. If the heat cannot be effectively dissipated away, some drawbacks occur.
For solving the above drawbacks, various heat dissipation mechanisms such as airflow convection mechanisms (e.g., through fans), water cooling mechanisms or thermosyphon mechanisms are widely used. For example, thermosiphon is heat dissipation method for allowing a working medium (e.g., water) to flow along a circular loop without the need of using a pump to push the working medium. Nowadays, many literatures about the researches and technologies of the thermosiphon mechanisms have been disclosed. For example, US Patent Publication No. 20100315781 discloses a thermosyphon heat exchanger. Moreover, a water cooling radiator is one of the widely-used heat exchanger in the associated application fields. The water cooling radiator cooperates with a fan to cool down the high temperature liquid or condense the vaporized stem into liquid. Consequently, the liquid flows along a circular loop without any pump. In other words, the processes of vaporizing and condensing the liquid are sufficient for circulating the liquid. The principles of the thermosiphon and the operations of the water cooling radiator are well known to those skilled in the art, and are not redundantly described herein.
However, in some usage situations, the thermosyphon heat exchanger is unable to effectively remove the heat from the computer or the electronic device because the circulating efficacy of the working liquid within the thermosyphon heat exchanger is unsatisfied. The applicant found that the vaporizing efficiency and the liquefying efficiency of the working liquid in the heat dissipation device are important factors influencing the circulation of the working medium. Therefore, it is important to enhance the circulation of the working medium in the heat dissipation device.
For solving the drawbacks of the conventional technologies, the present invention provides a heat dissipation device with a vaporization-enhancing structure for increasing the thermal contact area and enhancing the efficiency of vaporizing the working medium. Consequently, the circulation of the working medium in the heat dissipation device is enhanced, and the overall heat dissipation performance is effectively enhanced.
In accordance with an aspect of the present invention, there is provided a heat dissipation device. The heat dissipation device includes a first storage structure, at least one first pipe, at least one heat sink fin group and a vaporization-enhancing structure. The first storage structure includes a first chamber. The first storage structure is in thermal contact with a heat source. An inner portion of each first pipe has a first channel. A first end of the first channel is in fluid communication with the first chamber. A working medium is filled in the first chamber and the first channel. The at least one heat sink fin group is disposed on an outer surface of the at least one first pipe. The vaporization-enhancing structure is disposed within the first chamber and in thermal contact with the first storage structure and at least a portion of the working medium. After the vaporization-enhancing structure receives heat energy from the heat source, the heat energy is transferred to the working medium. The vaporization-enhancing structure facilitates liquid-gas transformation of the working medium, so that the working medium moves in a direction toward a second end of the first channel.
In an embodiment, the at least one first pipe includes plural first pipes, and the at least one heat sink fin group includes plural heat sink fin groups. Each of the plural first pipes is arranged between two adjacent ones of the plural heat sink fin groups.
In an embodiment, the vaporization-enhancing structure includes plural skived fins.
In an embodiment, the first storage structure further includes a first plate, a second plate and plural lateral plates. The plural lateral plates are connected between the first plate and the second plate. The first chamber is defined by the first plate, the second plate and the plural lateral plates collaboratively.
In an embodiment, the second plate includes at least one opening, and the opening is in communication with the first end of the first channel.
In an embodiment, the heat dissipation device further includes a second storage structure, and the second storage structure includes a second chamber. The second chamber is in fluid communication with the second end of the first channel. Moreover, a sealed space is defined by the first chamber, the second chamber and the at least one first channel.
In an embodiment, the heat dissipation device further includes a heat dissipation element. The heat dissipation element is disposed on an outer surface of the second storage structure.
In an embodiment, the heat dissipation device further includes a liquefaction-enhancing structure. The liquefaction-enhancing structure is disposed within the second chamber and in thermal contact with the second storage structure and at least a portion of the working medium. The liquefaction-enhancing structure facilitates gas-liquid transformation of the working medium, so that the working medium moves in a direction toward the first end of the first channel.
In an embodiment, the liquefaction-enhancing structure includes plural skived fins.
In an embodiment, the second end of the first channel is closed.
In an embodiment, the first end and the second end of the at least one first pipe are connected with the first storage structure.
In an embodiment, an inner portion of the at least one first pipe is equipped with a liquefaction-enhancing structure. The liquefaction-enhancing structure facilitates gas-liquid transformation of the working medium, so that the working medium moves in a direction toward the first end of the first channel.
In an embodiment, the liquefaction-enhancing structure includes plural capillary structures or recesses, which are formed on an inner surface of the at least one first pipe and disposed within the first channel.
In an embodiment, the heat dissipation device further includes a third storage structure, at least one second pipe, at least one additional heat sink fin group and an additional vaporization-enhancing structure. The third storage structure includes a third chamber. The third storage structure is in thermal contact with the heat source or an additional heat source. An inner portion of each second pipe has a second channel. A first end of the second channel is in fluid communication with the third chamber. An additional working medium is filled in the third chamber and the second channel. The at least one additional heat sink fin group is disposed on an outer surface of the at least one second pipe. The additional vaporization-enhancing structure is disposed within the third chamber and in thermal contact with the third storage structure and at least a portion of the additional working medium. After the vaporization-enhancing structure receives heat energy from the heat source or the additional heat source, the heat energy is transferred to the additional working medium. The additional vaporization-enhancing structure facilitates liquid-gas transformation of the additional working medium, so that the additional working medium moves in a direction toward a second end of the second channel.
In an embodiment, at least one of the first storage structure and the at least one first pipe and at least one of the third storage structure and the at least one second pipe are directly connected with each other and linked with each other, or at least one of the first storage structure and the at least one first pipe and at least one of the third storage structure and the at least one second pipe are linked with each other through an intermediate coupling mechanism.
In an embodiment, the first pipe is a vertical pipe, and the second pipe is a horizontal pipe.
In an embodiment, the additional vaporization-enhancing structure includes plural skived fins.
From the above descriptions, the heat dissipation device of the present invention is equipped with the vaporization-enhancing structure to increase the thermal contact area and enhance the vaporizing efficiency of the working medium. Consequently, the circulating efficacy of the working medium within the heat dissipation device is enhanced, and the overall heat dissipation performance of the heat dissipation device is increased. In an embodiment, the vaporization-enhancing structure comprises plural skived fins. Since the skived fins have the advantages of high density fins, the thermal contact area between the vaporization-enhancing structure and the liquid working medium is increased. Since the vaporizing speed of the liquid working medium is increased, the circulating efficacy of the liquid working medium within the heat dissipation device is further enhanced and the overall heat dissipation performance of the heat dissipation device is increased. Moreover, since the vaporization-enhancing structure is composed of the plural skived fins, the fabricating cost is reduced.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
In this context, the term “thermal contact” is the contact via thermal conduction. In accordance with the present invention, the thermal contact has two types, including a direct contact mechanism and an indirect contact mechanism. In some embodiments, the thermal contact also includes the contact between two components that are close to each other but not contacted with each other. If two components are directly attached on each other, these two components are in direct contact. If a thermally conductive medium (e.g., thermal paste) is arranged between two components, these two components are in indirect contact. The examples are presented herein for purpose of illustration and description only.
Please refer to
In an embodiment, each first pipe 13 is arranged between two adjacent heat sink fin groups 14. Each heat sink fin group 14 comprises heat sink fins 141. These heat sink fins 141 are substantially parallel with each other and spaced apart from each other in the vertical direction, and arranged on the outer surfaces of the first pipes 13. In an embodiment, the first storage structure 11 further comprises a first plate 112, a second plate 113 and plural lateral plates 114. The plural lateral plates 114 are connected between the first plate 112 and the second plate 113. The first chamber 111 is defined by the first plate 112, the second plate 113 and the plural lateral plates 114 collaboratively. The vaporization-enhancing structure 15 comprises plural skived fins. The vaporization-enhancing structure 15 is disposed on the first plate 112. The second plate 113 comprises plural openings 1131. The plural openings 1131 are in communication with the first ends 1311 of the first channels 131 of the first pipes 13. The structure of the second storage structure 12 is similar to that of the first storage structure 11, and is not redundantly described herein.
The above examples are presented herein for purpose of illustration and description only. The constituents of the heat sink fin groups 14, the arrangements of the heat sink fins 141, the constituents of the first storage structure 11, the constituents of the second storage structure 12 and the relationships between the first storage structure 11, the second storage structure 12 and the first pipes 13, the example of the vaporization-enhancing structure 15 and the relative positions between the vaporization-enhancing structure 15 and the first chamber 111 of the first storage structure 11 are not restricted. That is, numerous modifications and alterations may be made according to the practical requirements.
The principles of removing heat energy by the heat dissipation device 1A will be described as follows. When the first plate 112 of the first storage structure 11 is in thermal contact with an underlying heat source 31, the heat energy of the heat source 31 is transferred to the liquid working medium 2a through the first plate 112 and the overlying vaporization-enhancing structure 15. The liquid working medium 2a is disposed within the first chamber 111 and in thermal contact with the first plate 112 and the vaporization-enhancing structure 15. After the liquid working medium 2a absorbs sufficient heat energy, the liquid working medium 2a is vaporized. Consequently, the liquid working medium 2a is transformed into the gaseous working medium 2b. That is, the liquid-gas transformation occurs. Then, the gaseous working medium 2b enters the first channels 131 through the first ends 1311 of the first channels 131 of the first pipes 13 and moves in the direction toward the second ends 1312 of the first channels 131. The heat energy of the gaseous working medium 2b in the first channels 131 is externally transferred to the heat sink fin groups 14, which are disposed on the outer surfaces of the first pipes 13. Since the gaseous working medium 2b releases heat energy, the gaseous working medium 2b is condensed and liquefied. The gaseous working medium 2b is transformed into the liquid working medium 2a again. The liquid working medium 2a flows back into the first chamber 111 of the first storage structure 11 through the first ends 1311 of the first channels 131 of the first pipes 13 and accumulates in the first chamber 111.
Through the working loop of the two phase changes, the heat energy generated by the heat source 31 can be quickly dissipated away by the heat dissipation device 1A. As mentioned above, the vaporization-enhancing structure 15 comprises the plural skived fins. Since the skived fins have the advantages of high density fins, the thermal contact area between the vaporization-enhancing structure 15 and the liquid working medium 2a is increased. That is, the heat transfer area is increased. Moreover, since the vaporizing speed of the liquid working medium 2a is increased, the circulating efficacy of the working medium 2 within the heat dissipation device 1A is enhanced and the overall heat dissipation performance of the heat dissipation device 1A is increased. Moreover, since the vaporization-enhancing structure 15 is composed of the plural skived fins, the fabricating cost is reduced.
Similarly, after the gaseous working medium 2b in the first channels 131 of the first pipes 13 releases heat energy, the gaseous working medium 2b is liquefied into the liquid working medium 2a. The liquid working medium 2a flows back into the first chamber 111. However, a portion of the gaseous working medium 2b in the first channels 131 of the first pipes 13 is possibly not liquefied and enters the second chamber 121 through the second ends 1312 of the first channels 131.
In this embodiment, the liquefaction-enhancing structure 16 is disposed within the second chamber 121, and the liquefaction-enhancing structure 16 is composed of plural skived fins. As mentioned above, the skived fins have the advantages of high density fins, and thus the thermal contact area between the liquefaction-enhancing structure 16 and the gaseous working medium 2b is increased. Since the heat transfer area is increased, the speed of liquefying the gaseous working medium 2b is increased. The liquid working medium 2a flows back into the first chamber 111 of the first storage structure 11 through the first ends 1311 of the first channels 131 of the first pipes 13 and accumulates in the first chamber 111. In other words, the use of the liquefaction-enhancing structure 16 also enhances the circulating efficacy of the working medium 2 within the heat dissipation device 1B and increases the overall heat dissipation performance of the heat dissipation device 1B. It is noted that the example of the liquefaction-enhancing structure 16 is not restricted. That is, any other structure capable of increasing the thermal contact area to increase the speed of liquefying the gaseous working medium 2b can be used as the liquefaction-enhancing structure 16.
The constituents of the heat sink fin groups 193 and the arrangements of their heat sink fins are similar to the constituents of the heat sink fin groups 14 and the arrangements of their heat sink fins 141. The constituents of the third storage structure 191 and the relative positions between the third storage structure 191 and the plural second pipes 192 are similar to the constituents of the first storage structure 11 and the relative positions between the first storage structure 11 and the plural first pipes. The example of the vaporization-enhancing structure 194 and the relative positions between the vaporization-enhancing structure 194 and the third chamber 1911 of the third storage structure 191 are similar to the example of the vaporization-enhancing structure 15 and the relative positions between the vaporization-enhancing structure 15 and the first chamber 111 of the first storage structure 11. The two phase changes of the working loop of the working medium 4 in the third chamber 1911 of the third storage structure 191 and the second pipes 192 are similar to the two phase changes of the working loop of the working medium 4 in the first chamber 111 of the first storage structure 11, the first pipes 13 and the second chamber 121 of the second storage structure 12.
In an embodiment, at least one of the first storage structure 11, the second storage structure 12, the first pipes 13 and the heat sink fin groups 14 and at least one of the third storage structure 191, the second pipes 192 and the heat sink fin groups 193 are directly connected with each other and thus linked with each other. Alternatively, at least one of the first storage structure 11, the second storage structure 12, the first pipes 13 and the heat sink fin groups 14 and at least one of the third storage structure 191, the second pipes 192 and the heat sink fin groups 193 are linked with each other through an intermediate coupling mechanism (not shown). For example, the intermediate coupling mechanism is an outer casing for fixing the first storage structure 11, the second storage structure 12 and the third storage structure 191. Preferably but not exclusively, the first pipes 13 are vertical pipes and the second pipes 192 are horizontal pipes. In this embodiment, the heat dissipation device 1G comprises plural storage structures (e.g., the first storage structure 11 and the third storage structure 191) to be in thermal contact with plural heat sources 31 and 32 in order to remove the heat energy. Consequently, the heat dissipation device 1G can be flexibly placed according to the application space. For example, according to the application space, the heat dissipation device 1G is rotated 90 degrees. That is, the second pipes 192 are switched from the horizontal pipes to the vertical pipes. Moreover, the third storage structure 191 is located over the heat source 32 and in thermal contact with the heat source 32. Consequently, the heat energy generated by the heat source 32 can be quickly dissipated away by the heat dissipation device 1G.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all modifications and similar structures.
| Number | Date | Country | Kind |
|---|---|---|---|
| 107106603 | Feb 2018 | TW | national |
