Patent Application
20120312509
1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating heat pipes.
2. Description of Related Art
Electronic components, such as central processing units (CPUs) and integrated circuit (IC) packages, comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
However, as the operating speed of electronic components has been continually upgraded, increasingly, the above-described kind of conventional heat dissipation device can no longer meet the heat dissipation requirements of modern electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.
Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The first base 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The first base 10 has a rectangular profile. Two elongated first receiving grooves 12 are defined in a top face of the first base 10. The two first receiving grooves 12 are spaced from and parallel to each other. Two first recessed portions 14 are defined in the top face of the first base 10. The two first recessed portions 14 are located at two opposite lateral sides of the first base 10. The two first recessed portions 14 are correspondingly located adjacent to ends of the two first receiving grooves 12. In this embodiment, the first receiving grooves 12 extend along a lengthwise direction of the first base 10.
The second base 20 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The second base 20 has a rectangular profile. Two cutouts 22 are defined at two opposite lateral sides of the second base 20, respectively. The cutouts 22 are located corresponding to the recessed portions 14 of the first base 10. In other words, the cutouts 22 correspondingly face the recessed portions 14. A bottom face of the second base 20 thermally contacts the top face of the first base 10. An area of the second base 20 is larger than that of the first base 10. In this embodiment, a width of the second base 20 is equal to a length of the first base 10.
Referring to
Each of the heat pipes 40 comprises an evaporating section 44, a condensing section 46 spaced from the evaporating section 44, and a connecting section 42 interconnecting the evaporating section 44 and the condensing section 46. Each heat pipe 40 is U-shaped. The evaporating section 44 is parallel to the condensing section 46 of each heat pipe 40. Both the evaporating section 44 and the condensing section 46 of each heat pipe 40 have a semicircular transverse cross section. In this embodiment of the disclosure, there are two heat pipes 40 juxtaposed with each other. The evaporating section 44 of each heat pipe 40 is received in a corresponding first receiving groove 12 of the first base 10. The evaporating sections 44 of the heat pipes 40 are sandwiched between the first base 10 and the second base 20. Top faces of the evaporating sections 44 of the heat pipes 40 are coplanar with the top face of the first base 10. The condensing section 46 of each heat pipe 40 is received in a corresponding second receiving groove 34 of the fin set 30. The condensing sections 46 of the heat pipes 40 are sandwiched between the second base 20 and the fin set 30. Bottom faces of the condensing sections 46 of the heat pipes 40 are coplanar with the bottom face of the fin set 30. The condensing sections 46 of the heat pipes 40 are spaced from the top face of the first base 10. The connecting section 42 of each heat pipe 40 is accommodated in a corresponding receiving space.
In use of the heat dissipation device, heat absorbed by the first base 10 is transferred to the second base 20, then distributed to the fin set 30, and finally dissipated into the ambient. A thermal conductive capability between the first base 10 and the fin set 30 is enhanced via the heat pipes 40, whereby heat accumulated in the first base 10 is more quickly conducted and the heat dissipation efficiency of the heat dissipation device is thus greatly improved. Additionally, besides the electronic component mounted on the printed circuit board, there are typically other electronic components mounted on the printed circuit board nearby. The area of the first base 10 is limited to a certain extent, and is therefore able to avoiding interfering with certain other electronic components in certain applications. As the first base 10, the second base 20 and the fin set 30 are separate components, the area of the second base 20 overlapping on the first base 10 can be suitably configured for a particular application, and the size of the fin set 30 placed on the second base 20 can be suitably configured for the particular application, with no need to consider reconfiguring the other electronic components mounted on the printed circuit board.
It can be understood that, in alternative embodiments, the first base 10 can be combined with the second base 20 to form a single unitary (integrated) piece, i.e, a base module 100 (see
It is to be further understood that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110153871.3 | Jun 2011 | CN | national |
