The subject matter herein generally relates to heat dissipation devices with forced coolant flow.
A large amount of thermal energy is generated when an electronic device (e.g., a computer central processing unit) operates, and this thermal energy must be quickly removed from the central processing unit to avoid instability or damage to the central processing unit. In general, the surface of the central processing unit is often provided with a heat dissipation device to absorb thermal energy from the central processing unit. The heat energy absorbed by the heat dissipation device is then dissipated by ambient air.
Traditionally, the heat dissipation device includes a metal substrate that is attached to a central processing unit, and a number of fins are formed on the substrate. The substrate is pressed against the central processing unit and can cool sufficiently to ensure proper operation of the central processing unit. Most of the heat energy accumulated on the substrate is first transferred to the fins and then dissipated by the fins. However, the amount of thermal energy generated by advanced central processors has increased. The traditional heat dissipation device is no longer capable of effectively removing thermal energy from the central processor.
Implementations of the present disclosure will now be described, by way of embodiments only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. Additionally, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and devices have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening devices, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the device need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series, and the like.
In one embodiment, the base 10 includes a cylinder 11 and a number of heat sinks 13. The heat sinks 13a are arranged circumferentially around the cylinder 11 and extend outwardly for a predetermined length in a radial direction. In one embodiment, the cylinder 11 and the heat sinks 13 are formed integrally and made of material having relative high thermal conductivity (such as aluminum alloy or graphite sheet).
In one embodiment, as shown in
The separating member 34 is positioned in the housing 31 and defines a first chamber 311 and a second chamber 312 in the housing 31 for storage of coolant. In one embodiment, the separating member 34 is a thin circular disk and having a diameter that is slightly greater than an inside diameter of the housing 31. During the assembly of the driving member 30, the edge of the separating member 34 is sandwiched between the housing members 32 and 33 and the housing members 32 and 33 may be connected through ultrasonic welding technique so as to fix the separating member 34 in the housing 31. A sealing member may be placed between the housing members 32 and 33 to improve the sealing performance of the housing 31. The housing members 32 and 33 may include injection holes 321 and 322. The injection holes 321 and the injection hole 322 respectively communicate with the first chamber 311 and the second chamber 312 for the supply of the coolant into the first chamber 311 and the second chamber 312. The injection holes 321 and 322 may be sealed by a cover.
In one embodiment, the separating member 34 includes a magnetic element. The thin disk of the separating member 34 may be made of magnetic material (i.e., the separating member 34 itself is made of a metal disk having magnetism conductivity). Alternatively, the magnetic material and the thin disk are two individual components and connected together. When the magnetic material is attracted or repelled by magnetic force, the thin disk is deformed and shifts toward the first chamber or the second chamber.
The first magnetic driving member 35 and the second magnetic driving member 36 are connected to the housing 31 and arranged on the traversal axis T. The traversal axis T may be perpendicular to an extension plane OP at which the undeformed separating member 34 is located. In one embodiment, the housing 31 includes two platforms 313 and 314 extruded from the outer surface of the housing members 32 and 33. The first magnetic driving member 35 and the second magnetic driving member 36 are respectively placed on the platform 313 and the platform 314. In one embodiment, the first magnetic driving member 35 and the second magnetic driving member 36 are electromagnets and electrically connected to an electronic current controller 37. The electronic current controller 37 is configured to control electrical current that is applied to the first magnetic driving member 35 and the second magnetic driving member 36 to generate magnetic force.
In one embodiment, the extension segment 22 includes a number of U-shaped sub-segments 221, 223, and 225, and a number of connecting sub-segments 222 and 224. The inlet port 21, the U-shaped sub-segment 221, the connecting sub-segment 222, the U-shaped sub-segment 223, the connecting sub-segment 224, the U-shaped sub-segment 225 and the outlet port 23 are connected in sequence. The U-shaped sub-segments 221, 223, and 225 extend along a height direction (Z-axis direction) of the base 30. In addition, the U-shaped sub-segments 221, 223, and 225 have different widths and are arranged along a direction that is parallel to the traversal axis T. Specifically, the U-shaped sub-segment 223 has a width greater than that of the U-shaped sub-segment 221, and the U-shaped sub-segment 225 has a greater width than that of the U-shaped sub-segment 223.
Referring to
In another embodiment, as shown in
In accordance with one embodiment, an operating method of the heat dissipation device 1 is described below.
In one embodiment, the heat conduction plate 40 of the heat dissipation device 1 is attached on a heat-generating source (such as a CPU or chip, not shown in figures). The heat conduction plate 40 may be connected to the heat-generating source via conductive paste. Afterwards, the driving member 30 of the heat dissipation device 1 is driven to dissipate the heat.
Afterwards, electrical current from the electronic current controller 37 to the first magnetic driving member 35 is stopped, and the electronic current controller 37 applies a preset electrical current to the second magnetic driving member 36 for a particular time. At this time, as shown in
In one embodiment, the electronic current controller 37 sequentially applies electrical current to the first magnetic driving member 35 and the second magnetic driving member 36 in a time period P. The time period P for applying electrical current is repeated several times to actuate the flow of the coolant in two different closed-loop flow paths in the manner of a pump (i.e., the first chamber and the conduit connected to the first chamber and the second chamber and the conduit connected to the second chamber). Therefore, heat from the heat conduction plate 40 is dissipated by conducting heat to the base 20.
In one embodiment, a time interval t1 is programmed between operations for applying electronic current to the first magnetic driving member 35 and the second magnetic driving member 36. That is, the electronic current controller is configured to cut off electronic current between each alternation of supplying electronic current to one of the two magnetic driving members. In addition, a time interval t2 is programmed between two successive time periods P. In the time interval t1 and the time interval t2, the application of electronic current from the electronic current controller 37 to the first magnetic driving member 35 and the second magnetic driving member 36 is stopped, and the separating member 34 is not deformed. Therefore, the coolant in the conduits 20 can flow into the first chamber 311 or the second chamber 312 without hindrance caused by compression applied to the coolant in the first chamber 311 or the second chamber 312.
In one another embodiment, electronic current to the second magnetic driving member 36 is applied immediately after the application of electronic current to the first magnetic driving member 35. A vacant space in the first chamber 311 and the second chamber 312 may be preserved, and the first chamber 311 and the second chamber 312 are not filled with coolant.
The electrical current applied from electronic current controller 37 to the first magnetic driving member 35 and the second magnetic driving member 36 may be a constant value. Alternatively, the electrical current applied from electronic current controller 37 to the first magnetic driving member 35 and the second magnetic driving member 36 used in present time period P can be adjusted to a value that is less than the electrical current applied in previous time period P. As a result, magnetic attraction force for the separating member 34 is gradually decreased over time, such that a time of the coolant staying in the conduits may be prolonged and the cooling efficiency may be improved.
Embodiments of the heat dissipation device actively drive coolant to flow into conduits to convey more heat and faster from heat source to the base. Therefore, a heat dissipation efficiency of the heat dissipation device is improved.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims.
Number | Date | Country | Kind |
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201910069775.7 | Jan 2019 | CN | national |
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