HEAT DISSIPATION MODULE

Abstract

A heat dissipation module including a base, a heat pipe and a fastener is provided. The base has a holding space, and the heat pipe is provided through the holding space. In addition, the fastener is inserted into the holding space. The fastener includes a body and at least an elastomer extending from the body, wherein the elastomer is suitable to press against the heat pipe to make the heat pipe tightly assembled with the base.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 96105755, filed on Feb. 15, 2007. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a heat dissipation module and, more particularly, to a heat dissipation module with a fastener.

2. Description of the Related Art

Along with the rapid development of the electronic industry, the heat dissipation processing of electronic devices is highly valued. For example, common LED car lamps have heat emitting power with high wattage; therefore, heat dissipation modules are usually disposed in the LED car lamps to reduce the work temperature of the LED car lamps.

FIG. 1A is a assembly diagram showing a conventional heat dissipation module, and FIG. 1B is an disassembly diagram showing the heat dissipation module in FIG. 1A. Please refer to FIG. 1A and 1B, and in a conventional heat dissipation module 100, a heat pipe 110 is fastened into a through hole 122 of a base 120 by a solder reflow process, thereby one end 110a of the heat pipe 110 has a good connecting relationship with the base 120. Furthermore, a fin assembly 130 is provided at the other end 110b of the heat pipe 110, wherein the fin assembly 130 is also connected to the heat pipe 110 by solder reflow processing to increase the heat dissipation efficiency of the heat dissipation module 100.

However, configuration designs of some electronic devices disable the heat dissipation module 100 which has finished solder reflow process to be directly disposed into the interior space of some electronic devices. For example, the conventional LED car lamp has a sealed housing, and its lampshade 200 only has an opening 202 through which the heat pipe 110 is provided (Please refer to FIG. 2, which is a assembly diagram showing the heat dissipation module in FIG. 1B assembled to the lampshade). Therefore, the heat dissipation module 100 after solder reflow process cannot pass through the sealed housing to be assembled into the lampshade 200 (The heat dissipation module 100 after solder reflow process cannot be assembled into the lampshade 200 because of the interference with the opening 202). In order to match up the configuration of the lampshade 200, the heat pipe 110 is passed through the opening 202 to make two ends of the heat pipe 110 locate at two sides of the opening, respectively, and then fastened the base 120 and fin assembly 130 to two ends of the heat pipe, respectively, by solder reflow process to dispose the heat dissipation module 100 in the LED car lamp with high heat emitting power.

However, the common lampshade 200 is made of plastic which can not tolerate the high temperature circumstance in solder reflow process. Therefore, the way that assembled the heat pipe 100, the base 120 and the fin assembly 130 into the lampshade 200 first, and then performed the solder reflow process to the whole lampshade 200 to install the heat dissipation module 100 to the LED car lamp is improper. Specifically, the heat pipe 110, the base 120 and the fin assembly 130 which require solder reflow process for assembly is not suitable for heat irresistible components. That is, the application of the heat dissipation modules manufactured by solder reflow process is limited.

In addition, some types of heat dissipation module 300 utilizes screws 302 to fasten a heat pipe 320 into a base 310 (please refer to FIG. 3, which shows another conventional heat dissipation module), however, when a technician wants to make the heat dissipation module 300 disposed on the heat source (not shown) of an electronic device, the interior of the electronic device has no sufficient space for a fastening tool such as screwdriver due to the current trend of lightness and slimness of electronic devices, which affects the assembly efficiency of the heat dissipation module 300 and further decreases the production efficiency of electronic devices.

BRIEF SUMMARY OF THE INVENTION

The invention provides a heat dissipation module which assembles a heat pipe to a base, and the heat dissipation module is not restricted by the assembling space when it is assembled to the heat source of an electronic device, thereby the production efficiency of the electronic device as well as its application is increased.

The invention provides a heat dissipation module including a base, a heat pipe and a fastener. The base has a holding space and the heat pipe is provided through the holding space. In addition, the fastener is inserted into the holding space and has a body and at least an elastomer extending from the body, wherein the elastomer is suitable to press against the heat pipe to make the heat pipe inserted into the holding space tightly assembled with the base.

In an embodiment of the invention, the base further includes a plurality of locking slots, and the fastener further includes a plurality of hooks extending from the body, and the hooks are suitable to be locked at the locking slots, whereby the fastener is fastened to the base.

In an embodiment of the invention, the holding space includes a first space and a second space which are interlinked to the first space, and the heat pipe is provide through the first space and the fastener is inserted into the second space.

In an embodiment of the invention, the fastener is preferably a metal element, but it is not limited.

In an embodiment of the invention, the base is preferably made of metal, but it is not limited.

In an embodiment of the invention, one end of the heat pipe, which is opposite to the base, further includes a fin assembly for increasing the heat dissipation efficiency.

The invention utilizes a fastener having a plurality of elastomers to tightly assemble the heat pipe in the holding space with the base of the heat dissipation module. Compared with the conventional technology, the heat dissipation module of the invention is assembled without the solder reflow process, and therefore, the heat dissipation module of the invention is suitable for heat irresistible components. That is to say, the heat dissipation module of the invention has more applications. In addition, the fastener of the invention can tightly assemble the heat pipe with the base without any auxiliary tools. In this way, the heat dissipation module of the invention is not restricted by the small assembling space when it is installed to other electronic device. In other words, the heat dissipation module of the invention is convenient to be assembled, and an electronic device assembled with the heat dissipation module of the invention has preferred production efficiency.

These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is an assembly diagram showing a conventional heat dissipation module.

FIG. 1B is a disassembly diagram showing the heat dissipation module in FIG. 1A.

FIG. 2 is an assembly diagram showing the heat dissipation module in FIG. 1B assembled with a lampshade.

FIG. 3 is a schematic diagram showing another conventional heat dissipation module.

FIG. 4A is an assembly diagram showing a heat dissipation module in the preferred embodiment of the invention.

FIG. 4B is a disassembly diagram showing the heat dissipation module in FIG. 4A.

FIG. 5 is a sectional drawing showing the dissipation module in FIG. 4A along I-I′ line.

FIG. 6 is an assembly diagram showing the heat dissipation module in FIG. 4A assembled with a fin assembly.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 4A is an assembly diagram showing a heat dissipation module in the preferred embodiment of the invention, and FIG. 4B is a disassembly diagram showing the heat dissipation module in FIG. 4A.

Please refer to FIGS. 4A and 4B, and the heat dissipation module 400 in the embodiment includes a base 410, a heat pipe 420 and a fastener 430. Wherein the base 410, for example, is made of metal, has a holding space 412, and one end 420a of the heat pipe 420 is provided through the holding space 412. In addition, the fastener 430 is also inserted into the holding space 412.

Specifically, the holding space 412 in the embodiment includes a first space 412a and a second space 412b which is interlinked to the first space 412a, and the end 420a of the heat pipe 420 is provided through the first space 412a, and the fastener 430 is inserted into the second space 412b. The shape of the first space 412a is preferred to be correspondent with the external shape of the heat pipe 420, but it is not limited, and the shape of the second space 412b is preferred to be correspondent with the external shape of the fastener 430.

From above, the fastener 430 such as a metal element in the embodiment mostly consists of a body 432 and at least an elastomer 434 extending from the body 432 (two elastomers are shown in FIG. 4B in the embodiment). Wherein the elastomer 434 is, for example, an elastic metallic sheet formed by punching the body 432. When the heat pipe 420 and the fastener 430 are provided into the holding space simultaneously, the elastomer 434 extending from the body 432 presses against the heat pipe 420, whereby the heat pipe 420 inserted into the holding space 412 is tightly assembled with the base 410. In the following, the embodiment illustrates how the heat pipe 420 is tightly assembled with the base 410 in detailed description.

FIG. 5 is a sectional drawing showing the heat dissipation module in FIG. 4A along I-I′ line. Please refer to FIGS. 4B and 5 simultaneously. In the embodiment, when the heat pipe 420 and the fastener 430 are provided at the holding space simultaneously, the heat pipe 420 contacts the elastomer 434 of the fastener 430 and applies a downward force to the elastomer 434, thereby the elastomer 434 is elastically compressed. Accordingly, after the elastomer 434 extending from the body 432 is elastically compressed, the elastomer 434 applies an elastic force to the heat pipe 420 relatively to the body 432, and after the heat pipe 420 bears the elastic force applied by the elastomer 434, it can be tightly assembled with the base 410.

Certainly, in other preferred embodiments, the size and shape of the elastomer 434 can be changed according to usage requirements, thereby the elastomer 434 can supply a sufficient elastic force for making the heat pipe 420 tightly assembled with the base 410. Specifically, in the embodiment, there is no limitation on the size and shape of the elastomer 434, and any elastomer 434 which can make the heat pipe 420 tightly assembled with the base 410 is within the spirit and scope of the invention.

In addition, in the embodiment, in order to make the fastener 430 firmly fixed at the base 410 to keep the heat pipe 420 tightly assembled with the base 410, a plurality of hooks 436 extending from the body 432 are provided at the fastener 430, and locking slots 414 corresponding to a plurality of hooks 436 are provided on the base 410. Therefore, when the fastener 430 is inserted into the holding space 412 to make the heat pipe 420 tightly assembled with the base 410, the hooks 436 of the fastener 430 can be locked at the locking slots 414 of the base 410. In this way, the fastener 430 is not easy to get loose from the base 410 because of being affected by an inappropriate external force. That is, the heat pipe 420 and base 410 can keep tightly assembled with each other even when affected by the inappropriate external force.

In addition, in order to make the heat dissipation module have a preferred heat dissipation efficiency, a fin assembly 600 is provided at the other end 420b of the heat pipe 420 in the embodiment (please refer to FIG. 6 which is an assembly diagram showing the heat dissipation module in FIG. 4 assembled with a fine assembly). In this way, heat energy conducted to the heat dissipation module 400 is released to the air through the convection between the fin assembly 600 and the ambient environment; thereby the heat dissipation efficiency of the heat dissipation module 400 is increased.

To sum up, the heat dissipation module of the invention utilizes a fastener with a plurality of elastomers to tightly assemble the heat pipe provided through holding space with a base. Compared with the conventional technology, the invention has the following advantages:

First, the heat dissipation module of the invention utilizes a fastener to tightly assemble a heat pipe with a base without solder reflow process, and therefore, the heat dissipation module of the invention is suitable to be assembled on heat irresistible components. That is to say, the heat dissipation module of the invention has a broader application field.

Second, the above fastener can tightly assemble the heat pipe with the base without any auxiliary tools, and therefore, when the heat dissipation module of the invention is assembled to other electronic device, a locking tool is not restricted by the assembling space. That is, the heat dissipation module of the invention is convenient to be assembled.

Third, the heat dissipation module of the invention is convenient to be assembled, and therefore, an electronic device which is assembled with the heat dissipation module of the invention has preferred production efficiency.

Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope and spirit of the invention. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.

Claims

1. A heat dissipation module comprising: a base having a holding space;a heat pipe provided through the holding space; anda fastener having a body and at least an elastomer extending from the body, wherein the fastener is inserted into the holding space to make the elastomer press against the heat pipe, whereby the heat pipe provided in the holding space is tightly assembled with the base.

2. The heat dissipation module according to claim 1, wherein the base further comprises a plurality of locking slots, and the fastener further comprises a plurality of hooks extending from the body, and the hooks are suitable to be locked at the locking slots to make the fastener fastened at the base.

3. The heat dissipation module according to claim 1, wherein the holding space comprises a first space and a second space which is interlinked to the first space, and the heat pipe is suitable to be provided through the first space, while the fastener is suitable to be inserted at the second space.

4. The heat dissipation module according to claim 1, wherein the fastener is a metallic element.

5. The heat dissipation module according to claim 1, wherein the base is made of metal.

6. The heat dissipation module according to claim 1, wherein one end of the heat pipe, which is opposite to the base, further comprises a fin assembly.