The present invention relates generally to a heat dissipation structure of handheld device, and more particularly to a heat dissipation structure of handheld device, which can enhance the heat dissipation performance and the structural strength of the handheld device.
Along with the multiplication of the performance and processing speed of the handheld mobile device, the internal electronic components of the handheld mobile device generate higher heat, which is conducted to the entire body of the handheld mobile device. As a result, a user's hand will feel hot and the electronic components may be overheated to burn down. Therefore, it is necessary to dissipate the heat generated by the internal electronic components.
The current handheld mobile device generally has a middle frame or a case as a base seat for supporting the respective units such as the electronic components and the touch screen. The middle frame or the case is generally an integrated structure body made by means of mechanical processing. The manufacturers in this field often additionally arrange assistant heat transfer members such as copper foil, graphite sheet, thin heat pipe and two-phase flow heat exchange unit in the mobile device to spread and dissipate the heat generated by the internal electronic components or conduct the heat to a remote end to dissipate the heat.
The integrated middle frame case 3 is made of one single material by means of mechanical processing such as milling or punching. The single material is selectively aluminum or aluminum alloy or copper alloy. In the case that a lightweight material is selectively used, the structural strength of the handheld device will be deteriorated. On the other hand, in the case that a material with better heat conductivity, such as pure copper, is selectively used, the heat conduction efficiency is enhanced, but the handheld device will be overweight. Moreover, the pure copper is soft and has poor structural strength. Therefore, the middle frame case 3 made of one single material cannot provide good heat conduction performance and sufficient structural strength at the same time.
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It is therefore tried by the applicant to provide a heat dissipation structure of handheld device, which is selectively made of different materials in combination with each other, whereby the different materials can provide respective necessary material properties to achieve the effect of lightweight and thinning. Moreover, the heat dissipation structure of handheld device can enhance the heat conduction efficiency as well as the structural strength of the handheld device.
It is therefore a primary object of the present invention to provide a heat dissipation structure of handheld device, which is made of multiple materials in combination with each other. The multiple materials can provide respective necessary material properties to achieve better heat conduction efficiency and better structural strength of the handheld device.
To achieve the above and other objects, the heat dissipation structure of handheld device of the present invention includes a hollow frame body and a two-phase flow heat exchange unit.
The hollow frame body has a hollow receiving space at the center. An inner periphery of the hollow frame body has a connection section. The two-phase flow heat exchange unit has at least one two-phase flow conduction section. An outer periphery of the two-phase flow conduction section has a lip section. The two-phase flow heat exchange unit is disposed in the hollow receiving space. The lip section is securely connected with the connection section.
The hollow frame body and the two-phase flow heat exchange unit are respectively made of different materials and then assembled with each other. Therefore, the two-phase flow heat exchange unit can enhance the heat conduction performance of the handheld device. Moreover, the hollow frame body is selectively made of a material with better structural strength so that the structural strength of the handheld device is enhanced.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
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The hollow frame body 1 has at least one hollow receiving space 11 in any place. In this embodiment, the hollow frame body 1 has the hollow receiving space 11 at the center. The hollow receiving space 11 has two open ends. An inner periphery of the hollow frame body 1 has a connection section 12 in contact and connection with the two-phase flow heat exchange unit 2.
The two-phase flow heat exchange unit 2 has at least one two-phase flow conduction section 21. An outer periphery of the two-phase flow conduction section 21 has a lip section 22. The two-phase flow heat exchange unit 2 is disposed in the hollow receiving space 11 and the lip section 22 is securely connected with the connection section 12. The connection section 22 is connected with the lip section 22 by means of welding, adhesion, engagement, press fit, insertion or buckling. In this embodiment, the connection section 12 is a channel and the lip section 22 is inserted in the channel to connect with the hollow frame body 1. The two-phase flow heat exchange unit 2 is a vapor chamber or a flat-plate heat pipe. In this embodiment, the two-phase flow heat exchange unit 2 is, but not limited to, a vapor chamber for illustration.
The two-phase flow conduction section 21 has an airtight chamber 211 inside. An inner wall of the airtight chamber 211 has a capillary structure 212. A working liquid 213 is filled in the airtight chamber 211.
The hollow frame body 1 and the two-phase flow heat exchange unit 2 are made of a material selected from a group consisting of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy and aluminum alloy. In addition, the hollow frame body 1 and the two-phase flow heat exchange unit 2 are selectively made of different materials in combination with each other, whereby the different materials can provide respective necessary material properties to enhance the heat conduction efficiency and structural strength.
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In the present invention, the hollow frame body and the two-phase flow heat exchange unit are first independently manufactured and then connected with each other. Accordingly, the hollow frame body 1 and the two-phase flow heat exchange unit 2 can be selectively made of different materials. The different materials have different material properties to respectively enhance the structural strength and promote the heat conduction performance. With respect to the section necessitating better structural strength, stainless steel or titanium or titanium alloy is selectively used to provide better support strength. In the present invention, the hollow frame body 1 is connected with the two-phase flow heat exchange unit 2 as an assembly. The two-phase flow heat exchange unit 2 with two-phase flow heat exchange effect can be directly used to support the electronic components and perform heat conduction work. In the precondition that the number of the heat transfer members is not increased and the thickness is not increased, the heat dissipation and heat transfer member can be omitted so that the total weight and thickness are greatly reduced to achieve the object of lightweight and thinning. Therefore, the shortcoming of the conventional heat dissipation structure of handheld device that only one single material can be selectively used to provide one single material property is improved.
The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.