The subject matter herein generally relates to a heat-dissipation system.
With increasing heavy use of on-line applications, the need for computer data centers is increasing rapidly. During operation, server systems generate a lot of heat in the data centers.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
A definition that applies throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
In the illustrated embodiment, both the heat exchanger 40 and the cooling device 50 are installed outside of the refrigeration tank 10. The fan 30 is coupled between the heat exchanger 40 and the refrigeration tank 10.
In the illustrated embodiment, the electrical component 20 is completely submerged in the refrigerant 12.
In the illustrated embodiment, the refrigerant 12 absorbs the heat generated by the electrical component 20, and is boiled to be a vaporized refrigerant 12. In at least one embodiment, the refrigerant 12 is an electric insulation refrigerant, and the electric insulation refrigerant is fluoride. The boiling point of the electric insulation refrigerant is between 30 centigrade and 60 centigrade, and the heat generated by the electrical component 20 can be absorbed in a timely manner by the refrigerant vapor of the refrigerant 12.
In the illustrated embodiment, the refrigerant vapor of the refrigeration tank 10 is pumped into the heat exchanger 40 through the fan 30.
In the illustrated embodiment, the heat exchanger 40 exchanges the hot fluid formed by the refrigerant vapor with the cooling device 50, for cooling the hot fluid to return to the refrigeration tank 10. In at least one embodiment, the cooling device 50 is a cooling tower.
In the illustrated embodiment, the heat exchanger 40 is installed in a position higher than the refrigeration tank 10, allowing the cold fluid refrigerant to flow back into the refrigeration tank 10.
In the illustrated embodiment, each component is connected with a seamless steel tubing to prevent the refrigerant vapor from escaping in the transmission process.
In operation, the electrical component 20 starts to heat up (such as a central processing unit of the motherboard during booting), and the fan 30 is powered by electricity. The refrigerant 12 absorbs the heat of the motherboard of the server, and part of the refrigerant 12 is boiled to be a vaporized refrigerant 12. The refrigerant vapor of the refrigeration tank 10 is pumped into the heat exchanger 40 through the fan 30. The heat exchanger 40 exchanges the hot fluid formed by the refrigerant vapor with the cooling device 50, for cooling the hot fluid, then the cooled fluid returns to the gas-liquid separator 60. In the meantime, the water pump 70 pumps the cold refrigerant fluid from the gas-liquid separator 60 back to the refrigeration tank 10, to complete the entire cycle of cooling process.
While the disclosure has been described by way of example and in terms of a preferred embodiment, it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the range of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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201510774795.6 | Nov 2015 | CN | national |