The present invention relates generally to heat exchangers, and more particularly, but not by way of limitation, to a cross-counterflow heat exchanger for use with refrigerants.
Heating, ventilation, and air conditioning (“HVAC”) systems typically include components such as, for example, a compressor, a condenser coil, an outdoor fan, an evaporator coil, and an indoor fan. The condenser coil and evaporator coil typically include a plurality of tubes or channels that are designed to exchange heat between a first fluid contained within the condenser coil or evaporator coil and a second fluid surrounding these coils. For example, the condenser coil may contain a refrigerant that has been pressurized by the compressor. The compressed refrigerant passes through the condenser coil in order to reject heat within the compressed refrigerant to ambient air passing over the condenser coil. The evaporator coil may contain a refrigerant that has been depressurized by, for example, an expansion valve in order to provide a cooling duty. The depressurized refrigerant passes through the evaporator coil to absorb heat from air passing over the evaporator coil.
In some HVAC systems, the compressor operates to significantly compress the refrigerant. The resulting pressure requires that the condenser coil and evaporator coil be constructed to reliably handle these pressures. While current coil construction methods have shown to be capable of performing as needed, the current coil construction methods have limitations. For example, the current coil construction methods do not permit a cross-counterflow arrangement for exchanging heat between a refrigerant and a surrounding air flow. The typical construction can also be costly.
In an embodiment, a heat exchanger includes a plurality of conduits that extend between a first endplate and a second endplate. A first manifold is coupled to the first endplate to couple the first manifold to first ends of the plurality of conduits. An inlet is coupled to the first manifold to direct a first fluid into the first manifold and at least one baffle is disposed within the first manifold to form a first cavity and a second cavity. The at least one baffle of the first manifold is configured to direct the first fluid from the inlet to a first conduit of the plurality of conduits. A second manifold is coupled to the second endplate to couple the second manifold to second ends of the plurality of conduits and at least one baffle is disposed within the second manifold to form a fourth cavity and a fifth cavity. The at least one baffle of the second manifold is configured to direct the first fluid from the first conduit to a second conduit of the plurality of conduits. The first conduit is coupled to the first cavity of the first manifold and the fourth cavity of the second manifold and the second conduit is coupled to the fourth cavity of the second manifold and the second cavity of the first manifold.
A method of making a heat exchanger includes coupling a plurality of conduits between a first endplate and a second endplate, the plurality of conduits forming a first array of conduit ends on the first endplate and a second array of conduit ends on the second endplate. The method also includes coupling a first manifold comprising at least one baffle to the first endplate and coupling a second manifold comprising at least one baffle to the second endplate. The at least one baffle of the first manifold divides the first array of conduit ends between at least a first cavity and a second cavity, and the at least one baffle of the second manifold divides the second array of conduit ends between at least a fourth cavity and a fifth cavity.
In an embodiment, an HVAC system includes an indoor unit that includes an evaporator coil and an outdoor unit that includes a condenser coil. At least one of the evaporator coil and the condenser coil includes: a plurality of conduits that extend between a first endplate and a second endplate; a first manifold coupled to the first endplate to couple the first manifold to first ends of the plurality of conduits; an inlet coupled to the first manifold to direct a first fluid into the first manifold; at least one baffle disposed within the first manifold to form a first cavity and a second cavity and configured to direct the first fluid from the inlet to a first conduit of the plurality of conduits; a second manifold coupled to the second endplate to couple the second manifold to second ends of the plurality of conduits; and at least one baffle disposed within the second manifold to form a fourth cavity and a fifth cavity and configured to direct the first fluid from the first conduit to a second conduit of the plurality of conduits. The first conduit is coupled to the first cavity of the first manifold and the fourth cavity of the second manifold, and the second conduit is coupled to the fourth cavity of the second manifold and the second cavity of the first manifold.
A more complete understanding of embodiments of the present invention may be obtained by reference to the following Detailed Description when taken in conjunction with the accompanying Drawings wherein:
Embodiment(s) of the invention will now be described more fully with reference to the accompanying Drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiment(s) set forth herein. The invention should only be considered limited by the claims as they now exist and the equivalents thereof.
The HVAC system 100 includes an indoor fan 110, a gas heat 103 typically associated with the indoor fan 110, and an evaporator coil 120, also typically associated with the indoor fan 110. The indoor fan 110, the gas heat 103, and the evaporator coil 120 are collectively referred to as an indoor unit 102. In a typical embodiment, the indoor unit 102 is located within, or in close proximity to, the enclosed space 101. The HVAC system 100 also includes a compressor 104, an associated condenser coil 124, and an associated condenser fan 115, which are collectively referred to as an outdoor unit 106. In various embodiments, the outdoor unit 106 and the indoor unit 102 are, for example, a rooftop unit or a ground-level unit. The compressor 104 and the associated condenser coil 124 are connected to the evaporator coil 120 by a refrigerant line 107. In a typical embodiment, the refrigerant line 107 includes a plurality of copper pipes that connect the associated condenser coil 124 and the compressor 104 to the evaporator coil 120. In a typical embodiment, the compressor 104 may be, for example, a single-stage compressor, a multi-stage compressor, a single-speed compressor, or a variable-speed compressor. The indoor fan 110, sometimes referred to as a blower, is configured to operate at different capacities (e.g., variable motor speeds) to circulate air through the HVAC system 100, whereby the circulated air is conditioned and supplied to the enclosed space 101.
Still referring to
The HVAC controller 170 may be an integrated controller or a distributed controller that directs operation of the HVAC system 100. In a typical embodiment, the HVAC controller 170 includes an interface to receive, for example, thermostat calls, temperature setpoints, blower control signals, environmental conditions, and operating mode status for various zones of the HVAC system 100. The environmental conditions may include indoor temperature and relative humidity of the enclosed space 101. In a typical embodiment, the HVAC controller 170 also includes a processor and a memory to direct operation of the HVAC system 100 including, for example, a speed of the indoor fan 110.
Still referring to
Additionally, the user interface 178 may include a processor and memory configured to receive user-determined parameters such as, for example, a relative humidity of the enclosed space 101 and to calculate operational parameters of the HVAC system 100 as disclosed herein.
The HVAC system 100 is configured to communicate with a plurality of devices such as, for example, a monitoring device 156, a communication device 155, and the like. In a typical embodiment, and as shown in
In a typical embodiment, the communication device 155 is a non-HVAC device having a primary function that is not associated with HVAC systems. For example, non-HVAC devices include mobile-computing devices configured to interact with the HVAC system 100 to monitor and modify at least some of the operating parameters of the HVAC system 100. Mobile computing devices may be, for example, a personal computer (e.g., desktop or laptop), a tablet computer, a mobile device (e.g., smart phone or smart watch), and the like. In a typical embodiment, the communication device 155 includes at least one processor, memory, and a user interface such as a display. One skilled in the art will also understand that the communication device 155 disclosed herein includes other components that are typically included in such devices including, for example, a power supply, a communications interface, and the like.
The zone controller 172 is configured to manage movement of conditioned air to designated zones of the enclosed space 101. Each of the designated zones includes at least one conditioning or demand unit such as, for example, the user interface 178, only one instance of the user interface 178 being expressly shown in
A data bus 190, which in the illustrated embodiment is a serial bus, couples various components of the HVAC system 100 together such that data is communicated therebetween. The data bus 190 may include, for example, any combination of hardware, software embedded in a computer readable medium, or encoded logic incorporated in hardware or otherwise stored (e.g., firmware) to couple components of the HVAC system 100 to each other. As an example and not by way of limitation, the data bus 190 may include an Accelerated Graphics Port (AGP) or other graphics bus, a Controller Area Network (CAN) bus, a front-side bus (FSB), a HYPERTRANSPORT (HT) interconnect, an INFINIBAND interconnect, a low-pin-count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a serial advanced technology attachment (SATA) bus, a Video Electronics Standards Association local (VLB) bus, or any other suitable bus or a combination of two or more of these. In various embodiments, the data bus 190 may include any number, type, or configuration of data buses 190, where appropriate. In particular embodiments, one or more data buses 190 (which may each include an address bus and a data bus) may couple the HVAC controller 170 to other components of the HVAC system 100. In other embodiments, connections between various components of the HVAC system 100 are wired. For example, conventional cable and contacts may be used to couple the HVAC controller 170 to the various components. In some embodiments, a wireless connection is employed to provide at least some of the connections between components of the HVAC system 100 such as, for example, a connection between the HVAC controller 170 and the indoor fan 110 or the plurality of environment sensors 176.
Referring now to
The first manifold 204 and the second manifold 208 function as fluid collectors and are configured to direct a flow of the first fluid as it passes through the heat exchanger 200. The first manifold 204 and the second manifold 208 may be manufactured out of a variety of materials such as, for example, plastics or metals. In embodiments using plastics, the first manifold 204 and the second manifold 208 can be created via an injection molding process or various other known processes used to form components out of plastics. Using plastic can reduce a cost to manufacture the heat exchanger 200. In some embodiments, plastics are appropriate for fluid pressures of up to approximately 175 psig. In a typical embodiment, various types of plastics may be used for the first manifold 204 and the second manifold 208 such as, for example, nylon, PVC, acetal, and PPS. When using plastic, the first manifold 204 and the second manifold 208 may be joined to the first endplate 205 and the second endplate 209, respectively, via various known joining processes such as, for example, crimping and adhesive processes. In some embodiments, a gasket may be placed between the first manifold 204 and the first endplate 205 and the second manifold 208 and second endplate 209 to provide a better seal therebetween.
In embodiments using metals, the first manifold 204 and the second manifold 208 may be formed using various known techniques such as, for example, welding, casting, pressing, and the like. In a typical embodiment, various metals may be used for the first manifold 204 and the second manifold 208 such as, for example, aluminum, copper, and steel. When the first manifold 204 and the second manifold 208 are made of metal, they may be joined to the first endplate 205 and the second endplate 209, respectively, via various known joining processes such as, for example, welding and brazing processes. In various embodiments, metals are appropriate for fluid pressures of up to approximately 300 psig.
In some embodiments, as illustrated in
The plurality of conduits 206 can be made in a variety of ways. For example, the plurality of conduits 206 can be formed via an extrusion process or by folding a sheet and welding together opposite edges of the sheet together to form a conduit. Forming the plurality of conduits 206 via folding and welding can result in lower manufacturing costs and also allows surfaces of the plurality of conduits 206 to be embossed or pressed with intricate shapes to increase a surface area of the plurality of conduits 206 that comes into contact with the first and second fluids to increase an ability of the plurality of conduits 206 to transfer heat between the first and second fluids.
As illustrated in
In a typical embodiment, a plurality of fins 207 are disposed between the four layers (a)-(d) of the plurality of conduits 206. The plurality of fins 207 are configured to increase heat transfer between the second fluid that passes around the heat exchanger 200 (e.g., air) and the first fluid flowing through the heat exchanger 200 (e.g., refrigerant).
The first manifold 204 includes a first baffle 212 and a second baffle 214 that divide the first manifold 204 into a first cavity 218, a second cavity 220, and a third cavity 222. The second manifold 208 includes a third baffle 216 that divides the second manifold 208 into a fourth cavity 224 and a fifth cavity 226. The cavities 218, 220, 222, 224, and 226 create a flow path for the first fluid that passes back and forth between the first manifold 204 and the second manifold 208.
Referring now to
A person of ordinary skill in the art will recognize that each of the inlet 202 and the outlet 210 could be disposed on either the first manifold 204 or the second manifold 208 by using an appropriate number of baffles within the first manifold 204 and the second manifold 208 to direct the first fluid to pass through the plurality of conduits 206. For example, the first fluid can be made to make additional passes between the first manifold 204 and the second manifold 208 by adding additional baffles to the first manifold 204 and the second manifold 208. Similarly, fewer passes may be achieved by removing baffles from the first manifold 204 and the second manifold 208. The design of the heat exchanger 200 allows for complicated, multi-pass flow paths to be created with a simplified design as compared to other heat exchanges that require additional manifolds to create additional passes.
To form the sheet 301 into a tube, the sheet 301 is folded so that the left side edge 306 and the right side edge 308 abut one another. The left side edge 306 and the right side edge 308 may then be joined together to form a tube as shown in
At step 406, a first manifold 204 comprising at least one baffle (e.g., the first baffle 212) is coupled to the first endplate 205 and a second manifold comprising at least one baffle (e.g., the third baffle 216) is coupled to the second endplate 209. The at least one baffle of the first manifold 204 divides the first array of conduits between the first cavity 218 and the second cavity 220. The at least one baffle of the second manifold 208 divides the second array of conduits between the fourth cavity 224 and the fifth cavity 226.
The method 400 may optionally include one or more of steps 408 and 410. At step 408, the plurality of fins 207 are positioned between layers (a)-(d) of the plurality of conduits 206. The plurality of fins 207 may be positioned between the layers (a)-(d) at the same time the plurality of conduits 206 are coupled to the first endplate 205 and the second endplate 209 or after the plurality of conduits 206 have been coupled to the first endplate 205 and the second endplate 209. At step 410, a surface treatment 310 is applied to at least one of the first side 314 and the second side 316 of each conduit of the plurality of conduits 206. The surface treatment may be applied to the plurality of conduits 206 prior to the plurality of conduits 206 being coupled to the first endplate 205 and the second endplate 209. The method 400 ends at step 412.
Conditional language used herein such as, among others. “can,” “might,” “may,” “e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or states. Thus such conditional language is not generally intended to imply that features, elements and/or states are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or states are included or are to be performed in any particular embodiment.
While the above detailed description has shown, described, and pointed out novel features as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the devices or algorithms illustrated can be made without departing from the spirit of the disclosure. As will be recognized, the processes described herein can be embodied within a form that does not provide all of the features and benefits set forth herein, as some features can be used or practiced separately from others. The scope of protection is defined by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Although various embodiments of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it will be understood that the invention is not limited to the embodiments disclosed, but is capable of numerous rearrangements, modifications and substitutions without departing from the spirit of the invention as set forth herein.
This application is a continuation of U.S. patent application Ser. No. 15/896,189, filed on Feb. 14, 2018. U.S. patent application Ser. No. 15/896,189 is incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
Parent | 15896189 | Feb 2018 | US |
Child | 16899652 | US |