Claims
- 1. A heat mode thermal transfer recording material comprising
- a) a support;
- b) a light-heat converting layer comprising
- 1) a water-soluble near infrared-absorptive dye having a sulfo group; and
- 2) a water soluble binder;
- c) an ink layer containing a colorant and a binder which can be softened or melted upon heating, and transferred; and
- d) a cushioning layer;
- wherein said water-soluble near infrared-absorptive dye has an absorption peak at wavelengths longer than 700 nm and the water solubility of said dye is not less than 0.1% by weight of water, and said light-heat converting layer is disposed between said support and said ink layer.
- 2. The heat mode thermal transfer recording material of claim 1, wherein said water-soluble binders are selected from the group consisting of polyvinyl alcohols, polyvinyl pyrrolidone, gelatin, glue, casein, methyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, carboxymethyl cellulose, hydroxyethyl starch, gum arabic, sucrose octacetate, ammonium alginate, sodium alginate, polyvinylamine polyethylene oxides, polystyrenesulfonic acids and polyacrylic acids.
- 3. The heat mode thermal transfer recording material of claim 2, wherein said water-soluble binder is a binder selected from the group consisting of a gelatin, a polyvinyl alcohol, and a methyl cellulose.
- 4. The heat mode thermal transfer recording material of claim 1, wherein the thickness of the ink layer is not more than 1.0 .mu.m.
- 5. The material of claim 1, wherein said light-heat converting layer comprises said water-soluble near infrared-absorptive dye in an amount of 2 to 80% by weight.
- 6. The heat mode thermal transfer recording material of claim 1, wherein the thickness of said ink layer is within the range of 0.2 to 2 .mu.m.
- 7. The heat mode thermal transfer recording material of claim 1, wherein the thickness of said light-heat converting layer is within the range of 0.1 to 3 .mu.m.
- 8. The heat mode thermal transfer recording material of claim 1, wherein the thickness of said cushioning layer is within the range of 1 to 50 .mu.m.
- 9. The heat mode thermal transfer recording material of claim 1, wherein the thickness of said support is within the range of 5 to 200 .mu.m.
- 10. The heat mode thermal transfer recording material of claim 1, wherein a backing layer is provided on the reverse side of said support.
- 11. The heat mode thermal transfer recording material of claim 1, wherein the thickness of said light-heat converting layer is not more than 1.0 .mu.m, and the absorbance of said light-heat converting layer is 0.3 to 3.3 at a wavelength longer than 700 nm.
- 12. The heat mode thermal transfer recording material of claim 11, wherein said absorbance of said light-heat converting layer is 0.7 to 2.5 at a wavelength longer than 700 nm.
Priority Claims (2)
Number |
Date |
Country |
Kind |
4-094422 |
Apr 1992 |
JPX |
|
4-271880 |
Oct 1992 |
JPX |
|
Parent Case Info
This application is a Continuation of application Ser. No. 08/041,444, filed Apr. 1, 1993, now abandoned.
US Referenced Citations (13)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0321923 |
Jun 1989 |
EPX |
0366461 |
May 1990 |
EPX |
0454083 |
Oct 1991 |
EPX |
63-104881 |
May 1988 |
JPX |
2-292088 |
Dec 1990 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
41444 |
Apr 1993 |
|