This Non-provisional application claims priority under U.S.C. ยง 119(a) on Patent Application No(s). 093135591 filed in Taiwan, Republic of China on Nov. 19, 2004, the entire contents of which are hereby incorporated by reference.
The invention relates to a heat pipe, and in particular to a heat pipe with an enhanced wick structure.
In electronic devices, with increased number of transistors per unit area, heat is increased. Moreover, as operating frequency of the electronic devices increase, heat generated by on/off operation of the transistors is also increased. To prevent deterioration of operating performance of the electronic devices and prolong the lifespan of the electronic devices, heat generated by the transistors must be effectively removed.
A heat pipe can transfer heat over a long distance within a small cross section and under minor temperature differences. The heat pipe can be operated in the absence of power and is thus widely used to remove heat generated by an electronic device. Conventionally, a heat pipe has a hollow and sealed main body, a wick structure, and a working fluid. The working fluid absorbs heat and vaporizes in a vaporization section. The working fluid then flows to a condensing section to release the heat and is condensed to liquid. The liquid working fluid returns to the vaporization section by capillary attraction provided by the wick structure. By the working fluid circulating in the heat pipe with the aforementioned process, heat generated from the electronic device can thus be continuously transferred away from the electronic device. Therefore, the wick structure plays an important role in the performance of the heat pipe. Conventionally, the wick structure is divided into a meshed wick structure, sintered wick structure, and grooved wick structure.
Accordingly, all the conventional wick structures have drawbacks and limitations in application. As assembly density of components in electronic devices increases, heat generated by the electronic devices also increases. Additionally, as size of the electronic devices is reduced, smaller heat pipes with enhanced capability of heat transfer are thereby required.
Hence, there is a need to provide an improved heat pipe with a wick structure capable of being easily manufactured and can be widely applied to various heat pipes.
Accordingly, an embodiment of the invention provides a wick structure for a heat pipe. The wick structure includes a coil-shaped wire on an inner wall of a main body of the heat pipe. The coil-shaped wire is attached to the inner wall so as to form a plurality of grooves. The coil-shaped wire is obtained by winding a copper wire around a supporting frame. The supporting frame has a predetermined shape corresponding to the main body of the heat pipe so that the supporting frame is exactly accommodated within the heat pipe. The cross section of the heat pipe is circular, elliptical, semicircular, rectangular, triangular, quadrilateral, trapezoid, pentagonal, hexagonal, octagonal, or polygonal shape. The coil-shaped wire includes metal, alloy, or nonmetallic materials. The coil-shaped wire preferably includes copper. The heat pipe is made of plastic, metal, alloy, or nonmetallic materials.
Another embodiment of the invention provides a heat pipe including a main body, a wick structure, and a working fluid. The wick structure is attached to the inner wall of the main body, and the working fluid is filled in the main body. The wick structure includes a coil-shaped wire attached to the inner wall of the main body so as to form a plurality of grooves. The coil-shaped wire is obtained by winding a copper wire around a supporting frame. The supporting frame has a predetermined shape corresponding to the main body of the heat pipe so that the supporting frame is exactly accommodated within the heat pipe. The cross section of the heat pipe is circular, elliptical, semicircular, rectangular, triangular, quadrilateral, trapezoid, pentagonal, hexagonal, octagonal, or polygonal shape. The coil-shaped wire includes metal, alloy, or nonmetallic materials. The coil-shaped wire preferably is copper. The heat pipe is made of plastic, metal, alloy, or nonmetallic materials. The working fluid is inorganic compounds, water, alcohols, liquid metal, ketones, refrigerant, or organic compounds.
Yet another embodiment of the invention provides a method of forming a wick structure in a heat pipe. The method includes steps of providing a supporting frame, winding a copper wire around the supporting frame to form a coil-shaped wire, providing a main body including an inner wall, and attaching the coil-shaped wire onto the inner wall to form a plurality of grooves. The supporting frame has a predetermined shape corresponding to the main body of the heat pipe so that the supporting frame is exactly accommodated within the heat pipe. The cross section of the heat pipe is circular, elliptical, semicircular, rectangular, triangular, quadrilateral, trapezoid, pentagonal, hexagonal, octagonal, or polygonal shape. The coil-shaped wire is made of metal, alloy, or nonmetallic materials. The coil-shaped wire preferably is copper, and the heat pipe is plastic, metal, alloy, or nonmetallic materials.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The heat pipe 20 can be applied to a heat-generating electronic device alone or be used by combining with a heat sink for transferring heat from the heat-generating electronic device to other places. The heat-generating electronic device may be a CPU, a transistor, a server, an advanced graphic card, a hard disk drive, a power supply, a vehicle control system, a multimedia electronic mechanism, a radio base station, or an advanced video game machine. Moreover, in addition to the heat pipe 20 and heat sink, a fan can also be applied to the heat-generating electronic device to enhance heat dissipation effect or transfer efficiency.
The supporting frame 28 preferably includes multiple columns, such as several rectangular columns as shown in
Moreover, the coil-shaped wire 26 is not limited to being winding in only one single predetermined direction according to a virtual axle X, as shown in
In addition to application in transformers, mature winding techniques can also be applied to manufacture of the heat pipe. As compared to the conventional sintered wick structure requiring complicated manufacturing processes of stuffing powders and sintering, the present wick structure with the coil-shaped wire can simply be manufactured by using mature winding techniques, thereby reducing manufacturing costs thereof.
Moreover, the pitch of the grooves of the wick structure can be adjusted by changing the diameter of the copper wire and adjusting the distance between adjacent wires during winding of the wire. As the result, the manufacture of the present wick structure is thus simplified. Also, the present wick structure can cooperate with the meshed, sintered, and grooved wick structures to be employed on various heat pipes.
In conclusion, the heat pipe of this embodiment has a novel wick structure with the coil-shaped wire. The manufacture of the wick structure of this embodiment is simplified, compared to that of conventional wick structures, and the wick structure of this embodiment provides high heat transfer capability, high permeability and greater capillary attraction.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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093135591 | Nov 2004 | TW | national |