The subject matter herein generally relates to a heat pipe assembly and an electronic device using the heat pipe assembly.
Electronic components such as central processing units (CPUs) generate heat during operation. Thus, heat dissipation devices, such as heat pipes, are used to dissipate the heat generated. While heat pipes are useful, a heat pipe with a better structure is needed.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein may be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to illustrate details and features of the present disclosure better.
Several definitions that apply throughout this disclosure will now be presented.
The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like. The term “about” when utilized, means “not only include the numerical value, but also include numbers closest to the numerical value”.
Referring to
The sleeve 12 includes an open end 121 facing away from the end wall 13. The open end 121 defines an opening 123.
The dissipation section 11 includes a first casing 111, a first wick structure 112 attached to an inner surface of the first casing 111, and a working medium 113 filled in the first casing 111. The sleeve 12 extends straight from the first casing 111.
The first casing 111 defines a first sealed cavity 1111. The working medium 113 is filled in the first sealed cavity 1111.
The first casing 111 may comprise only one metal layer or at least two metal layer stacked together. The metal layer is made of metal such as copper, silver, aluminum, stainless steel, or carbon steel.
The first wick structure 112 may be made of metal mesh, carbon nanotube array, or any combination thereof.
The first working medium 113 may be selected from, for example, water, alcohol, ammonia, or any combination thereof.
The first sealed cavity 1111 can maintain a vacuum state.
The male heat pipe 20 includes an inserting end 21 and a free end 22 opposite to the inserting end 21. The inserting end 21 can be inserted into the sleeve 12 of the female heat pipe 10 through the opening 123. The inserting end 21 and the free end 22 are closed ends. An external diameter of the inserting end 21 is smaller than or equal to the internal diameter of the opening 123, so that the inserting end 21 can be inserted into the sleeve 12.
The male heat pipe 20 includes a second casing 211, a second wick structure 212 attached to an inner surface of the second casing 211, and a second working medium 213 filled in the second casing 211.
The second casing 211 defines a second sealed cavity 2111. The second working medium 213 is filled in the second sealed cavity 2111.
The second casing 211 may comprise only one metal layer or at least two metal layer stacked together. The metal layer is made of metal such as copper, silver, aluminum, stainless steel, or carbon steel.
The second wick structure 212 may be made of metal mesh, carbon nanotube array, or any combination thereof.
The second working medium 213 may be selected from water, alcohol, ammonia, or any combination thereof.
The second sealed cavity 2111 can maintain a vacuum state.
The female heat pipe 10a includes a U-shaped dissipation section 11a and at least two sleeves 12a integrally formed with the dissipation section 11a. The number of the sleeves 12a is equal to the number of the male heat pipes 20a.
The male heat pipes 20a and the sleeves 12a have the same structures as the male heat pipe 20 and the sleeve 12, respectively, of the heat pipe assembly 100 in the first exemplary embodiment. Different from the dissipation section 11 of the heat pipe assembly 100 of the first exemplary embodiment, the dissipation section 11a is U-shaped and comprises two ends, and the male heat pipes 20a extend straight from the two end portions of the dissipation section 11a.
Referring to
In at least one exemplary embodiment, the auxiliary device 202 includes a heat dissipation component 2021. The dissipation section 11a of the female heat pipe 10a is in thermal contact with the heat dissipation component 2021. The heat dissipation component 2021 can dissipate the heat transmitted from the main device 201.
In another exemplary embodiment, the two male heat pipes 20a may be mounted in the auxiliary device 202. The female heat pipe 10a may be mounted in the main device 201.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structures and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including, the full extent established by the broad general meaning of the terms used in the claims.
Number | Date | Country | Kind |
---|---|---|---|
201620645839.5 | Jun 2016 | CN | national |