1. Technical Field
The disclosure relates generally to a heat transfer apparatus, and more particularly to a heat pipe having a composite capillary wick structure.
2. Description of the Related Art
Heat pipes have excellent heat transfer performance due to their low thermal resistance, and are therefore an effective means for transfer or dissipation of heat from heat sources. Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers.
A heat pipe is usually a vacuum casing containing a working medium therein. The working medium is employed to carry, under phase change between liquid state and vapor state, thermal energy from an evaporator section to a condenser section of the heat pipe. Preferably, a wick structure is provided inside the heat pipe, attached to an inner wall of the casing, for drawing the working medium back to the evaporator section after it is condensed at the condenser section. In operation, the evaporator section of the heat pipe is maintained in thermal contact with a heat-generating component. The working medium contained at the evaporator section absorbs heat generated by the heat-generating component and then turns into vapor and moves towards the condenser section where the vapor is condensed into condensate after releasing the heat into the ambient environment. Due to the difference in capillary pressure which develops in the wick structure between the two sections, the condensate is then brought back by the wick structure to the evaporator section where it is again available for evaporation.
In order to draw the condensate back timely, the wick structure provided in the heat pipe is expected to provide a high capillary force and meanwhile generate a low flow resistance for the condensate. In ordinary use, the heat pipe needs to be flattened to enable the miniaturization of electronic products incorporating the heat pipe. The flattening may result in damage to the wick structure of the heat pipe. When this happens, the flow resistance of the wick structure increases and the capillary force provided by the wick structure is decreased, which in turn reduces the heat transfer capability of the heat pipe. If the condensate is not quickly brought back from the condenser section, the heat pipe will suffer a dry-out problem at the evaporator section.
Therefore, it is desirable to provide a heat pipe with improved heat transfer capability; wherein a wick structure of the heat pipe will not be damaged and still can have a satisfactory wicking force when the heat pipe is flattened.
The components of the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments of the display device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views.
Referring to
Referring to
The first wick structure 30 is screen mesh to provide a capillary force to drive condensed working medium 20 at the condensing section 104 to flow towards the evaporating section 102; thus, a thickness and pore size of the first wick structure 30 can be easily changed. The thickness of the first wick structure 30 is preferably smaller than 0.1 mm. The first wick structure 30 is attached on an inner wall of the casing 10 and extends from the condensing section 104 to the evaporating section 102. The first wick structure 30 is coiled from a plat screen mesh 31 showed as
When assembled, the first wick structure 30 and the second wick structure 40 are juxtaposed on the inner wall of the casing 10. The second wick structure 40 is attached at a bottom surface of the inner wall of the evaporating section 102 of the case 10. A composite wick structure is thus formed in the casing 10 of the heat pipe 100. In operation, the evaporating section 102 of the heat pipe 100 is placed in thermal contact with the heat source. The working medium 20 contained in the evaporating section 102 of the heat pipe 100 is vaporized into vapor upon receiving the heat generated by the heat source. Then, the generated vapor moves via the inner space between the first wick structure 30. After the vapor releases the heat carried thereby and is condensed into condensate in the condensing section 104, the condensate flows through the pores of the first wick structure 30 to the evaporating section 102 of the heat pipe 100 to again be available for evaporation. Meanwhile, the condensate is capable of entering the second wick structure 40 easily due to the second wick structure 40 has smaller pores with the larger capillary force than the first wick structure 30. As a result, the condensate is drawn back to the evaporating section 102 rapidly and timely, thus preventing a potential dry-out problem occurring at the evaporating section 102 of the heat pipe 100. The composite wick structure has different pore sizes to provide relatively large capillary force, and to provide relatively low flow resistance and heat resistance at the same time. The heat transfer capability of the heat pipe 100 is thus increased.
Referring to
It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of the embodiment(s), together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only; and that changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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100148749 | Dec 2011 | TW | national |