IBM Technical Disclosure Bulletin, vol. 31, No. 3, Aug. 1988, "Testable High Performance Module", by Katyl et al., pp. 158-160, Letter to Yakubowski dated Jun. 13, 1988, re: Pyralux. |
Research Disclosure #28852, Apr. 1988, "Heat Sink Having High Ratio Fluid Channels . . . Manufacture", p. 224. |
IBM Technical Disclosure Bulletin, vol. 23, No. 8, pp. 3623-3624, Jan. 1981, "Fixture for . . . Module" by E. Kunkler et al. |
IBM Technical Disclosure Bulletin, vol. 22, No. 6, pp. 2297-2298, Nov. 1979, "Heat Sink Design . . . Environment" by Arnold et al. |
IBM Technical Disclosure Bulletin, vol. 19, No. 5, p. 1640, Oct. 1976, "Pressure-Sensitive Tape . . . Application" by Christie et al. |