Claims
- 1. A heat sink comprising:
a first planar member having an upper face formed with a first groove portion; a second planar member having a lower face formed with a second groove portion; and a partition disposed between said upper face of said first planar member and said lower face of said second planar member; said partition being formed with a hole for communicating a first space and a second space to each other, said first space being formed by said first groove portion and a lower face of said partition, said second space being formed by said second groove portion and an upper face of said partition; said first space being provided with a first connecting member for connecting a bottom face of said first groove portion and said lower face of partition to each other; said heat sink further comprising a supply port for supplying a fluid into said first space and a discharge port for discharging said fluid from said second space.
- 2. A heat sink according to claim 1, wherein a plurality of said first connecting members are provided.
- 3. A heat sink according to claim 1, wherein said first connecting member has a substantially circular cross section.
- 4. A heat sink according to claim 1, wherein said first connecting member has a cross section whose length in a first direction from said supply port to said hole is longer than the length in a second direction substantially perpendicular to said first direction, said cross section being shaped like a curve on said supply port side.
- 5. A heat sink according to claim 4, wherein said first connecting member has a substantially elliptical cross section.
- 6. A heat sink according to claim 1, wherein a second connecting member for connecting a bottom face of said second groove portion and said upper face of partition to each other is disposed in said second space.
- 7. A heat sink according to claim 6, wherein a plurality of said second connecting members are provided.
- 8. A heat sink according to claim 6, wherein said second connecting member has a substantially circular cross section.
- 9. A heat sink according to claim 6, wherein said second connecting member has a cross section whose length in a third direction from said hole to said discharge port is longer than the length in a fourth direction substantially perpendicular to said third direction, said cross section being shaped like a curve on said hole side.
- 10. A heat sink according to claim 9, wherein said second connecting member has a substantially elliptical cross section.
- 11. A heat sink according to claim 6, wherein said first and second connecting members disposed at a part where said first and second spaces overlap each other are located at respective positions overlapping each other.
- 12. A heat sink according to claim 1, wherein an upper face of said second planar member has a heating element mounting area for mounting a heating element to be cooled,
said hole being disposed at a position opposing said heating element mounting area.
- 13. A heat sink according to claim 1, wherein a plurality of said holes are provided.
- 14. A heat sink according to claim 1, wherein said hole has a sufficiently small cross section for injecting said fluid into said second space.
- 15. A semiconductor laser apparatus comprising:
the heat sink according to claim 1; and a semiconductor laser mounted on an upper face of said second planar member of said heat sink.
- 16. A semiconductor laser apparatus according to claim 15, wherein said semiconductor laser has a plurality of laser emission points arranged in a predetermined direction,
said predetermined direction being oriented so as to become substantially parallel to said upper face of second planar member.
- 17. A semiconductor laser stack apparatus comprising first and second heat sinks and first and second semiconductor lasers;
said first and second heat sinks being the heat sink according to claim 1; said first semiconductor laser being held between an upper face of said second planar member of said first heat sink and a lower face of said first planar member of said second heat sink; said second semiconductor laser being mounted on said upper face of second planar member of said second heat sink.
- 18. A semiconductor laser stack apparatus according to claim 17, wherein said first and second semiconductor lasers have a plurality of laser emission points arranged in a predetermined direction, said predetermined direction being oriented so as to become substantially parallel to said upper faces of first and second planar members.
- 19. A semiconductor laser stack apparatus according to claim 17, further comprising:
a supply tube connected to both of said supply port of said first heat sink and said supply port of said second heat sink; and a discharge tube connected to both of said discharge port of said first heat sink and said discharge port of said second heat sink.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-231575 |
Aug 1998 |
JP |
|
RELATED APPLICATION
[0001] The present application is a continuation-in-part application of PCT application No. PCT/JP99/01968 filed on Apr. 13, 1999, designating U.S.A. and now pending.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
PCT/JP99/01968 |
Apr 1999 |
US |
Child |
09773509 |
Feb 2001 |
US |