BACKGROUND
1. Technical Field
The present invention relates to a heat sink assembly which is mistake proof in assembly.
2. Description of Related Art
A typical heat sink assembly includes a motherboard having a plurality of threaded holes, and a heat sink fastened to the motherboard. Screws are threadedly engaged in the screw holes to secure the heat sink apparatus to the motherboard to dissipate heat generated by a heat generating component, such as a CPU on the motherboard. Since the screws of the heat sink apparatus are arranged symmetrically, the heat sink apparatus can be secured to the motherboard in various orientations, such that the heat sink apparatus may be attached incorrectly, thereby impairing heat dissipation efficiency.
Therefore, a mistake proof heat sink assembly is desired to overcome the above-described shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of an embodiment of a heat sink assembly, the assembly including a motherboard, a heat sink apparatus, and a mistake-proof member;
FIG. 2 is another view of the mistake-proof member of FIG. 1;
FIG. 3 is an assembly view of FIG. 1;
DETAILED DESCRIPTION OF THE EMBODIMENTS
Referring to FIG. 1, an embodiment of a heat sink assembly includes a motherboard 10, a heat sink apparatus 20 configured for dissipating heat generated by a heat generating component on the motherboard 10, and a mistake-proof member 30.
The heat sink apparatus 20 includes four supporting pieces 22 at four corners thereof and four screws 24 attached to distal ends of the supporting pieces 22. A mounting hole 26 is defined in one of the four supporting pieces 22 for receiving the mistake-proof member 30. Four screw holes 12 are defined in the motherboard 10 corresponding to the screws 24 of the heat sink apparatus 20. A mistake-proof hole 14 is defined in the motherboard 30 corresponding to the mounting hole 26 for receiving the mistake-proof member 30.
Referring to FIG. 2, the mistake-proof member 30 includes a post 32, a cap 34 formed at a top of the post 32, and a ring 36 formed under the cap 34. A distance between the cap 34 and the ring 36 is approximately equal to a thickness of the supporting piece 22. A groove 341 is defined in the cap 34 and an upper portion of the post 32 for increasing the elasticity of the cap 34. The cap 34 is frustoconical shaped such that a diameter of a top side is less than a diameter of a bottom side. A diameter of the mounting hole 26 greater than the diameter of the top side of the cap 34, but less than that of the bottom side of the cap 34 and the outer diameter of the ring 36. The cap 34 is symmetrically divided by the groove 341.
Referring to FIG. 3, in assembly, the mistake-proof member 30 is attached to the mounting hole 26 of the supporting piece 22. The top side of the cap 34 of the mistake-proof member 30 is inserted into the mounting hole 26 upwardly from a back side of the supporting piece 22 toward a top side of the supporting piece 22. The cap 34 is elastically compressed in the mounting hole 26 and returns to its original shape and size when the bottom side of the cap extends through the mounting hole 26 and resists against the top side of the supporting piece 22. The ring 36 of the mistake-proof member 30 is resisted against the back side of the supporting piece 22. The mistake-proof member 30 is aligned with the mistake-proof hole 14 and the screws 24 of the heat sink apparatus 20 are secured in the screw holes 12 of the motherboard 10 in only one configuration with the mistake-proof member 30 engaged in the mistake-proof hole 14.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.