Heat sink clip assembly

Information

  • Patent Grant
  • 6307748
  • Patent Number
    6,307,748
  • Date Filed
    Monday, October 16, 2000
    24 years ago
  • Date Issued
    Tuesday, October 23, 2001
    23 years ago
Abstract
A clip assembly (30) includes a nail member (40), a sleeve member (60), and a spring (50) around the sleeve member. The nail member includes a cap (42), a post (44), a neck (46) and a cone-shaped barb (48). A pair of wedges (442) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (62) for receiving the nail member, and a pair of rectangular slots (66) for receiving the wedges. A circumferential shoulder (68) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (72) of the sleeve member defines cutouts (722), thereby also forming deformable fingers (723). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a clip assembly, and particularly to a clip assembly which readily attaches a heat sink to an electronic device.




2. The Related Art




A heat sink is usually mounted in contact with an electronic device for removing heat therefrom. Various means have been used for attaching heat sinks to be in intimate thermal contact with electronic devices. Common means include using adhesives or clips. However, coefficients of thermal expansion of heat sinks are generally different from coefficients of thermal expansion of adhesives. Thus, a heat sink fastened by adhesive is easily separated from the electronic device during transportation. Moreover, it is extremely difficult to remove such heat sink from the electronic device. This makes repair or replacement of the components impractical.




Conventional clips also pose problems for manufacturers. For example, referring to

FIGS. 10 and 11

, a conventional heat dissipating assembly comprises a heat sink


2


and a plurality of T-shaped clips


1


. Each of two sides of the heat sink


2


defines a slot


22


therein. Each clip


1


comprises a cross arm


12


, and a leg


14


depending from a middle portion of the cross arm


12


. The distal end of the leg


14


defines a catch


16


. In assembly, the cross arm


12


of each clip


1


is received in the slot


22


of the heat sink


2


. The heat sink


2


is placed on an electronic device


3


, with the catch


16


of the clip


1


engaging with a lower portion of the electronic device


3


.




However, this conventional clip assembly has many shortcomings. First, the clip must be manufactured to a given size required by the design of a particular heat sink. Every differently sized heat sink requires a new differently sized clip. Secondly, the engaging force of the clip is limited. Thirdly, the process of inserting the clip into the slot requires great precision of movement. The process often results in deformation or even breakage of the clip. Fourthly, the clip does not prevent the heat sink from moving in a lateral direction relative to the electronic device. U.S. Pat. No. 5,730,210 discloses a single fastening bolt cooperating with a spring to fasten a heat sink to the CPU on the mother board. This type design also requires unconformable laborious forcible insertion to have the inherent expansion head of the bolt extend through the fixing hole in the mother board for retention.




A new heat sink clip assembly is desired to overcome the above-mentioned problems of the prior art.




SUMMARY OF THE INVENTION




Accordingly, an object of the present invention is to provide a clip assembly for a heat sink which readily attaches the heat sink to an electronic device.




Another object of the present invention is to provide a clip assembly for securely attaching a heat sink to an electronic device.




To achieve the above-mentioned objects, a clip assembly in accordance with the present invention comprises a nail member, a sleeve member, and a spring around the sleeve member. The nail member includes a cap, a post, a neck, and a cone-shaped barb at a bottom end. A pair of wedges is formed on an outer surface of the post. The sleeve member is cylindrical. An upper main portion of the sleeve member defines a central bore for receiving the nail member, and a pair of rectangular slots for receiving the wedges of the nail member. A circumferential shoulder is formed on the main portion, for abutting against a bottom surface of a heat sink. A lower portion of the sleeve member defines cutouts, thereby also forming deformable fingers. The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.




Other objects, advantages and novel features of the present invention will be apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings, in which:











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is an exploded view showing a pair of clip assemblies in accordance with the present invention, for attaching a heat sink to an electronic device mounted on a printed circuit board;





FIG. 2

is a perspective view of a nail member of the clip assembly of the present invention;





FIG. 3

is a perspective view of a sleeve member of the clip assembly of the present invention;





FIG. 4

is a cross-sectional view of

FIG. 3

, taken along line IV—IV;





FIGS. 5-8

are similar to

FIG. 3

, but showing the nail member inside the sleeve member at various stages of insertion of the nail member into the sleeve member;





FIG. 9

is a partial side view of the components of

FIG. 1

assembled together;





FIG. 10

is a partly exploded view of conventional clips for a heat sink; and





FIG. 11

is an assembled side view of FIG.


10


.











DESCRIPTION OF THE PREFERRED EMBODIMENT




Referring to

FIG. 1

, a pair of clip assemblies


30


of the present invention is used to attach a heat sink


80


to an electronic device


90


mounted on a printed circuit board (PCB)


100


. A pair of fixing holes


102


is defined in the PCB


100


, with the electronic device


90


positioned between the fixing holes


102


. The heat sink


80


is generally rectangular in the embodiment illustrated. The heat sink


80


comprises a chassis


82


, a plurality of fin members


84


, and a pair of fastening ears


86


. The ears


86


extend outwardly from respective diagonally opposite corners of the chassis


82


. Each ear


86


defines a fastening hole


88


therein, corresponding to the fixing hole


102


of the PCB


100


.




Referring also to

FIG. 2

, the clip assembly


30


includes a nail member


40


, a spring


50


, and a sleeve member


60


. The nail member


40


includes a flat cap


42


, a post


44


, a neck


46


and a cone-shaped barb


48


, all of which are coaxial. The post


44


depends from the cap


42


, and defines a pair of oppositely disposed wedges


442


on a circumferential surface thereof (only one wedge visible in FIG.


2


). Each wedge


442


has a generally triangular profile, whereby an uppermost portion of the wedge


442


is wider than a lowermost portion of the wedge


442


. The neck


46


depends from the post


44


, and the barb


48


depends from the neck


46


. The diameter of the neck


46


is less than that of the post


44


.




Referring also to

FIGS. 3 and 4

, the sleeve member


60


is generally cylindrical. The sleeve member


60


comprises an upper main portion


61


, and a lower portion


72


beneath the main portion


61


. Alongitudinal central bore


62


is defined throughout the main portion


61


. The bore


62


has a diameter dimensioned to slidingly receive the cone-shaped barb


48


and the post


44


of the nail member


40


. A pair of opposing cutouts


64


is defined in a top surface of the main portion


61


. A pair of opposing rectangular slots


66


is defined in an outer circumferential surface of the main portion


61


, below and in alignment with the cutouts


64


. A circumferential external shoulder


68


is formed in the main portion


61


beneath the rectangular slots


66


. The lower portion


72


defines a plurality of axial cutouts


722


in a bottom surface thereof. The width of each cutout


722


is less than the diameter of the bore


62


. Thus the remaining sections of the lower portion


72


form a plurality of fingers


723


. An inner surface of each finger


723


is shaped so that the finger


723


is elastically deformable when contacted by the barb


48


and the neck


46


of the nail member


40


. The external diameter of the lower portion


72


is slightly less than the diameter of each fixing hole


102


of the PCB


100


.




Referring also to

FIGS. 5 and 6

, in pre-assembly, the sleeve members


60


are inserted upwardly into the corresponding fastening holes


88


of the heat sink


80


. The shoulder


68


of each sleeve member


60


abuts against a bottom surface of each fastening ear


86


of the heat sink


80


. Each spring


50


is placed over its corresponding sleeve member


60


, such that a bottom end of the spring


50


abuts a top surface of the fastening ear


86


. Each nail member


40


is downwardly inserted into the bore


62


of the corresponding sleeve member


60


. The wedges


442


of the nail member


40


are guided into correct orientation by the cutouts


64


of the sleeve member


60


(see FIG.


5


). The nail member


40


is manually depressed with compression of the corresponding spring


50


so that the wedges


442


elastically deform within the bore


62


of the sleeve member


60


and thereupon the wedges


442


enter into the rectangular slots


66


of the sleeve member


60


. The compressed spring


50


exerts upward force on the cap


42


of the nail member


40


. Thus the wedges


442


of the nail member


40


move upwardly to abut the main portion


61


of the sleeve member


60


at an upper limit of the rectangular slots


66


of the sleeve member


60


(see FIG.


6


). Therefore, the clip assembly


30


including the nail member


40


, the sleeve member


60


and the spring


50


, can be pre-assembled to the heat sink


80


with tension.




Referring also to

FIGS. 7-9

, in assembly, the heat sink


80


is placed on a top surface of the electronic device


90


. The lower portion


72


of each sleeve member


60


is received in the corresponding fixing hole


102


of the PCB


100


. Each nail member


40


is then manually depressed to move downwardly, thus wedges


442


being disengaged from the sleeve member


60


. Thus, without such upward engagement from the wedges


442


the sleeve member


60


freely moves downwardly due to gravity until the shoulder


68


of the sleeve member


60


abuts against the top surface of the PCB


100


. The depressed nail member


40


continuously moves downward and forces its barb


48


thereof to enter into the lower portion


72


of the sleeve member


60


. As the barb


48


progressively passes down inside the lower portion


72


, it contacts the fingers


723


thereby causing the fingers


723


to elastically expand outwardly (see FIG.


7


). Once the barb


48


has passed beyond the fingers


723


, the fingers


723


elastically collapse inwardly and contact the post


44


of the nail member


40


. The fingers


723


are thereby still retained in elastically expanded positions by the post


44


.




During depression of the nail member


40


, the spring


50


is further compressed and exerts more upward force on the cap


42


of the nail member


40


. Therefore, after the barb


48


passes beyond the fingers


723


, the manual depression force is removed from the nail member


40


. The upwardly exerted forces generated by the spring


50


will move the nail member


40


and the associated sleeve member


60


upwardly because there is an engagement between the barb


48


and the bottom ends of the fingers


723


. This common upward movement continues until the outwardly expanded fingers


723


abuts against the bottom edge of the fixing hole


102


. Naturally, the upward movement of the sleeve member


60


results in the shoulder


68


distanced from the top surface of the printed circuit board


100


as shown in FIG.


9


. Under this situation, the compressed springs


50


provide elastic force for firmly retaining the heat sink


80


to the electronic device


90


.




In disassembly, the cap


42


of each nail member


40


is gripped and pulled upwards to forcibly disengage abutment between the barb


48


and the bottom ends of the fingers


723


. The barb


48


of the nail member


40


causes the fingers


723


of the sleeve member


60


to elastically expand outwardly. The barb


48


then passes beyond the fingers


723


, thereby allowing the fingers


723


to elastically collapse back inwardly to their original unexpanded positions. Each sleeve member


60


is then easily removed from the fixing hole


102


of the PCB


100


. Then the cap


42


of each nail member


40


is again gripped and pulled upwards. The wedges


442


of the nail member


40


elastically deform within the bore


62


of the sleeve member


60


above the rectangular slots


66


. The wedges


442


pass into the cutouts


64


of the sleeve member


60


. Each nail member


40


and spring


50


is then easily removed from the sleeve member


60


. Each sleeve member


60


is then readily removed from the fastening hole


88


of the heat sink


80


.




The invention allows easy assembling between the printed circuit board and the pre-assembled clip assembly and heat sink with less insertion force. Additionally, the invention provides two stages assembling between the nail member


40


and the sleeve member


60


wherein in the first stage the nail member


40


is in a high position relative to the sleeve member


60


with the spring


50


less compressed when the clip assembly


30


is assembled to the heat sink


80


where the sleeve member


60


is engaged with the bottom surface of the heat sink


80


, while in the second stage the nail member


40


is in a low position relative to the sleeve member


60


with the spring


50


more compressed when the clip assembly


30


with the associated heat sink


80


is further assembled to the printed circuit board


100


where the sleeve member


60


is engaged with the bottom surface of the printed circuit board


100


.




It is understood that the invention may be embodied in other forms without departing from the spirit thereof. For example, the wedges


442


of the nail member


40


may engage the sleeve member


60


in both upward and downward directions for retaining the nail member


40


to the sleeve member


60


in position. Also as described earlier, the shoulder


68


provides an abutment against the top surface of the printed circuit board


100


during depression of the nail member


40


, thus assuring no drop of the sleeve member


40


from the fixing hole


102


and allowing the barb


48


to further pass the bottom end of the fingers


723


. Therefore, the present example and embodiment are to be considered in all respects illustrative and not restrictive, and the invention is not to be limited to the details given herein.



Claims
  • 1. A clip assembly comprising:a sleeve member comprising a central bore, a lower portion defining a plurality of cutouts forming a plurality of expandable fingers, and a shoulder formed on an outer surface of the sleeve member adapted to abut against a heat sink; a nail member received in the bore of the sleeve member, the nail member comprising a cap, a post depending from the cap, a neck depending from the post, and a barb formed at a bottom end of the post, wherein the barb and the neck are adapted to expand the fingers of the sleeve member; and an elastic member fitting over the sleeve member, and acting between the nail member and the sleeve member.
  • 2. The clip assembly as described in claim 1, wherein at least a slot is defined in a circumferential surface of the sleeve member.
  • 3. The clip assembly as described in claim 2, wherein at least a wedge is defined on a circumferential surface of the post of the nail member for elastically entering the at least a slot.
  • 4. The clip assembly as described in claim 3, wherein at least a cutout is defined in a top surface of the sleeve member corresponding to the at least slot.
  • 5. The clip assembly as described in claim 1, wherein the barb of the nail portion is generally cone-shaped.
  • 6. The clip assembly as described in claim 1, wherein the neck of the nail member has a diameter less than that of the post of the nail member.
  • 7. The clip assembly as described in claim 1, wherein the elastic member is a spring.
  • 8. A pre-assembled heat sink assembly comprising:a heat sink defining a fastening hole; at least a clip assembly including: a sleeve member defining a central bore, a lower portion defining a plurality of outwardly expandable fingers, an upper portion extending through the fastening hole, and a shoulder formed between the upper portion and the lower portion; a nail member received within the bore of the sleeve member, said nail member including a cap, a post extending downwardly from the cap, a bottom portion positioned below the post adapted to move downwardly to engageably expand the corresponding fingers; and an elastic member fitting over the sleeve and positioned between the cap and a top surface of the heat sink, and adapted to exert a resilient force along an axial direction of the clip assembly; wherein an engagement is formed between the nail member and the sleeve member for preventing the sleeve member from moving downwardly away from the nail member, and thus the shoulder abuts against a bottom surface of the heat sink by means of said elastic member.
  • 9. The assembly as described in claim 8, wherein a barb is formed around a distal bottom end of said nail member which is adapted to engage the fingers in the axial direction.
  • 10. The assembly as described in claim 8, wherein said engagement is performed by wedges of the nail member.
  • 11. An electrical assembly comprising:a pre-assembled heat sink assembly including; a heat sink defining a fastening hole; at least a clip assembly pre-assembled to the heat sink, said clip assembly including: a sleeve member extending through the fastening hole and out of a bottom surface of the heat sink; a nail member coaxially moved relative to the sleeve member with a cap at a top portion and means for upwardly engaging the sleeve member below said cap to have the nail in an upper position with regard to the sleeve member; and an elastic member compressed and positioned between the cap and a top surface of the heat sink so as to hold the clip assembly stable in position with regard to the heat sink.
  • 12. The assembly as described in claim 11, wherein said sleeve member further includes expandable fingers around a lower portion thereof, which is adapted to be outwardly expanded by a bottom portion of the nail member.
  • 13. The assembly as described in claim 12, wherein a printed circuit board with a fixing hole is positioned below the heat sink with an electronic device thereon confronting the bottom surface of the heat sink.
  • 14. The assembly as described in claim 13, wherein the fingers extend through the fixing hole and are expanded to abut against a bottom edge of said fixing hole, where the nail member is in a lower position with regard to the sleeve member.
  • 15. A two-stage electrical assembly comprising:a pre-assembled heat sink assembly including: a heat sink with a fastening hole; at least a clip assembly pre-assembled to the heat sink, said clip assembly including: a sleeve member with a coaxially moveable nail member and a spring deflectable along the same axial direction; said assembly defining a first stage assembling in which the nail member is in a high position relative to the sleeve member with the spring less deflected when the clip assembly is pre-assembled to the heat sink where the sleeve member extends through the fastening hole and is engaged with a bottom surface of the beat sink.
  • 16. The assembly as described in claim 15, wherein a printed circuit board with an electronic device thereon and a fixing hole therein is positioned below the pre-assembled heat sink assembly under a condition that the bottom surface of the heat sink confronts said electronic device, and a second stage assembling is defined thereof in which the nail member is in a low position relative to the sleeve member with the spring more deflected when the pre-assembled heat sink assembly is further assembled to the printed circuit board where the sleeve member fewer extends through the fixing hole and is engaged with a bottom surface of the printed circuit board.
  • 17. A method for assembling a heat sink to a printed circuit board, comprising the steps of:providing a heat sink defining a fastening hole therein; providing at least a clip assembly including a sleeve member, a nail member and a spring; positioning the sleeve member extending through the fastening hole and below a bottom surface of the heat sink; positioning the nail member coaxially moveable with regard to the sleeve member with means for temporarily holding the sleeve member in a higher position relative to the heat sink; and positioning a spring between a top surface of the heat sink and the nail member to exert a first resilient force to hold both the nail member and the engaged sleeve member in a tensional vertical manner relative to the heat sink so as to pre-assemble the clip assembly to the heat sink.
  • 18. The method as described in claim 17, further including steps of:providing a printed circuit board with an electronic device thereon below the heat sink, said printed circuit board defining therein a fixing hole in alignment with the fastening hole; and downwardly depressing the nail member to have fingers, which are formed on a bottom portion of the sleeve member, extend below the printed circuit board and outwardly expanded to abut against a bottom edge of the fixing hole wherein the sleeve member is in a lower position where the spring exerts a second resilient force, which is larger than the first resilient force, to press the heat sink against the electronic device.
  • 19. A pre-assembled heat sink assembly comprising:a heat sink defining a fastening hole; at least a sleeve member upwardly installed to the heat sink from a bottom side of the heat sink, said sleeve member including a lower portion with a plurality outwardly expandable fingers positioned below the bottom side of the heat sink, and an upper portion extending upwardly into the fastening hole and further above an upper side of the heat sink; a nail member coaxially downwardly installed into the sleeve member from the upper side of the heat sink, said nail member and said sleeve member being engaged with each other along an axial direction; and an elastic member positioned over the sleeve member and between the upper side of the heat sink and a top portion of the nail member.
  • 20. A pre-assembled heat sink assembly comprising:a heat sink defining a fastening hole; at least a sleeve member including a lower portion with a plurality outwardly expandable fingers positioned below a bottom surface of the heat sink, and an upper portion extending upwardly into the fastening hole and further above an upper surface of the heat sink; a nail member coaxially installed into the sleeve member, said nail member including a top portion and a bottom portion, said nail member and said sleeve member being engaged with each other along an axial direction; and an elastic member positioned over the sleeve member and between the upper surface of the heat sink and the top portion of the nail member; wherein both the sleeve member, the nail member and the elastic member are pre-assembled to the heat sink before assembled to a printed circuit board having therein a fixing hole in alignment with the fastening hole, and the bottom portion of the nail member is adapted to engageably expand the corresponding fingers outwardly for latchable engagement with a bottom edge of said fixing hole of the printed circuit board when the nail member is depressed to move deep downwardly relative to the sleeve member.
  • 21. The assembly as described in claim 20, wherein said sleeve member further includes a shoulder below the bottom surface of the heat sink, and said shoulder is adapted to abut against a top surface of the printed circuit board when said nail member is depressed to move downwardly relative to the sleeve member.
  • 22. The assembly described in claim 21, wherein said shoulder abuts against the bottom surface of the heat sink before the pre-assembled heat sink is assembled to the printed circuit board.
Priority Claims (1)
Number Date Country Kind
089206473 Apr 2000 TW
US Referenced Citations (6)
Number Name Date Kind
5384940 Soule et al. Jan 1995
5730210 Kou Mar 1998
5748446 Feightner et al. May 1998
5757621 Patel May 1998
5901039 Dehaine et al. May 1999
6252768 Lin Jun 2001