Patent Application
20060215715
The present invention relates to a heat sink for cooling off a heating element by causing a refrigerant to flow, a laser module, a laser apparatus and a laser processing apparatus, and in particular, to a heat sink, a laser module, a laser apparatus and a laser processing apparatus suitable for cooling off a laser diode.
In a laser diode that is used as a pumping source for Nd:YAG laser or as a light source for direct processing therewith, the conversion efficiency from electricity to light is 50% or so. Where the laser diode is used as a light source for Nd:YAG laser, heat equivalent to the output of laser light is generated. Generally, since a laser diode causes a problem of a lowering in durability and conversion efficiency as the temperature increases, an increase in temperature is suppressed by attaching a heat sink having high cooling capacity. Also, in recent years, a laser having high output has been demanded for welding of metals and machining thereof. In line therewith, high output of a laser diode has been advanced, and such a laser diode has been developed, in which an active area where a laser beam is generated is formed like an array in the lateral direction. The size of such a laser diode array is usually 10 mm in width and 1.0 through 1.5 mm in the resonator length, and 100 through 150 μm in thickness, and also the output is 20 through 60 W or so. Since the wavelength of a laser beam outputted from the laser diode array changes according to the temperature, it is necessary that the temperature in the lateral direction is kept constant in order to generate light of a further uniform wavelength. Also, it is preferable that the laser diodes are cooled off to a further low temperature in order to prolong the service life of the laser diodes.
Therefore, a heat sink by which a high-output laser diode array is efficiently cooled off to a uniform temperature has been examined. Such a heat sink in which a refrigerant is caused to flow is used as a heat sink for the laser diode array, and for example, a heat sink has been proposed, in which two flow channels having, respectively, independent inlet ports and outlet ports on the same plane are provided. (For example, refer to Japanese Unexamined Patent Publication No. Hei-8-139478 (Pages 2 and 3 and FIG. 1)). The heat sink improves the thermal conversion efficiency and a temperature uniformity of a lower area of the plane contacted with the laser diode array by forming a bent portion in a flow channel in the lower area.
In addition, such a heat sink has been proposed, in which channels into which a refrigerant flows are structured to be vertically two-layered by stacking three to five heat radiating plates made of a metallic material having high heat conductivity and joining the same to each other (For example, refer to U.S. Pat. No. 5,105,429, U.S. Pat. No. 5,105,430, and German Unexamined Patent Publication No. 4315580). The flow channels formed vertically two-layered are connected with each other by means of a plurality of holes or micro-channels, which are formed at the lower area of a plane contacted with a laser diode array, and are made into a single flow channel. Further, another heat sink has been proposed, which has a two-layered flow channel by which a refrigerant is supplied from the flow channel positioned at the lower part thereof and the refrigerant is discharged from the flow channel positioned at the upper part thereof, and is structured so that a refrigerant is ejected from the flow channel positioned at the lower part to the flow channel positioned at the upper part in an area contacted with a laser diode array (For example, refer to Japanese Unexamined Patent Publication No. Hei-8-139479, Pages 2 and 3, and FIG. 1 and FIG. 2)
In the heat sink having above-described stacking structure, a heat sink having such a structure has been proposed, in which a refrigerant injected from an inlet port is separated into a plurality of flow channels and is led to the lower part area of the plane contacted with a laser diode array through said flow channels at a uniform temperature and a uniform flow rate, and is further led into a plurality of flow channels formed on the upper-layered heat radiating plate via flow channels formed in said lower part area and communicating the upper- and lower-layered flow channels in the vertical direction, and is further led from the upper-layered flow channels to the discharge outlet (For example, refer to Japanese Unexamined Patent Publication No. Hei-10-209531). In the prior arts, such a method has been proposed, which forms flow channels by means of chemical etching. Also, still another heat sink has been proposed, which is provided with fins for leading a refrigerant supplied from the input inlet to vertically connected flow channels under uniform pressure (For example, refer to International Publication No. 00/11922 Pamphlet, Pages 5 through 7, FIGS. 2A through 2C). Still further, such a heat sink has been proposed, which is provided with an intermediate layer to solve problems of a pressure loss and a lowering in flow rates resulted from stacking of respective heat radiating plates (For example, refer to Japanese Unexamined Patent Publication No. 2001-160649, Pages 3 through 5, and FIG. 1)
However, demand for high output lasers have increased, and the number of laser diodes used therefor has been increased. Cost reduction and high reliability have been required with respect to heat sinks for cooling off the laser diodes. However, the prior art heat sinks have the following problems and shortcomings.
Since, in flow channels in the conventional heat sinks, the direction of flow of a refrigerant is radically changed, and the diameter thereof is radically made thin, there is a problem in that the pressure loss is great when the refrigerant flows in the flow channels. In particular, in micro-channels, micro-slits, or a capillary tubing array of the flow channels used for vertical communication of the two-layered structure, the pressure loss of the refrigerant is increased. If the pressure loss of the refrigerant is large, the load of the pressure applied into the flow channels is accordingly increased. Therefore, a possibility of refrigerant leakage is increased. In addition, in applications using a plurality of heat sinks, since a high performance pump for sending out a refrigerant is required, the costs thereof are increased. Further, if the shape of the flow channels is complicated, the flow velocity is made slow at portions where the flow channel is widened in width and is bifurcated into several flow channels, and there is another problem in that the cooling capacity is lowered. Although there is means for improving the flow velocity by thinning the flow channel, the pressure loss is increased as described above. Further, in a flow channel having a complicated shape, which is provided with bifurcated and confluent portions, it is not preferable that there is a danger of a refrigerant leaking out due to joining defectives at the joining surfaces of the respective layers, and the design thereof is complicated.
Still further, a majority of the prior art heat sinks have a lamination structure having flow channels for flowing a refrigerant in the upper layer, the lower layer and in the intermediate layer disposed therebetween. When producing a heat sink of the lamination structure, since it is necessary that three to five heat radiating plates are stacked and jointed together, the costs thereof are further increased in comparison with a mono-layered structure. However, if the flow channel is formed of a mono-layered structure, no heat sink having a sufficient cooling capacity is obtainable. Therefore, Patent Document 1 has proposed a heat sink having two independent bent flow channels on the same plane, wherein since the heat sink is provided with an inlet port and an outlet port, respectively, means for supplying a refrigerant is complicated. Also, since the flow channel is bent, there is a problem in that the pressure loss of a solvent is increased.
Further, where water is used as a refrigerant, there is another problem in that corrosion occurs in the flow channel. Where a heat sink is formed of a metallic material, mixture of oxygen in water that is a refrigerant causes corrosion. Also, where a heat sink is concurrently used as an electrode for driving a heating element, a large current is flown into the heat sink, wherein durability is required for galvanic corrosion. However, it is a fact that no consideration is taken for any corrosion in the conventional heat sinks.
It is therefore an object of the present invention to provide a heat sink, a laser module, a laser apparatus and a laser processing apparatus, which can be produced at low cost and have excellent heat efficiency and reliability.
A heat sink according to a first aspect of the invention is a heat sink constructed by stacking two heat radiating plates, wherein one heat radiating plate includes a refrigerant flow channel composed of a recess portion or a groove formed on an overlapping plane with the other heat radiating plate and a singular or a plurality of projections provided so as to be dispersed in a specified area of the refrigerant flow channel; and at least one of the two heat radiating plates is provided with a pair of openings that become an inlet port of a refrigerant and an outlet port thereof, wherein flows of the refrigerant are disturbed by the projections.
In the invention, turbulent flows are brought about in flows of the refrigerant flowing in the flow channels by the refrigerant being brought into contact with the projections. If a turbulent flow occurs in the flow of the refrigerant, mixture of the refrigerant is carried out by vortex motions, and transfer of heat from the heat radiating plate to the refrigerant is accelerated, wherein the cooling capacity thereof is increased in comparison with a laminar flow. In addition, since the heat sink according to the present invention is composed of two heat radiating plates, there are few joining portions, wherein the ratio of generation of refrigerant leakage due to joining defectives can be reduced, and it is possible to reduce the production costs thereof.
It is preferable that the specified area is provided at a position adjusted to an area to which a heating element to be cooled off is thermally connected.
It is preferable that the cross sectional plane of the projections is gradually made smaller from the bottom surface of the flow channel upward or from the upper surface of the flow channel downward. In the present invention, by gradually making the cross sectional plane of the projections smaller toward the upper surface of the flow channel or toward the bottom surface thereof, an effect of a refrigerant flowing in the flow channel being agitated in the up and down direction can be brought about, wherein a cooling effect can be improved.
Also, it is preferable that a part of the outer edge of the cross sectional plane of the projection is formed to be curved. Further, it is preferable that the shape of the cross sectional plane of the projections is circular, elliptical or streamline-shaped to the flows of the solvent. In the present invention, by making the shape of the projections circular, elliptical or streamline-shaped to the flows of the solvent, it is possible to further suppress the pressure loss resulting from turbulent flows brought about by the projections in comparison with a case where the cross sectional plane is rectangular or polygonal.
It is preferable that the projections are contacted with the other heat radiating plate. In the present invention, by bringing the projections into contact with the other heat radiating plate, it becomes possible for the two heat radiating plates to diffuse heat via the projections, and an agitating effect of the refrigerant can be improved, wherein the cooling effect can be improved.
It is preferable that one heat radiating plate described above has a pair of flow channels shaped so that, after a refrigerant introduced from the inlet port is divided into the flow channels and passes through the specified area, the refrigerant is discharged from the outlet port, and the specified area is provided with a separation member for preventing the refrigerant from confluence with each other. In the present invention, by providing the separation member, it is possible to prevent the heat conversion efficiency from being lowered due to mixing of refrigerant, which is heated by the heating element, in the specified area.
It is preferable that the flow channel includes the first area contacted with the inlet port and the second area between the first area and the specified area, and the width of the second area is narrower than that of the first area. In the present invention, by making the width of the flow channel contacted with the specified area narrower than that of the flow channel in the upstream thereof, it is possible to accelerate the velocity of the refrigerant flowing into the specified area, wherein it is possible to improve the cooling efficiency.
It is preferable that at least a part of the inner surface of the flow channel is formed to be curved. In the invention, since the inner surface of the flow channel is formed to be curved, turbulent flows generated outside the specified area can be suppressed, and it is possible to prevent the velocity from being lowered and to prevent a pressure loss.
A refrigerant flow channel having the same pattern as at least a part of the refrigerant flow channel formed in one heat radiating plate described above may be formed on the other heat radiating plate, so that the sectional area of the flow channel is increased, and the pressure loss of the flow channel can be reduced, thereby the cooling efficiency can be improved.
In addition, it is preferable that the flow channels are formed by a chemical etching method. In the present invention, if the chemical etching method is employed, for example, masking is given to the heat radiating plates and the heat radiating plates are immersed in an etching solution. Thereby, it is possible to form flow channels having the same depth at one time. As a result, it becomes easy to facilitate curving of the inner surface of the flow channels.
It is preferable that the heat radiating plates are made of copper or a copper alloy, and a nickel-contained layer including nickel at a ratio of 70 wt % or more is formed on the surface with which the refrigerant in the flow channel is brought into contact. In the present invention, by forming the nickel layer, it is possible to prevent the heat radiating plates from corroding, and the reliability thereof can be improved. Further, it is possible to form the nickel-contained layer by a plating method.
If the heat radiating plates are made of copper or a copper alloy, and a copper oxide layer having a thickness of 50 nm or more is formed on the surface with which the refrigerant in the flow channel is brought into contact, the heat radiating plates can be prevented from corroding, and the reliability thereof can be improved. Still further, the copper-oxidized layer may be formed by heating the heat sink in an atmosphere including oxygen.
The heating element is, for example, a laser diode.
A laser module according to a second aspect of the present invention includes the heat sink, a setting fixture fixed on the heat sink, and a laser diode fixed on one heat radiating plate of the heat sink. In the present invention, by employing the heat sink having few joining portions, the ratio of generation of refrigerant leakage can be reduced, and it is possible to produce a laser module having high reliability at low cost.
It is preferable that the laser module includes a singular or a plurality of heat sinks, a through-hole penetrating through a singular or a plurality of heat sinks is formed at an area having no flow channel formed in the heat sinks, and, the heat sink is fixed at the setting fixture by a screw inserted into the through-hole and screwed in the setting fixture.
Also, it is preferable that a flow channel by which a refrigerant is supplied to the heat sink is formed in the setting fixture.
A laser apparatus according to a third aspect of the present invention includes the laser module and a laser rod which is excited by laser light oscillated by the laser module and oscillates laser light. In the present invention, it is possible to produce a laser apparatus having high reliability at low cost by employing the laser module.
A laser processing apparatus according to a fourth aspect of the present invention includes the laser module. In the present invention, it is possible to produce a laser processing apparatus having high reliability by employing the laser module.
A laser processing apparatus according to a fifth aspect of the present invention includes the laser apparatus. In the present invention, by employing the laser apparatus, it is possible to stably cool off the laser diode for a longer period of time, wherein the running costs thereof can be reduced.
FIGS. 5(a) through 5(c) are sectional views showing the shapes of the projections formed on the first heat radiating plate of a heat sink according to the first embodiment of the present invention, which correspond to the sectional view taken along the line B-B in
Hereinafter, a detailed description is given of heat sinks according to embodiments of the present invention with reference to the accompanying drawings. First, a description is given of a heat sink according to first embodiment of the present invention.
In the first heat radiating plate 1, two opening portions 3a and 3b which are made into an inlet port for injecting a refrigerant and an outlet port for discharging a solvent are formed at portions separated in the lengthwise direction of the first heat radiating plate 1. Also, a pair of flow channels 2 are formed from the opening portion 3b toward the opening portion 3b in the first heat radiating plate 1. The flow channels 2 are formed so as to be deviated from the opening portion 3b toward the long side of the first heat radiating plate 1, respectively, and extend toward the opening portion 3b along the long side of the first heat radiating plate 1, and reach the opening portion 3b, turning around in the vicinity of the short side of the first heat radiating plate 1. The flow channels 2 have a groove-like shape, the section of which is semi-circular, as shown in
Further, five projections 4 are provided at the left and right sides, respectively, in the vicinity of the turning-around portion of the flow channels 2. It is preferable that the sections of the projections 4 in the vertical direction with respect to the second heat radiating plate 6 and the first heat radiating plate 1 are made narrower and narrower from the first heat radiating plate 1 side toward the second heat radiating plate 6 side as shown in
Still further, a pattern whose shape is similar to the flow channel 2 formed in the first heat radiating plate 1 may be formed on the second heat radiating plate 6 as shown in
Next, a description is given of a method for producing a heat sink according to the present embodiment. A material of the heat radiating plate 1 and the heat radiating plate 2, which compose a heat sink according to the embodiment, is a plate-shaped metallic material such as copper, which has high thermal conductivity, and flow channels 2, projections 4 and separation rod 5, etc., are formed on the metallic plate. The metallic plate is made into the first heat radiating plate 1. With respect to a method for forming these elements, for example, after a copper plate is masked to the shapes of the flow channels 2, projections 4 and the separation rod 5, an isotropic chemical etching method is applicable. Next, the second heat radiating plate 6 shown in
Next, a description is given of operations of the heat sink according to the present embodiment, which is constructed as described above. In the heat sink according to the embodiment, a heating element 8 such as a laser diode array, etc., is jointed at the position of the heating element jointed portion 7 of the second heat radiating plate 6. The heating element jointed portion 7 is adjusted to an area where the projections 4 on the first heat radiating plate 1 are formed. Also, when cooling off the heating element 8, for example, the opening portion 3a is made into an inlet port and the opening portion 3b is made into an outlet port, wherein a refrigerant such as water is injected from the opening portion 3a. The injected refrigerant is divided into the left side and the right side and is flown into the flow channels 2. The velocity thereof is accelerated at a portion where the flow channels are made narrow immediately before the projections 4. After that, turbulent flows are brought about by the refrigerant being brought into collision with the projections 4, and the velocity of the refrigerant is locally accelerated, and at the same time, the refrigerant is mixed by vortex motions, wherein transfer of the heat quantity from the heat radiating plates to the refrigerant is accelerated. Thus, by increasing the mixing effect of the refrigerant by means of the projections, the heat can be efficiently taken away from the heat radiating plates contacted with the flow channels 2. In addition, the separation rod 5 assumes a role of rectifying the refrigerant flowing in the left and right flow channels. The refrigerant passed through the area where the projections 4 are formed is rectified by the separation rod 5 and is discharged from the opening portion 3b following the flow channels 2. In the heat sink according to the embodiment, the opening portion 3a is made into an inlet port and the opening portion 3b is made into an outlet port. However, the heat sink is not limited thereto, wherein the opening portion 3b may be made into an inlet port and the opening portion 3a may be made into an outlet port.
In the heat sink according to the present embodiment, the flow channel 2 is formed so as to be divided into the left side and the right side from the opening portion 3b, and the separation rod 5 is provided, which prevents that the left and right flow channels are brought into confluence with each other at the lower area of the heating element jointed portion 7 which is a thermal connection area with the heating element 8. By employing such a water channel structure, although the temperature of the refrigerant divided into the left side and the right side rises when the refrigerant passes through the heating element jointed area 7, the refrigerant is discharged from the opening portion 3b without being mixed. Therefore, the heat conversion efficiency of the refrigerant in the heat sink can be improved, and the cooling capacity can be improved.
Also, in the heat sink according to the present embodiment, a plurality of projections 4 are formed in a flow channel corresponding to the lower area of the heating element jointed area 7, and the sectional shape of the projections 4 are widened toward the end, wherein the agitating effect in the up and down direction of the refrigerant flowing through the flow channels can be accelerated, and the cooling capacity can also be improved. Since the tip end portions of the projections widening toward the end are brought into contact with the wall surface of the flow channels, it is possible to prevent the velocity from being lowered due to a decrease in the sectional area of the flow channels, and the agitating effect in the up and down directions of the flow channels can be further accelerated to increase the cooling effect. Further, since the heat sink is constructed so that the refrigerant is flown into the area where the projections are formed, once the sectional area of the flow channels following the hole into which the refrigerant is injected is made narrow, it is possible to accelerate the velocity of the refrigerant, wherein the cooling effect can be improved.
Further, in the heat sink according to the embodiment, since the flow channels 2 formed on the first heat radiating plate 1 are constructed as described above, it is possible to produce a heat sink only by joining two heat radiating plates each other, namely joining the first heat radiating plate 1, on which the flow channels 2 are formed, and the second heat radiating plate 6, which is plate-shaped. Therefore, the joining processes can be reduced in comparison with prior art process for producing heat sinks in which flow channels are formed in a plurality of layers, and the production costs can be reduced. In addition, since the number of joining points can be reduced in comparison with the prior art heat sinks, a possibility of water leakage due to defective joining can be lowered, and the reliability thereof can be improved.
Further, since turbulent flows of a refrigerant, which does not pertain to cooling of a heating element, increases the pressure loss, and reduces the velocity, it is necessary that such turbulent flows are reduced as much as possible. Therefore, in the heat sink according to the present embodiment, the sectional structure of the flow channels is not rectangular, but is shaped so as to be enclosed by a curved line. As a result, it is possible to suppress turbulent flows at bent portions. The effect can be obtained if only a part of the flow channels is enclosed by a curved line. Further, if the flow channels are formed by isotropic etching of metal, the heat sink having the flow channels, a part of which is made U-shaped and curved. It is possible to form flow channels 2 whose section is semi-circular, by joining a plate-shaped heat radiating plate 6 to the heat radiating plate 1, wherein turbulent flows produced in the bent portion of the flow channels 2 can be suppressed, and it is possible to suppress unnecessary pressure losses. Further, since the pressure loss of the flow channels is low, load applied onto the jointed boundary surface is reduced, and the long-term reliability of the heat sink for hydraulic pressure resistance can be increased.
Still further, by the above-described chemical etching, it becomes possible to inexpensively form the projections 4 each having a shape, whose section in the vertical direction to the heat radiating plate 1 and the heat radiating plate 6 widens toward the end, and the flow channels 2 in a short time. By the projections 4 being formed so as to have such a shape, the heat radiating plate 1 and the heat radiating plate 6 can be jointed together without etching the tip ends thereof.
Also, the heat sink according to the embodiment is effective for heating elements other than a laser diode such as an electronic device employing, for example, a silicon semiconductor or a compound semiconductor. Further, a refrigerant other than water may be used as the refrigerant used in the heat sink according to the present embodiment, and this is the same with respect to the following embodiments.
The position, orientation and quantity of the projections 4 according to the embodiment are not limited to such a construction as shown in
In addition, the second modified version shown in FIG. 7 is such that the projections 4 are disposed at the long side of the heat radiating plate. In the modified version, projections 23 to increase the velocity are provided separately from the projections 4 to accelerate turbulent flows. Also, the flow channels 2 in the modified version are completely separated by the separation rod 5 from each other, wherein a refrigerant injected from an inlet port is discharged from the outlet port without making any confluence in the flow channels 2. By employing such a shape for the flow channels, a long heating element can be handled.
Further, the third modified version shown in
The fourth modified version shown in
Next, a description is given of a heat sink according to a second embodiment of the present invention.
In a prior art heat sink, where copper or a copper alloy is used for the material of heat radiating plates and water is used as a refrigerant, there was a problem in that rust occurs in the heat sink. Therefore, in the heat sink according to the present embodiment, a plated layer is provided on the surface of the flow channels 2, and with the plated layer, the heat radiating plates are prevented from being rusted. It is preferable that, for example, the material of the plated layer is nickel where the material of the heat radiating plates is made of copper or a copper alloy. In particular, it is preferable that the nickel content in the plated layer is 70 wt % or more. If a metal other than nickel is used for the plated layer, there is a fear that corrosion is accelerated due to an effect of galvanic current with the copper. Since a difference in the ionizing tendency between copper and nickel is slight, no influence is given by the galvanic current, and since nickel is hard, it has excellent durability. Further, where the heat sink is used as a part of an electrode of a laser module, large current flows in the entirety of the heat sink. In this case, if there exists boundaries of different metals, corrosion is generated. Therefore, it is preferable that a plated layer is formed by a metal whose ionizing tendency is close to that of the material of the heat sink. For example, where the heat sink is made of copper or a copper alloy, it is preferable that the material of the plated layer is nickel.
A copper oxide layer may be formed instead of the plated layer. Although oxidization of copper is a kind of corrosion, an oxide layer formed on the surface of the copper becomes possible to suppress further inner oxidation in water, wherein corrosion can be prevented.
Next, a description is given of a heat sink according to a third embodiment of the present invention.
Next, a description is given of operations of the heat sink according to the present embodiment. The heat sink according to the embodiment is used in a stacked state.
In the heat sinks according to the present embodiment, the opening portions 3a and 3b are formed at both the first heat radiating plate 1 and the second heat radiating plate 6 and are passed through the heat sinks, whereby a plurality of heat sinks are stacked, and refrigerant can be circulated in a plurality of heat sinks. Such a stack-type heat sink is fixed at the base, to which a laser diode is jointed, and having flow channels for supplying a refrigerant, whereby the refrigerant is flown into these heat sinks. Further, an electrode for oscillating the laser diode is connected to the laser diode and the heat sinks, wherein a current is flown by utilizing the heat sinks as a part of the electrode, thereby causing the laser diode to oscillate. The heat sink according to the present embodiment has high cooling capacity, and since there are few jointed parts, the worry of a refrigerant leaking out is remarkably reduced. Therefore, it is possible to propose a laser module having high reliability at low cost.
The heat sinks according to the present embodiment are, respectively, made of two metal sheets, and it is possible that the thickness thereof is reduced to 11.0 mm where the cooling capacity is 0.4° C./W. The heat sinks can be made thinner than a prior art heat sink of a two-stage structure, and it is possible to obtain a cooling capacity equivalent thereto. Therefore, in a case of producing a stack type laser module in which heat sinks having a laser diode array jointed thereto are stacked in the vertical or longitudinal direction, it is possible to make the height thereof in the longitudinal direction lower than in cases of using prior art heat sinks, and light outputted from the respective laser diode arrays can be easily led to a single optical fiber.
Next, a description is given of a laser module according to a fourth embodiment of the present invention.
Next, a description is given of operations of a laser module according to the present embodiment. In the laser module according to the present embodiment, a heat sink 30 is fixed on a base 34 for injecting and discharging a refrigerant, and the refrigerant is flown into the heat sink 30 via a flow channel 2 provided in the refrigerant injecting/discharging base 34. In the laser module according to the present embodiment, since the heat radiating plate composing the heat sink 30 is made of a material having conductivity, the heat sink 30 can be used as a lower electrode, wherein a current is flown into the upper electrode and the lower electrode, and a laser can be oscillated.
Because the heat sink according to the second embodiment is employed for the laser module according to the embodiment, there is no worry about water leakage, and since a nickel layer is provided on the surface of the flow channel, the ratio of corrosion generation is low, wherein, even if a running test is carried out for more than 100 million hours being the service life of a laser diode, the cooling capacity of the heat sink does not deteriorate. Further, since it becomes unnecessary to replace the module due to an inconvenience of the heat sink, it is possible to reduce maintenance costs thereof to a large extent.
Next, a description is given of a laser apparatus according to a fifth embodiment of the present invention.
Next, a description is given of operations of the laser apparatus according to the present embodiment. The laser apparatus of the present embodiment is oscillated by laser light 39 from the laser module 35. The laser light 39 is absorbed by the Nd:YAG laser rod 36, and the light emitted from the Nd:YAG laser rod 39 is resonated by the rear mirror 37 and the output mirror 38 to cause Nd:YAG laser light 40 to be generated.
Since the laser apparatus according to the present embodiment employs a laser module, in which the heat sink according to the second embodiment described above is used, as an excitation light source, it becomes possible to obtain stabilized laser light for a longer period of time, and maintenance costs thereof can be reduced.
Next, a description is given of a laser processing apparatus according to a sixth embodiment.
Hereinafter, a description is given of the results of having evaluated the characteristics by comparison of the examples according to the present invention with comparative examples departing from the scope of the present invention.
First, a heat sink which is 25 mm long, 11 mm wide and 2.5 mm thick, and has a structure similar to that of the first embodiment shown in
Also, a similar experiment was carried out while varying the size of the heat sink in a range of 15 mm through 25 mm long, 10 mm through 12 mm wide, and 1 through 3 mm thick, wherein the cooling efficiencies conform with each other within ±10% where the length and width were varied. On the other hand, where the thickness was 3 mm, thermal resistance of 0.20° C./W was obtained. The value of the thermal resistance increases in line with thinning of the thickness of the copper plate being a heat radiating plate, and it was 0.30° C./W in a heat sink whose thickness is 1 mm.
Next, as the second example of the present invention, a heat sink was produced, in which the shape, position and orientation of projections 4 were varied, and the cooling capacity was investigated. The heat sink according to the present example was made similar to the heat sink according to the first embodiment, which is shown in
Next, as the third example of the present invention, a heat sink having a size similar to the first example, the thickness of which is 2.5 mm, was produced, and flow channels 0.15 mm deep are provided on the second heat radiating plate with the same pattern as that of the flow channels 2 formed on the first heat radiating plate 1 as shown in FIG. A, wherein the pressure loss could be reduced by 20%, and the flow amount was increased. Therefore, it was possible to lower the thermal resistance by 0.20° C./W or so.
Also, changes in the thermal resistance were investigated in a case where the quantity and size of the projections having a shape shown in
Next, as the third example of the present invention, using a copper plate as the material of the heat radiating plates, a heat sink having a nickel-plated layer of 5 μm in thickness formed on the surface of the flow channels 2, a heat sink having a gold-plated layer of 5 μm in thickness formed on the surface of the flow channels 2, a heat sink having a nickel-plated layer of 5 μm in thickness formed on the surface of the flow channels 2 and a gold-plated layer of 1 μm in thickness formed on the nickel-plated layer, and a heat sink, not having a plated layer formed thereon, in which the surface of the flow channels is merely made of copper, were, respectively, produced in compliance with the structure similar to that of the first embodiment. As a corrosion-resisting test, after salt water whose temperature is 25° C. was circulated into these heat sinks for 50 hours, the interior thereof was observed. As a result, the corroded area of the heat sink having only a nickel-plated layer formed thereon was one-fifth the corroded area of the heat sink in which the surface of the flow channels 2 is merely made of copper, one-third the corroded area of the heat sink having a gold-plated layer formed thereon, and one-half the corroded area of the heat sink having a gold-plated layer on a nickel-plated layer.
Also, a heat sink having a copper oxide layer formed of 100 nm thickness instead of the nickel-plated layer was prepared, and changes in the pressure loss of the flow channels were measured for a long period of time while flowing cooling water. Further, the time for which corrosion grows and a change in the pressure loss is commenced was measured. The time of the heat sink having a copper oxide layer is equivalent to that of the heat sink having a nickel-plated layer, which is approximately 3000 hours. In the heat sink in which the surface of the flow channels is merely made of copper, an increase in the pressure loss was commenced in approximately 1500 hours, wherein the copper oxide layer is equivalent to the nickel-plated layer and has greater corrosion resistance by two times than in the case of only copper.
Next, a prior art heat sink, proposed by Patent Document 7 described above, in which flow channels are two-layered was produced as the first comparative example of the present invention.
Next, a prior art heat sink, in which the flow channels are two-layered, proposed by Patent Document 8 described above was produced as the second comparative example of the present invention.
Next, a prior art heat sink having flow channels formed on the same flat plane, which was proposed by Patent Document 5 described above, was produced as the third comparative example of the present invention.
As described in detail above, according to the present invention, since projections are provided in the flow channels formed in the heat radiating plate, turbulent flows are brought about in the refrigerant flowing in the flow channels, mixture is carried out by vortex motions of the refrigerant, and transfer efficiency of the heat quantity from the heat radiating plates to the refrigerant can be improved, wherein the cooling efficiency can be increased. In addition, since the projections are shaped so that the cross sectional shape is made narrower upward from the bottom surface of the flow channels, or downward from the upper surface, the refrigerant is agitated in the vertical direction, and the cooling efficiency can be improved. By shaping the flow channels as described above, it is possible to achieve flow channels of a single-layered structure, which have a cooling capacity equivalent to or exceeding the cooling capacity of the prior art flow channels of a two-layered structure, and it is possible to construct a heat sink by a heat radiating plate, in which flow channels are formed, and a plate-shaped heat radiating plate. Thereby, the number of jointed points in the heat sink can be reduced to increase the reliability, and the production costs thereof can be further lowered.
The present invention is advantageous as a heat sink for efficiently cooling off a high-output laser.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2003-052039 | Feb 2003 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP04/01782 | 2/18/2004 | WO | 6/12/2006 |
