Claims
- 1. A heat sink comprising:
(a) a base having a substantially flat region for interfacing with an electronic component; and (b) at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 2. The heat sink of claim 1 wherein at least one heat pipe further comprises a third region disposed between 0° and 180° to the flat region of the base.
- 3. The heat sink of claim 1 further comprising fins adapted to be attachable to the heat sink and to at least one heat pipe.
- 4. The heat sink of claim 1 wherein the base is adapted to attach at least one heat pipe to multiple heat generating components.
- 5. The heat sink of claim 1 wherein the base is adapted to attach at least one heat pipe to a heat-generating component, wherein at least one heat pipe attached directly contacting the heat generating component.
- 6. A heat transfer system comprising:
(a) a heat-generating component; (b) a plurality of heat sinks attached to the heat-generating component, each heat sink comprising:
(i) a base having a substantially flat region for interfacing with the heat-generating component; and (ii) at least one heat pipe attached to the base, wherein at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 7. The heat transfer system of claim 6 wherein at least one heat pipe further comprises a third region disposed between 0° and 180° to the flat region of the base.
- 8. The heat transfer system of claim 6 further comprising fins adapted to be attachable to the heat sink and to at least one heat pipe.
- 9. A circuit board assembly comprising:
(a) a printed circuit board with at least one heat-generating component; and (b) at least one heat sink attached to the printed circuit board, the heat sink comprising:
(i) a base having a substantially flat region for interfacing with an heat-generating component; and (ii) at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 10. The circuit board assembly of claim 9 wherein at least one heat pipe further comprises a third region disposed between 0° and 180° to the flat region of the base.
- 11. The circuit board assembly of claim 9 further comprising at least one heat pipe directly contacting more than one heat-generating component.
- 12. The circuit board assembly of claim 9 further comprising fins adapted to be attachable to at least one heat sink.
- 13. A computer system comprising:
(a) an enclosure; and (b) a circuit board assembly disposed in the enclosure, the assembly comprising:
(i) a printed circuit board having at least one heat-generating component; and (ii) at least one heat sink attached to the heat generating component comprising:
(bb) a base having a substantially flat region for interfacing with an electronic component; and (cc) at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 14. The computer system of claim 13 wherein the at least one heat pipe further comprises a third region disposed between 0° and 180° to the flat region of the base.
- 15. The computer system of claim 13 further comprising fins adapted to be attachable to at least one heat sink.
- 16. A method for transferring heat comprising:
(a) dissipating heat from at least one heat generating component through at least one heat pipe at a first rate of heat dissipation; the heat pipe characterized by having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base; and (b) dissipating heat from at least one heat generating component through the base at a second rate of heat dissipation.
- 17. The method of claim 16 further comprising:
(a) attaching fins adapted to be attachable to the heat sink; and (b) dissipating heat from the at least one heat generating component through the fins at a third rate of heat dissipation.
- 18. A method of manufacturing a heat sink comprising forming a base for the heat sink adapted to attach at least one heat pipe to a heat generating component, the heat pipe having a first region substantially parallel to the flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 19. The method of manufacturing of claim 18 further comprising attaching a heat pipe to the base.
- 20. A heat sink, comprising:
(a) a base; and (b) a plurality of heat pipes coupled to the base.
- 21. The heat sink of claim 20 wherein the plurality of heat pipes are operable to directly contact a heat-generating component to which the base is attached.
- 22. The heat sink of claim 20 further fins disposed on the base and substantially perpendicular to the base.
- 23. The heat sink of claim 20 wherein the plurality of heat pipes each have a first region substantially parallel to a flat region of the base and a second region disposed between 0° and 180° to the flat region of the base.
- 24. The heat sink of claim 20 wherein the heat pipes in the plurality of heat pipes are aligned in a row.
- 25. The heat sink of claim 20 wherein each of the plurality of heat pipes has a cross-sectional area that is significantly smaller than the area of the base.
- 26. The heat sink assembly of claim 20 wherein the plurality of heat pipes each has a diameter of substantially ¼ inch.
CROSS-RELATED APPLICATIONS
[0001] This application is related to utility patent applications U.S. application Ser. No. ______ (Atty. Docket No. 100200241-1 (1964-8-3) titled HEAT SINK WITH HEAT PIPE IN DIRECT CONTACT WITH COMPONENT, and U.S. application Ser. No. ______ (Atty. Docket No. 100200241-1 (1964-9-3) titled HEAT SINK WITH ANGLED HEAT PIPE, which were filed on the same day as this application and which are hereby incorporated by reference in their entirety.