1. Technical Field
The disclosure relates to a heat sink with vapor chamber and, more particularly, to a heat sink with vapor chamber having firm structure.
2. Description of Related Art
Nowadays, numerous heat sinks are used to dissipate heat generated by electronic devices. A vapor chamber type heat sink is a common structure of the heat sinks. Generally, the heat sink includes a plate shaped heat spreader thermally contacting the electronic device. A vacuum chamber is defined in the heat spreader. A wick structure is formed on an inner face of the chamber, and a working fluid is contained in the chamber. As the electronic device is maintained in thermal contact with the heat spreader, the working fluid contained in the chamber corresponding to a hotter location vaporizes into vapor. The vapor then spreads to fill the chamber, and wherever the vapor comes into contact with a cooler location of the chamber, it releases its latent heat and condenses. The condensate returns to the hotter location via a capillary force generated by the wick structure. Thereafter, the working fluid frequently vaporizes and condenses to form a circulation to thereby remove the heat generated by the electronic device.
However, the heat spreader of the heat sink is prone to deforming when subjected to an inner or outer pressure during use, which further results in the wick structure disengagement from the inner face of the chamber, adversely affecting the stability of the heat sink.
What is needed, therefore, is a heat sink which can overcome the limitations described.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Also referring to
The first wick layer 30 includes a central portion 32 and four interconnecting side portions 34 integrally extending downwardly from the central portion 32. The central portion 32 of the first wick layer 30 is formed on an inner face of the central plate 222 of the tank 20. The first wick layer 30 is a sintered wick layer which is formed from sintering metal power.
The second wick layer 40 includes a central portion 42 and four interconnecting side portions 44 integrally extending upwardly from the central portion 42. The central portion 42 of the second wick layer 40 is formed on an inner face of the heat spreader 10 and enclosed by the tank 20. The side portions 44 of the second wick layer 40 has outer faces adhered on the four sidewalls 224 of the body 22 of the tank 20, and inner faces engaging with the side portions 34 of the first wick layer 30, thus the first wick layer 30 is accommodated in the second wick layer 40, and the first wick layer 30 and the second wick layer 40 are in communication, therefore, the working fluid can flow between the first wick layer 30 and the second wick layer 40 via capillary forces generated therefrom. The second wick layer 40 is a meshed wick layer which is formed from a mesh.
Also referring to
In use, the heat spreader 10 of the heat sink thermally contacts and absorbs heat from a heat-generating source. The working fluid in the chamber 26 is heated and vaporized to flow upwardly through the holes 560 of the connecting portions 56 to reach the central plate 222 of the tank 20. The vaporized working fluid exchanges heat with the central plate 222 and then is condensed to liquid. The condensing working fluid returns to the heat spreader 10 via the first wick layer 30 and the second wick layer 40.
According to the disclosure, the supporting member 50 in the chamber 26 can support the heat spreader 10 and the tank 20 to prevent the first and second wick layers 30, 40 from deforming, and prevent the first and second wick layers 30, 40 from disengaging from the heat spreader 10 and the tank 20; thus, the heat sink in accordance with the present disclosure can have a normal function even when it is subjected to a large internal vapor pressure or an external vibration.
It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Number | Date | Country | Kind |
---|---|---|---|
200810306034.8 | Dec 2008 | CN | national |