Claims
- 1. A heat sink for cooling modules containing semicondcutor chips comprising:
- a base member of heat conducting material having a top surface and a bottom surface, said bottom surface in thermal contact with at least one semiconductor chip, said top surface having a pyramidal top surface having a peak at the intersection of four triangular surfaces; and
- a rectilinear array of cooling fins extending from said top surface, said rectilinear array providing a plurality of air flow channels between said cooling fins and in contact with all of the triangular planar surfaces;
- whereby an impinging flow of cooling air is directed by the peak of the top surface through the air flow channels and along the top surface, thereby improving the cooling efficiency of the heat sink.
- 2. The heat sink as claimed in claim 1 further comprising a plurality of residual webs of material between said cooling fins to direct the air flow over said top surface.
- 3. The heat sink as claimed in claim 1 wherein said base member and said cooling fins are comprised of aluminum.
- 4. The heat sink as claimed in claim 2 wherein said base member and said cooling fins are comprised of aluminum.
Parent Case Info
This is a continuation application of Ser. No. 876,054, filed June 19, 1986, now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (3)
Number |
Date |
Country |
662743 |
Apr 1965 |
DEX |
420255 |
Apr 1947 |
ITX |
2163287 |
Feb 1986 |
GBX |
Non-Patent Literature Citations (3)
Entry |
IBM Technical Disclosure Bulletin, "Thermal Enhancement of Moduler", vol. 19, No. 8, Jan. 1977. |
J. L. Horvath, IBM Technical Disclosure Bulletin, vol. 23, No. 2, 7/80, pp. 603-604. |
A. J. Arnold et al., IBM Technical Disclosure Bulletin, vol. 22, No. 6, 11/79, pp. 2297-2298. |
Continuations (1)
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Number |
Date |
Country |
Parent |
876054 |
Jun 1986 |
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