Wire-like or pin-like cooling fins or heat sinks

Industry

CPC
H01L23/3677

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3677Wire-like or pin-like cooling fins or heat sinks

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermal contact and method of making
- Patent number 12,142,542
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module with cooling fins in a matrix form
- Patent number 12,127,382
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yoshihiro Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor die package with thermal management features
- Patent number 12,074,083
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dispersion layers for double sided interconnect
- Patent number 12,074,084
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal bridge interposer structure
- Patent number 12,046,530
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid microjet liquid-cooled heat spreader
- Patent number 12,029,008
- Issue date Jul 2, 2024
- The Penn State Research Foundation
- Bladimir Ramos Alvarado
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for managing power in a multi-dimensional pack...
- Patent number 12,019,492
- Issue date Jun 25, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device and memory device module
- Patent number 12,009,282
- Issue date Jun 11, 2024
- MEIKO ELECTRONICS CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including cooler for cooling semiconductor...
- Patent number 12,009,279
- Issue date Jun 11, 2024
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,009,280
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,002,730
- Issue date Jun 4, 2024
- Mitsubishi Electric Corporation
- Ikumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies and methods of fabricating the same
- Patent number 11,997,838
- Issue date May 28, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,990,385
- Issue date May 21, 2024
- Advanced Semiconductor Engineering, Inc.
- Li-Chieh Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COOLING DEVICE
- Publication number 20240397674
- Publication date Nov 28, 2024
- MIBA SINTER AUSTRIA GMBH
- Manuel POHN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE PACKAGE WITH THERMAL MANAGEMEN...
- Publication number 20240363474
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
- Publication number 20240347412
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20240332119
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS
- Publication number 20240332126
- Publication date Oct 3, 2024
- Intel Corporation
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20240321682
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274495
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND POWER MODULE
- Publication number 20240274494
- Publication date Aug 15, 2024
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266247
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaw-Juinn HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS INCLUDING COOLER FOR COOLING SEMICONDUCTOR...
- Publication number 20240258194
- Publication date Aug 1, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE
- Publication number 20240234293
- Publication date Jul 11, 2024
- NEC Corporation
- Katsumi KIKUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE
- Publication number 20240222223
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS

Wire-like or pin-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for producing a 3D semiconductor memory device and structure

Semiconductor device having a thermal contact and method of making

Package comprising metal layer configured for electromagnetic inter...

Semiconductor package structure and fabrication method thereof

3D semiconductor device and structure with single-crystal layers

Semiconductor structure with heat dissipation structure and method...

Electronic systems with inverted circuit board with heat sink to ch...

3D semiconductor device and structure with metal layers and memory...

Semiconductor module with cooling fins in a matrix form

Through-substrate via structure and method of manufacture

Semiconductor device and method of making the same

Methods for producing a 3D semiconductor device and structure with...

Electronic power package and heat sink/cold rail arrangement

Semiconductor die package with thermal management features

Heat dispersion layers for double sided interconnect

Arrangement of a power semiconductor module and a cooler

3D semiconductor device and structure with bonding and DRAM memory...

Thermal bridge interposer structure

Thermal pads between stacked semiconductor dies and associated syst...

Methods for producing a 3D semiconductor device and structure with...

Hybrid microjet liquid-cooled heat spreader

Method and apparatus for managing power in a multi-dimensional pack...

Memory device and memory device module

Semiconductor apparatus including cooler for cooling semiconductor...

IC package with heat spreader

Package structure and method of manufacturing the same

Semiconductor module

Power device assemblies and methods of fabricating the same

Thermal routing trench by additive processing

Electronic device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

THERMALLY CONDUCTIVE SPACER

EMITTERS FOR INTEGRATED POWER CARD COOLING

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR PRODUCING A COOLING DEVICE

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

METHOD FOR FORMING SEMICONDUCTOR DIE PACKAGE WITH THERMAL MANAGEMEN...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT

IC PACKAGE WITH HEAT SPREADER

POWER MODULE WITH OVERLAPPING TERMINALS

THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS

HEAT DISSIPATION STRUCTURES

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION STRUCTURE AND POWER MODULE

THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS INCLUDING COOLER FOR COOLING SEMICONDUCTOR...

QUANTUM DEVICE

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME