Wire-like or pin-like cooling fins or heat sinks

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H01L23/3677

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3677Wire-like or pin-like cooling fins or heat sinks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,349,323
- Issue date Jul 1, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Shinya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,347,793
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,347,742
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin member having a rib includi...
- Patent number 12,347,741
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,334,412
- Issue date Jun 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 12,334,413
- Issue date Jun 17, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and powe...
- Patent number 12,308,304
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive chamber with stiffening structure for thermal...
- Patent number 12,309,966
- Issue date May 20, 2025
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated multi-chip cooler module
- Patent number 12,300,577
- Issue date May 13, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded air heat sink
- Patent number 12,278,159
- Issue date Apr 15, 2025
- RAYTHEON TECHNOLOGIES CORPORATION
- James S. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for managing heat distribution in a semiconduc...
- Patent number 12,238,898
- Issue date Feb 25, 2025
- Ciena Corporation
- Charles Baudot
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for heat dissipation of semiconductor devices
- Patent number 12,230,550
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- S. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical device and electronic control device with housings havin...
- Patent number 12,218,027
- Issue date Feb 4, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside air cooling of electronic packages
- Patent number 12,212,087
- Issue date Jan 28, 2025
- Cobham Advanced Electronic Solutions, Inc.
- Chul Hong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package design
- Patent number 12,191,225
- Issue date Jan 7, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,183,652
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239506
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20250233041
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Jürgen BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250233040
- Publication date Jul 17, 2025
- MEDIATEK INC.
- Sang-Mao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COOLING DEVICE
- Publication number 20250229328
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Manuel POHN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226281
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS
- Publication number 20250201656
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER
- Publication number 20250201662
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250192062
- Publication date Jun 12, 2025
- ZF Friedrichshafen AG
- Shaozhi Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250191994
- Publication date Jun 12, 2025
- Macronix International Co., Ltd.
- Yun-Yuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...
- Publication number 20250191995
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...
- Publication number 20250167073
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION THROUGH THERMAL VIAS
- Publication number 20250157875
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING MODULE FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...
- Publication number 20250140637
- Publication date May 1, 2025
- Wistron Corporation
- Chu-Chia TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140638
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Nobuchika AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER
- Publication number 20250140771
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONN...
- Publication number 20250140648
- Publication date May 1, 2025
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BONDING STRUCTURE
- Publication number 20250118619
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118620
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSELY PACKED ELECTRONIC SYSTEMS
- Publication number 20250120018
- Publication date Apr 10, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING

Wire-like or pin-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor memory device and structure

Package structure and manufacturing method thereof

Power conversion apparatus

Semiconductor package

IC package with heat spreader

Semiconductor device comprising a resin member having a rib includi...

Electronic package and method of forming the same

System in package with flip chip die over multi-layer heatsink stan...

Power module package for direct cooling multiple power modules

Semiconductor device and method of manufacturing the same, and powe...

Thermally conductive chamber with stiffening structure for thermal...

Densely packed electronic systems

Dual cool power module with stress buffer layer

Heterogeneous integrated multi-chip cooler module

Wire bonded air heat sink

3D semiconductor memory device and structure with memory and metal...

Selective metallization of integrated circuit packages

3D semiconductor device and structure with metal layers and memory...

Method and apparatus for managing heat distribution in a semiconduc...

Semiconductor devices having supportive plating structures

Structures and methods for heat dissipation of semiconductor devices

Semiconductor device and method of forming micro interconnect struc...

Venturi-effect heat-transfer device

Electrical device and electronic control device with housings havin...

Package structure for heat dissipation

Topside air cooling of electronic packages

Package-on-package assembly with wire bond vias

Ball grid array package design

Integrated circuit structure

Methods for producing a 3D semiconductor memory device and structure

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

COOLING DEVICE

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A COOLING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS

INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER

POWER MODULE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...

PACKAGE STRUCTURE FOR HEAT DISSIPATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION THROUGH THERMAL VIAS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

COOLING MODULE FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER

BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONN...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

THERMAL CONDUCTIVE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE

DENSELY PACKED ELECTRONIC SYSTEMS