Patent Grant
12007172
The application claims the benefit of Taiwan application serial No. 110102154, filed on Jan. 20, 2021, and the entire contents of which are incorporated herein by reference.
The present invention relates to a heat sink and, more particularly, to a heat sink for cooling an electronic element.
With the progress of electronic technology and continuous development of semiconductor industry technology in high performance, high power, and miniaturization, the heat and concentration during operation of IC elements increase. Thus, it is an inevitable issue in increasing the cooling effect of electronic products. Currently, there are various heat sinks available on the market and applicable on electronic products. In comparison with conventional fins, a vapor chamber or a heat pipe, which uses a working fluid and a capillary structure, can provide cooling by gas-liquid phase change of the working fluid, thereby reducing the concentration phenomenon of hot spots while providing advantages of quick reaction time, good temperature uniformity, light weight, and good efficiency. There are currently three common capillary structure types: grooves, meshes, and sintering.
In the above conventional heat sink with a working fluid and a capillary structure, since the working fluid and the capillary structure are disposed in a chamber in the heat sink, a plurality of posts is required in the chamber in addition to the working fluid and the capillary structure to avoid collapse or deformation of the surface of the chamber due to a normal pressure acting on the surface of the chamber or a negative pressure resulting from an internal vacuum. In manufacture, the posts and the capillary structure are processed separately, such as placement operation of the posts, welding operation of the posts, or directly etching metal sheets to form the posts. Thus, the complicated procedures increase difficulties in manufacture, causing difficulties in reduction of the manufacturing costs and in increase of the yield. Furthermore, the posts formed by etching cannot provide the capillary action and are the critical factor of difficulties in improving the cooling effect in a limited space.
Thus, it is necessary to improve the conventional heat sinks.
To solve the above problems, an objective of the present invention is to provide a heat sink including a supporting portion providing both supporting function and capillary action, which can increase the cooling effect and reduce the volume, thereby further significantly reducing the manufacturing costs.
Another objective of the present invention is to provide a heat sink which can significantly reduce the diameters of the capillary pores of the capillary structure and can increase the number of the capillary pores, thereby achieving better cooling effect.
A further objective of the present invention is to provide a heat sink which can simply the manufacturing procedures.
When the terms “front”, “rear”, “left”, “right”, “up”, “down”, “top”, “bottom”, “inner”, “outer”, “side”, and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention, rather than restricting the invention.
As used herein, the term “a”, “an” or “one” for describing the number of the elements and members of the present invention is used for convenience, provides the general meaning of the scope of the present invention, and should be interpreted to include one or at least one. Furthermore, unless explicitly indicated otherwise, the concept of a single component also includes the case of plural components.
As used herein, the term “coupling”, “assembly”, or similar terms is used to include separation of connected members without destroying the members after connection or inseparable connection of the members after connection. A person having ordinary skill in the art would be able to select according to desired demands in the material or assembly of the members to be connected.
A heat sink according to the present invention includes a casing and a capillary structure. The casing includes a chamber filled with a working fluid. The capillary structure is located in the chamber. The capillary structure includes a plurality of capillary pores of different diameters. The capillary structure includes at least one supporting portion connected to a substrate. The substrate and the at least one supporting portion abut two opposite inner faces of the casing, respectively.
Thus, in the heat sink according to the present invention, the capillary structure forms the supporting portion. Thus, the steps of placing posts, welding the posts, or etching for forming the posts are not required. The manufacturing procedures of the heat sink can be simplified, and the manufacturing costs of the heat sink can be reduced significantly. Since the supporting portion provides both efficacies of supporting and capillary action, the cooling effect can be increased and the volume of the heat sink can be further reduced, which is very helpful in miniaturization or thinning of the heat sink.
In an example, the capillary structure may include capillary pores of a diameter smaller than 0.2 mm. Thus, the capillary action is generated.
In an example, the capillary structure may be shaped by punching or rolling to form the substrate and the at least one supporting portion which are integrally connected to each other. Thus, the diameters of the capillary pores are reduced, and the number of the capillary pores is increased.
In an example, an average diameter of capillary pores in the substrate may be smaller than an average diameter of capillary pores in the at least one supporting portion. Thus, a composite capillary force is generated.
In an example, the capillary pores in the at least one supporting portion may be larger than 0.2 mm. Thus, the steam space is increased.
In an example, the capillary structure may be formed by shaping at least one metal net. Thus, an adsorption force is provided for return flow of the working fluid.
In an example, the capillary structure may be formed by stacking a plurality of metal nets and then shaping the plurality of metal nets. Thus, the number of the capillary pores is increased.
In an example, the plurality of metal nets may have different meshes and different thicknesses. Thus, metal nets with larger-diameter wires and metal nets with smaller-diameter wires can be stacked to save material.
In an example, the plurality of metal nets may be stacked and in different angular positions relative to each other. Thus, the shape of the meshes of the capillary structure is not limited to square or rhombic obtained by conventional plain weaving, providing densely distributed capillary pores of composite shapes.
In an example, when two metal nets are stacked, metal wires of one of the two metal nets are aligned with capillary pores in another of the two metal nets, and the two metal nets are embedded into each other after shaping. Thus, the number of the capillary pores of the capillary structure is increased.
In an example, adjacent metal nets of the capillary structure may be partially embedded into each other after shaping. Thus, adjacent metal nets of the capillary structure have different meshes in the opposite direction.
In an example, the capillary structure may be formed by sintering a plurality of powder particles and then shaping the plurality of powder particles after sintering. Thus, the adsorption force for return flow of the working fluid is further increased.
In an example, the substrate may include a first board and a second board having a thickness different from a thickness of the first board. Thus, the first board and the second board may have capillary pores of different diameters to increase the flow rate of the working fluid.
In an example, the casing may include at least one recessed portion recessed towards the cavity. Thus, the at least one recessed portion can serve as an evasive portion for receiving a heat generating object or an electronic element, reducing the space occupied.
In an example, the at least one recessed portion may abut the at least one supporting portion. Thus, the cooling area and the supporting force are increased.
In an example, the at least one recessed portion and the at least one supporting portion may not abut each other. Thus, the cooperative mechanism provides an evasion to permit easy installation of the heat sink in a limited space.
In an example, the at least one recessed portion may make one of the two opposite inner faces of the casing protrude into the chamber. The capillary structure sinuates on the one of the two opposite inner faces to form the at least one supporting portion. Thus, the at least one supporting portion and the at least one recessed portion can be integrally formed to simplify the processing procedure.
In an example, the casing may include a first sheet having a receiving groove. Furthermore, the casing may include a second sheet coupled to the first sheet to form the chamber. Thus, a vapor chamber is formed.
In an example, the second sheet includes a receiving groove intercommunicating with the receiving groove of the first sheet. Thus, a larger chamber can be formed to increase the cooling effect.
In an example, the plurality of metal wires or the plurality of powder particles of the capillary structure can expand after shaping. Thus, the diameter of the capillary pores can be reduced to increase the adsorption force of the capillary action.
In an example, the plurality of metal wires of the capillary structure can become flat after shaping. Thus, the heat conduction area can be increased.
The present invention will become clearer in light of the following detailed description of illustrative embodiments of this invention described in connection with the drawings.
With reference to
The casing 1 can be made of a material with a thermally conductive function, such as copper, aluminum, titanium, or stainless steel. Thus, the casing 1 can be directly or indirectly connected to a heat generating object for cooling the heat generating object. The heat generating object can be a central processor of a mobile phone or any other electronic product, or an electronic element, such as a chip, on a circuit board, which generates heat during operation. The casing 1 includes a chamber S therein. The chamber S can be filled with a working fluid L which can be water, alcohol, or any other liquid. Preferably, the working fluid L can be an electrically non-conductive liquid, such that the working fluid L in the liquid state can easily absorb heat and evaporate into a gaseous state. Thus, the gas-liquid phase change mechanism of the working fluid L can be used to transfer the heat energy. The chamber S is in a sealed vacuum state to avoid loss of the working fluid L in the gaseous state as well as avoiding adverse affects to the cooling effect resulting from squeezing of the space for the working fluid L in the gaseous state due to occupation of air.
The configuration of the casing 1 is not limited in the present invention. The outline of the casing 1 can be adjusted according to factors, such as the type, use conditions, or installation conditions of the heat sink. For example, the heat sink of this embodiment may be a vapor chamber J. The casing 1 may include a first sheet 1a and a second sheet 1b. After coupling of the first sheet 1a and the second sheet 1b, the chamber S can be formed therein for receiving the capillary structure 2.
The first sheet 1a may include a receiving groove 11. The receiving groove 11 may be formed by punching, die casting, bending, etching, etc. The present invention is not limited in this regard. An annular ledge 12 may be formed along a periphery of the receiving groove 11. A passageway 13 extends through the annular ledge 12 and intercommunicates with the receiving groove 11. The second sheet 1b may select a material the same as or different from that of the first sheet 1a. The present invention is not limited in this regard. A coupling portion 14 may be formed along a periphery of the second sheet 1b. The coupling portion 14 can be coupled with the annular ledge 12 of the first sheet 1a, such that the second sheet 1b and the first sheet 1a together form the chamber S for receiving the capillary structure 2. The second sheet 1b further includes a passageway cover 15 connected to the coupling portion 14. The passageway cover 15 can be aligned with the passageway 13 of the first sheet 1a to jointly form a liquid filling passageway T. The liquid injection passageway T can be used to suck air out of the chamber S and to fill the working fluid L used by the vapor chamber J into the chamber S. The liquid filling passageway T can be sealed after filling of the working fluid L, avoiding loss of the working fluid L in the gaseous state.
Further to the above description, the way of coupling of the second sheet 1b and the first sheet 1a is not limited in the present invention. For example, the second sheet 1b can be coupled to the first sheet 1a by adhesion, embedding, threading connection, snapping, welding, etc. In this embodiment, the annular ledge 12 of the first sheet 1a can be coupled to the coupling portion 14 of the second sheet 1b by brazing or laser welding. The liquid filling passageway T can be sealed by the welding flux, such that the first sheet 1a and the second sheet 1b can be reliably coupled without generating gaps, thereby increasing the structural strength.
The capillary structure 2 is located in the chamber S. The capillary structure 2 may be a porous structure to assist in flow of the working fluid L by capillary action. The capillary structure 2 may be a porous mesh structure or sintered powder structure. The sintered powder structure can be produced from copper powders or other suitable powders subjected to a powder sintering process. The present invention is not limited in this regard.
Further to the above description, after initial formation of the capillary structure 2, at least one substrate 21 and at least one supporting portion 22 can be formed after shaping. The shaping can be punching or rolling. The present invention is not limited in this regard. In this embodiment, the supporting portion 22 is disposed on the substrate 21. The average diameter of capillary pores in the supporting portion 22 can be different from that of capillary pores in the substrate, thereby providing a composite capillary action. The diameter of the capillary pores of the supporting portion 22 may be larger than 0.2 mm to increase the vapor space. The capillary structure 2 may abut a lower inner surface F1 of the casing 1 (the surface of the first sheet 1a facing the second sheet 1b) by the substrate 21 and may abut an upper inner surface F2 of the casing 1 (the surface of the second sheet 1b facing the first sheet 1a) by the supporting portion 22. Thus, the chamber S can be supported by the supporting portion 22 and the substrate 21 to avoid collapse or deformation of the surface of the chamber S due to a normal pressure acting on the surface of the chamber S or a negative pressure resulting from an internal vacuum. Particularly, the heat sink according to the present invention does not require the steps of welding of posts and forming post holes in the capillary structure or etching for forming posts of conventional heat sinks. Thus, the manufacturing process of the heat sink according to the present invention can be simplified to effectively and significantly reduce the manufacturing costs. Furthermore, the diameter of the capillary pores can be reduced and the number of capillary pores per unit area can be increased by shaping the capillary structure 2. Thus, the effect for adsorption of the working fluid L can be increased. Namely, the flow rate of the working fluid L can be increased, thereby achieving better cooling effect.
The way for shaping the capillary structure 2 is not limited in the present invention. For example, with reference to
Furthermore, the capillary structure 2 may be formed by stacking a plurality of metal nets N followed by shaping. The meshes of the plurality of metal nets N can be different. For example, metal nets N of 50 meshes and 200 meshes can be used. A metal net N with fewer meshes may have coarser metal wires N1 (namely, having a larger thickness). A metal net N with more meshes may have thinner metal wires N1 (namely, having a smaller thickness). Thus, metal nets with large-diameter wires and metal nets with small-diameter wires can be stacked to achieve the supporting height, thereby saving material. As shown in
With reference to
In view of the foregoing, by shaping the capillary structure 2, the diameter of the capillary pores 23 can be smaller than 0.2 mm to generate the adsorption force of capillary action. Specifically, the capillary structure 2 may be a copper net, and the diameter of the capillary pores 23 can be smaller than 0.042 mm after shaping. Alternatively, the capillary structure 2 may be a stainless steel net, and the diameter of the capillary pores 23 can be smaller than 0.03 mm after shaping. In each case, the adsorption force of capillary action is increased while providing the function of posts.
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In view of foregoing, in the heat sink according to the present invention, since the supporting portion are formed after shaping the capillary structure, the steps of placing the posts, welding the posts, or direct etching metal boards to form the posts are not required. Thus, the manufacturing procedures of the heat sink can be simplified, which is more helpful in significantly reducing the manufacturing costs, particularly in the case of replacing posts formed by etching metal sheets. The capillary structure can be formed by shaping to significantly reduce the diameters of the capillary pores and to increase the number of the capillary pores. Thus, the flow rate of the working fluid can be effectively increased to enhance the cooling effect. Since the supporting portion provide both efficacies of supporting and capillary action, the cooling effect can be increased, which is very helpful in miniaturization or thinning of the heat sink. Furthermore, the casing may include the recessed portion to increase the cooling area, further increasing the cooling effect.
Although the present invention has been described with respect to the above preferred embodiments, these embodiments are not intended to restrict the present invention. Various changes and modifications on the above embodiments made by any person skilled in the art without departing from the spirit and scope of the present invention are still within the technical category protected by the present invention. Accordingly, the scope of the present invention should be defined by the appended claims.
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| 110102154 | Jan 2021 | TW | national |
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| Number | Date | Country | |
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| 20220228812 A1 | Jul 2022 | US |
