Patent Application
20240418451
The present disclosure relates to the field of heat dissipation technology for lens, and in particular to a heat spreader with vapor chambers and a method for manufacturing the heat spreader with vapor chambers.
In the 5G era, electronic equipment is developing and has more and more high frequency, high running speed, integration, and light weight and small thickness, and the heat generated by components such as processors is also increasing. In order to effectively transfer the concentrated heat to the outer environment of the casing and maintain the smooth operation of core electronic components at permitted temperatures, more and more products use heat spreaders with vapor chambers as heat dissipation components. A heat spreader with vapor chambers has divergent vapor paths, good thermal conductivity, a light weight and a small thickness, making it a standard configuration for the new generation of mobile terminals. An existing heat spreader with vapor chambers usually includes two cover plates that are closed together and a capillary structure arranged between the two cover plates. The capillary structure of the heat spreader with vapor chambers is generally arranged on a contact surface with a heat source, and the upper and lower plates are supported by etched or stamped columns. The supporting columns are solid structures, occupying the space of vapor channels, causing the vapor channels to become smaller, and further leading to poor heat dissipation effect. The heat dissipation efficiency can be improved only by increasing the widths of the cover plates.
Therefore, it is necessary to provide a heat spreader with vapor chambers and a method for manufacturing the heat spreader with vapor chambers, in order to improve heat dissipation ability of the heat spreader with vapor chambers.
The present disclosure aims to provide a heat spreader with vapor chambers and a method for manufacturing the heat spreader with vapor chambers, in order to improve heat dissipation ability of the heat spreader with vapor chambers.
The technical solutions of the present disclosure are described below.
In the first aspect, some embodiments of the present disclosure provide a heat spreader with vapor chambers, including: a first cover plate being close to a heat source, a second cover plate being arranged to be opposite to the first cover plate and fit with the first cover plate to form an enclosed inner cavity, and a capillary structure arranged in the enclosed inner cavity. The heat spreader with vapor chambers has a first direction directing from the first cover plate to the second cover plate and a second direction perpendicular to the first direction. The first cover plate includes a first top wall extending perpendicular to the first direction and a first lateral wall extending from the first top wall towards the second cover plate along the first direction, the second cover plate includes a second top wall extending perpendicular to the first direction and a second lateral wall extending from the second top wall towards the first cover plate along the first direction, the first top wall, the first lateral wall, the second top wall and the second lateral wall fit with each other to form the enclosed inner cavity, and the enclosed inner cavity is filled with cooling medium. The capillary structure is spaced from the first lateral wall and the second lateral wall to form vapor channels.
As an improvement, the capillary structure is arranged to contact with the first top wall and the second top wall along the first direction.
As an improvement, a distance between the capillary structure and the first lateral wall and a distance between the capillary structure and the second lateral wall increase along the first direction.
As an improvement, the capillary structure has a plurality of cubic through-hole structures, and a diameter of one respective cubic through-hole structure ranges from 80 μm to 300 μm.
As an improvement, porosity of the capillary structure ranges from 90% to 97%.
As an improvement, the capillary structure is made of high-porosity foam copper, nickel or titanium alloy.
As an improvement, the first cover plate and the second cover plate are made of one of copper, stainless steel, or titanium alloy.
In the second aspect, some embodiments of the present disclosure provide a method for manufacturing the heat spreader with vapor chambers as described above, including:
The present disclosure has the following beneficial effects: in the heat spreader with vapor chambers according to the present disclosure, the enclosed inner cavity is supported by the capillary structure, and the capillary structure is spaced from the first lateral wall and the second lateral wall to form vapor channels free of supporting column structures. By using the capillary structure as a supporting structure, volumes of the vapor channels can be increased, thereby greatly improving heat dissipation effect. Moreover, the heat spreader with vapor chambers has a relatively small volume.
The following will provide, in conjunction with the accompanying drawings and the embodiments of the present disclosure, detailed description of the present disclosure.
As shown in
The first cover plate 10 is close to a heat source, and the second cover plate 20 is far away from the heat source. The second cover plate 20 is arranged to be opposite to the first cover plate 10, the first cover plate 10 is arranged on the second cover plate 20, and the first cover plate 10 fits with the second cover plate 20 to form an enclosed inner cavity 40. The capillary structure 30 is arranged in the enclosed inner cavity 40, and the enclosed inner cavity 40 is filled with cooling medium (not shown).
In some embodiments, the first cover plate 10 and the second cover plate 20 need to be closely fitted, and usually the connection between the first cover plate 10 and the second cover plate 20 needs to be welded and fixed to ensure a sealed connection between the first cover plate 10 and the second cover plate 20. For example, welding processes such as brazing or resistance welding may be used. With the above processing operations, the first cover plate 10 fits with the second cover plate 20 to form the enclosed inner cavity 40.
In some embodiments, the heat spreader with vapor chambers has a first direction directing from the first cover plate 10 to the second cover plate 20 and a second direction perpendicular to the first direction. In order for the first cover plate 10 and the second cover plate 20 to fit with each other to form the enclosed inner cavity 40, the first cover plate 10 includes a first top wall 11 extending perpendicular to the first direction and a first lateral wall 12 extending from the first top wall 11 towards the second cover plate 20 along the first direction, the second cover plate 20 includes a second top wall 21 extending perpendicular to the first direction and a second lateral wall 22 extending from the second top wall 21 towards the first cover plate 10 along the first direction. The first top wall 11, the first lateral wall 12, the second top wall 21 and the second lateral wall 22 fit with each other to form the enclosed inner cavity 40. The first cover plate 10 and the second cover plate 20 are made of one of copper, stainless steel, or titanium alloy, and the first cover plate 10 and the second cover plate 20 are manufactured by etching or stamping.
In some embodiments, the capillary structure 30 is spaced from the first lateral wall 12 and the second lateral wall 22 to form vapor channels 41. The capillary structure 30, as liquid channels, absorbs the cooling medium such that the liquid cooling medium flows, and the vapor channels 41 is used for the flow of gaseous cooling medium.
In the heat spreader with vapor chambers according to embodiments of the present disclosure, the enclosed inner cavity 40 is supported by the capillary structure 30, and the capillary structure is spaced from the first lateral wall 12 and the second lateral wall 22 to form vapor channels 41 free of supporting column structures. By using the capillary structure 30 as a supporting structure, volumes of the vapor channels 41 can be increased, thereby greatly improving heat dissipation effect. Moreover, the heat spreader with vapor chambers has a relatively small volume.
In some embodiments, the capillary structure 30 is arranged to contact with the first top wall 11 and the second top wall 21 along the first direction. The capillary structure can further enhance the strength of the heat spreader with vapor chambers and prevent it from being concave when subjected to external forces.
In some embodiments, a width of the capillary structure 30 in the second direction is smaller than a width of the enclosed inner cavity 40. In the second direction, the capillary structure 30 contacts with neither the first cover plate 10 nor the second cover plate 20, and is spaced from the first cover plate and the second cover plate by a same distance. In some other embodiments, a distance between the capillary structure 30 and the first lateral wall 12 and a distance between the capillary structure 30 and the second lateral wall 22 increase along the first direction. A cross-section of the capillary structure 30 along the A-A direction, i.e. the second direction, is trapezoidal. With this configuration, the cooling medium can be further accelerated to implement heat exchange.
In some embodiments, as shown in
In some embodiments, in order to increase the porosity of the capillary structure 30, the capillary structure 30 is made of high-porosity foam copper, nickel or titanium alloy. The capillary structure 30 made of the above materials has porosity of up to 90%˜97%. Compared to the traditional capillary structure 30, the capillary structure 30 according to the embodiments of the present disclosure has higher porosity and larger liquid absorption capacity.
In some embodiments, in order to inject the cooling medium into the enclosed inner cavity 40, a liquid injection hole 50 is defined on the heat spreader with vapor chambers. After welding the first cover plate 10 with the second cover plate 20, the cooling medium is injected into the enclosed inner cavity 40 through the liquid injection hole 50. Finally, the liquid injection hole 50 is closed to prevent the cooling medium from leaking out, thereby ensuring that the enclosed inner cavity 40 is in a negative pressure state.
The present disclosure provides the following specific embodiments to achieve the aforementioned heat spreader with vapor chambers.
Embodiment 1: a total thickness of the heat spreader with vapor chambers in the first direction is 1.2 mm, a total thickness in the second direction is 12.05 mm, and a total length of the heat spreader with vapor chambers is 300.0 mm. A total thickness of the capillary structure 30 on a side facing towards the first cover plate 10 in the second direction is 5.0 mm.
At shown in
At S10, i.e. cover plate obtaining operation, the first cover plate 10 and the second cover plate 20 are manufactured by etching or stamping.
At S10, two steel sheets having a thickness ranged from 0.05 mm to 0.4 mm are provided, and one or both of the two steel sheets are etched or stamped to obtain the first cover plate 10 and the second cover plate 20 of the heat spreader with vapor chambers. The ultra-thin cover plates reduce the volume of the heat spreader with vapor chambers and fulfill the material support strength of the heat spreader with vapor chambers. Then, the first cover plate 10 and/or the second cover plate 20 are placed in a passivation solution for passivation treatment to obtain the first cover plate 10 and/or the second cover plate 20 having a passivation film structure formed on surfaces.
At S20, i.e. capillary structure 30 obtaining operation, the capillary structure 30 is formed on a side of the first top wall 11 of the first cover plate 10 facing towards the second cover plate 20.
At S20, the capillary structure 30 is positioned in the middle of the first cover plate 10, ensuring that the distance between the capillary structure 30 and the first lateral wall 12 in the second direction is the same as the distance between the capillary structure 30 and the second lateral wall 22 in the second direction, so that the vapor channels 41 on both sides are of the same size. The capillary structure 30 is made of high-porosity foam copper, nickel or titanium alloy.
At S30, i.e. cover plate fixing operation, the second cover plate 20 is arranged on the first cover plate 10 and the first cover plate 10 and the second cover plate 20 are fixed to form the enclosed inner cavity 40 and to obtain an intermediate component.
At S30, the connection between the first cover plate 10 and the second cover plate 20 is welded and fixed. In some embodiments, the first lateral wall 12 is connected with the second lateral wall 22 to ensure a sealed connection between the first cover plate 10 and the second cover plate 20. Welding processes such as brazing or resistance welding may be used.
At S40, i.e. stress removal operation, high-temperature treatment is performed on the intermediate component to remove stress.
At S40, the intermediate component is placed in a high-temperature furnace to remove stress from the intermediate component and prevent deformation.
At S50, i.e. cooling medium filling operation, the enclosed inner cavity 40 is vacuumized and is injected with the cooling medium.
At S50, air is extracted from the enclosed inner chamber 40 through the liquid injection hole 50 reserved on the heat spreader with vapor chambers, then the cooling medium is injected into the enclosed inner chamber 40, and finally the liquid injection hole 50 is closed to prevent the cooling medium from leaking out.
With the above operations, the heat spreader with vapor chambers can be manufactured.
The above mentioned are only the embodiments of the present disclosure. It should be pointed out that for those skilled in the art, improvements can be made without departing from the inventive concept of the present disclosure, but these improvements are all within the scope of protection of the present disclosure.
The present application is a continuation of PCT Patent Application No. PCT/CN2023/101058, filed Jun. 19, 2023, which is incorporated by reference herein in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2023/101058 | Jun 2023 | WO |
| Child | 18399804 | US |
