Claims
- 1. A heat stable copolycondensate molding material which contains polyarylene sulfone and polyarylene ether sulfone units in random distribution and is obtainable by polycondensation of a mixture of
- (A) from 2 to 98 mol%, based on the sum of (A) to (C), of ##STR44## (B) from 2 to 98 mol%, based on the sum of (A) to (C), of ##STR45## and (C) from 0 to 96 mol%, based on the sum of (A) to (C), of ##STR46## where X is a chemical bond or ##STR47## wherein R.sup.3 and R.sup.4 are different when n and p are simultaneously 0 or ##STR48## only when n or p is not 0, R.sup.1 and R.sup.2 are each alkyl or alkoxy, each of 1 to 6 carbon atoms, R.sup.3 and R.sup.4 are each hydrogen, alkyl of 1 to 6 carbon atoms, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1 and n and p are 0, 1, 2, 3 or 4, with
- (D) from 1 to 100 mol%, based on the sum of (D) and (E), of ##STR49## where R.sup.5 and R.sup.6 are each hydrogen or have the same meaning as R.sup.1 and R.sup.2, Y is Cl or F, and v and w are each 0, 1, 2, 3 or 4, and
- (E) from 0 to 99 mol%, based on the sum of (D) and (E), of ##STR50## where Y is Cl or F, Z.sub.1 is ##STR51## Z.sub.2 is --O--, --S-- ##STR52## or a chemical bond, R.sup.7, R.sup.8, R.sup.9 and R.sup.10 are each hydrogen, Cl or F or may have the same meaning as R.sup.1 and R.sup.2, q and p are each 0 or 1 and r, s, t and u may each be an integer of from 0 to 4, with the proviso that one or more of the components (C) and (E) are present and the molar ratio of (B) to the sum of (A)+(C) is not greater than 1; further comprising from 10 to 60% by weight, based on the total weight, of at least one reinforcing filler.
- 2. A heat-stable copolycondensate molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 25 to 70 mol% of (A), from 25 to 70 mol% of (B) and from 5 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 1 to 100 mol% of (D) and from 0 to 99 mol% of (E), the percentage in each case being based on the sum of (D) and (E).
- 3. A heat-stable copolycondensate molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 20 to 80 mol% of (A), from 20 to 80 mol% of (B) and from 0 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 50 to 95 mol% of (D) and from 5 to 50 mol% of (E), the percentages in each case being based on the sum of (D) and (E).
- 4. A heat-stable copolycondensate molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 25 to 70 mol% of (A), from 25 to 70 mol% of (B) and from 5 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 50 to 95 mol% of (D) and from 5 to 50 mol% of (E), the percentages in each case being based on the sum of (D) and (E).
- 5. The molding which is obtainable from a heat-stable copolycondensate molding material as claimed in claim 1 as the central component.
- 6. A printed circuit board consisting of a heat-stable polycondensate molding material as claimed in claim 1.
- 7. An electrical plug connection consisting of a heat-stable copolycondensate molding material as claimed in claim 1.
- 8. A heat stable copolycondensate molding material which contains polyarylene sulfone and polyarylene ether sulfone units in random distribution and is obtainable by polycondensation of a mixture of
- (A) from 2 to 98 mol%, based on the sum of (A) to (C), of ##STR53## (B) from 2 to 98 mol%, based on the sum of (A) to (C), of ##STR54## and (C) from 0 to 96 mol%, based on the sum of (A) to (C), of ##STR55## where X is a chemical bond or ##STR56## wherein R.sup.3 and R.sup.4 are different when n and p are simultaneously 0, or ##STR57## only when u or p is 0, R.sup.1 and R.sup.2 are each alkyl or alkoxy, each of 1 to 6 carbon atoms, R.sup.3 and R.sup.4 are each hydrogen, alkyl of 1 to 6 carbon atoms, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1 and n and p are 0, 1, 2, 3 or 4, with
- (D) from 1 to 100 mol%, based on the sum of (D) and (E), of ##STR58## where R.sup.5 and R.sup.6 are each hydrogen or have the same meaning as R.sup.1 and R.sup.2, Y is Cl or F, and v and w are each 0, 1, 2, 3 or 4, and
- (E) from 0 to 99 mol% based on the sum of (D) and (E), of ##STR59## where Y is Cl or F, Z.sub.1 is ##STR60## Z.sub.2 is --O--, --S--, ##STR61## or a chemical bond, R.sup.7, R.sup.8, R.sup.9 and R.sup.10 are each hydrogen, Cl or F or may have the same meaning as R.sup.1 and R.sup.2, q and p are each 0 or 1 and r, s, t and u may each be an integer of from 0 to 4, with the proviso that one or more of the components (C) and (E) are present and the molar ratio of (B) to the sum of (A)+(C) is not greater than 1; further comprising from 5 to 50% by weight, based on the molding materials, of at least one thermoplastic selected from the group consisting of polyesters, nylons, polyurethanes, polyolefins, polyvinyl chlorides and polyoxymethylenes.
- 9. A heat-stable copolycondensate molding material as claimed in claim 8, which is obtainable by polycondensation of a mixture of from 25 to 70 mol% of (A), from 25 to 70 mol% of (B) and from 5 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 1 to 100 mol% of (D) and from 0 to 99 mol% of (E), the percentage in each case being based on the sum of (D) and (E).
- 10. A heat-stable copolycondensate molding material as claimed in claim 8, which is obtainable by polycondensation of a mixture of from 20 to 80 mol% of (A), from 20 to 80 mol% of (B) and from 0 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 50 to 95 mol% of (D) and from 5 to 50 mol% of (E), the percentages in each case being based on the sum of (D) and (E).
- 11. A heat-stable copolycondensate molding material as claimed in claim 8, which is obtainable by polycondensation of a mixture of from 25 to 70 mol% of (A), from 25 to 70 mol% of (B) and from 5 to 60 mol% of (C), the percentages in each case being based on the sum of (A) to (C), with from 50 to 95 mol% of (D) and from 5 to 50 mol% of (E), the percentage in each case being based on the sum of (D) and (E).
- 12. The molding which is obtainable from a heat-stable copolycondensate molding material as claimed in claim 8 as the central component.
- 13. A printed circuit board consisting of a heat-stable polycondensate molding material as claimed in claim 8.
- 14. An electrical plug connection consisting of a heat-stable copolycondensate molding material as claimed in claim 8.
- 15. A heat stable copolycondensate molding material as defined in claim 1, comprising from 5 to 50% by weight, based on the molding materials, of at least one thermoplastic selected from the group consisting of polyesters, nylons, polyurethanes, polyolefins, polyvinyl chlorides and polyoxymethylenes.
- 16. A heat stable copolycondensate molding material as defined in claim 2, comprising from 5 to 50% by weight, based on the molding materials, of at least one thermoplastic selected from the group consisting of polyesters, nylons, polyurethanes, polyolefins, polyvinyl chlorides and polyoxymethylenes.
- 17. A heat stable copolycondensate molding material as claimed in claim 3, comprising from 5 to 50% by weight, based on the molding materials, of at least one thermoplastic selected from the group consisting of polyesters, nylons, polyurethanes, polyolefins, polyvinyl chlorides and polyoxymethylenes.
- 18. A heat stable copolycondensate molding material as claimed in claim 4, comprising from 5 to 50% by weight, based on the molding materials, of at least one thermoplastic selected from the group consisting of polyesters, nylons, polyurethanes, polyolefins, polyvinyl chlorides and polyoxymethylenes.
- 19. The molding material of claim 1, wherein R.sup.1 and R.sup.2 are each independently C.sub.1-4 alkyl or C.sub.1-4 alkoxy, and R.sup.3 and R.sup.4 are each independently C.sub.1-4 alkyl, aryl or halogen-substituted alkyl, m is 1 and n and p are each independently 0, 1, 2 or 3.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3614753 |
Apr 1986 |
DEX |
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Parent Case Info
This is a division of application Ser. No. 036,446, filed Apr. 9, 1987 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4175175 |
Johnson et al. |
Nov 1979 |
|
4703081 |
Blackwell et al. |
Oct 1987 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
36446 |
Apr 1987 |
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