1. Field of the Invention
The present invention relates to a heat-transfer device.
2. Description of the Related Art
Heat exchangers, which allow two fluids at different temperatures to perform heat exchange, and heaters and coolers of fluids often use convective heat transfer, which is a form of heat transfer that uses heat transportation by flow. In the convective heat transfer, thermal energy is transferred from a heating or cooling surface through a heat conduction layer, a transition layer, and a convection layer to a fluid. The heat conduction layer is a fluid layer formed in a very thin region on the heating or cooling surface. In this layer, heat conduction due to fluid molecular diffusion is dominant rather than the heat transportation by flow. The heat conduction layer has a thickness determined by the Reynolds number Re, which is a dimensionless number representing the ratio of inertial forces to viscous forces in a flow, and the Prandtl number Pr, which is a dimensionless number representing the ratio of viscosity diffusion to thermal diffusion. As the Reynolds number and the Prandtl number increase, the thickness of the heat conduction layer decreases. With flow velocity represented by U [m/s], a flow characteristic length by D [m], and a fluid coefficient of kinematic viscosity by ν [m2/s], the Reynolds number is defined by an expression below.
Re=(UD)/ν (1)
With fluid thermal diffusivity represented by α [m2/s], the Prandtl number is defined by an expression below.
Pr=v/α (2)
A conventional technique to improve heat-transfer performance for a heat-transfer device, such as a heat exchanger, is described in JP 2005-69520 A. In this conventional technique, a plate-like copper is used as a heat transfer surface. This surface is chemically etched with an acid or alkaline mixed with carbon nanotubes, copper oxide nanoparticles, or aluminum oxide nanoparticles to form a nano-particle porous layer thereon.
However, the heat transfer enhancement technique described in JP 2005-69520 A uses the activation of molecular motion in a heat conduction layer on the nano-particle porous layer, and thus, the thickness of the heat conduction layer needs to be not more than a value several tens of times of the thickness of the nano-particle porous layer in order to obtain effect of the heat transfer enhancement up to a certain point. This technique, thus, suffers difficulty in obtaining the heat-transfer enhancement effect of the nano-particle porous layer sufficiently due to an increased thickness of the heat conduction layer in a field where the Reynolds number is small, in other words, in a low-velocity flow field (for example, in a range of 0 to 10 m/s).
An object of the invention is to obtain heat-transfer enhancement effect of a micro porous layer sufficiently even at low flow velocities.
The invention includes a micro porous layer and a plurality of heat-transfer enhancing structures on a surface of the heat transfer tube, the surface being in contact with the cold fluid.
The invention allows the heat-transfer enhancement effect of the micro porous layer to be obtained sufficiently even at low flow velocities.
The invention relates to a heat-transfer device usable as a heat exchanger, which allows two fluids at different temperatures to perform heat exchange, and as a heater or a cooler of a fluid. Some embodiments of the invention will now be described with reference to the drawings.
A first embodiment of the invention is a shell and tube heat exchanger with the heat-transfer device applied. This embodiment is capable of improving heat-transfer performance even under conditions of low flow velocities of a fluid used for heat exchange, in comparison with a conventional shell and tube heat exchanger.
There is a demand for enhanced convective heat transfer outside the heat transfer tubes because the convective heat transfer coefficient by the air flow outside the heat transfer tubes 101 is several hundredths of the condensation heat transfer coefficient by condensation heat transfer using the phase change of the vapor inside the heat transfer tubes 101. A micro porous layer 110 is formed on an outer surface 106 of each of the heat transfer tubes 101 to enhance the convective heat transfer outside the heat transfer tubes in the embodiment. The micro porous layer 110 is formed on the heat transfer tube outer surface 106 through a method described in JP 2005-69520 A before the heat transfer tubes 101 are welded onto the tube plates 102. The heat transfer tube outer surface 106 is chemically etched with an acid or alkali mixed with carbon nanotubes, copper oxide nanoparticles, or aluminum oxide nanoparticles to form a nano-particle porous layer on the heat transfer tube outer surface 106. A porous layer formed through an anodic oxidation method may be used as the micro porous layer 110 in place of the nano-particle porous layer. In a well-known anodic oxidation method, the heat transfer surface is machined for smoothing. Then, dc or ac voltage is applied to the heat transfer tubes 101 serving as the anode with a 3 to 8% oxalate solution serving as an electrolytic solution for electrochemical reaction on the outer surfaces 106 of the heat transfer tubes 101. The metal (for example, aluminum) of the outer surfaces of the heat transfer tubes dissolved by the electrochemical reaction bonds with oxygen in the electrolytic solution to form through metal oxidation a porous anodic oxide film, or a porous layer, on each of the heat transfer tube outer surfaces 106.
The micro porous layer 110 of each of the heat transfer tube outer surfaces 106 needs to have asperities thereon with a height h not more than several tens of times of the mean free path (the average distance travelled by a molecule before collision with another molecule) of molecules in order to activate air molecular motion for enhanced heat conduction. With gas pressure represented by P [Pa], temperature by T [K], and molecule diameter by d [m], the mean free path A is calculated with an expression below.
λ=3.11×10−24 T/(Pd2) (3)
The mean free path in the air at atmospheric pressure and 20° C. is approximately 0.06 μm. The height h of the asperities on the micro porous layer 110 on each of the heat transfer tube outer surfaces 106 is desirably not more than 10 μm in order to activate the air molecular motion. The micro porous layer 110 may be formed in any other method in place of the method described above as long as the height of the asperities is not more than 10 μm.
A plurality of heat-transfer enhancing structures 107 is installed on each of the heat transfer tube outer surfaces 106 to further improve the heat transfer enhancement by the micro porous layer 110. The heat-transfer enhancing structures 107 are formed with a metal material, such as aluminum, copper, and SUS. Other materials, such as a heat resistant rubber and a heat resistant resin, may be used to improve manufacturability. The heat-transfer enhancing structures 107 may each have a section of any form, such as triangular, rectangular, and circular sections, as long as its height can be defined.
A result of a component test will now be discussed, which has been conducted for a heat-transfer performance improvement ratio with the micro porous layer 110 and the heat-transfer enhancing structures 107 used in combination. The component test has been conducted with a low-velocity flow field at the flow velocity of 10 m/s.
Under high flow velocity conditions, in which the micro porous layer 110 used alone can yield the heat-transfer enhancement effect, the arrangement according to the embodiment with the use of the heat-transfer enhancing structures further reduces the thickness of the heat conduction layer, thereby further increasing the heat-transfer enhancement effect of the micro porous layer.
The embodiment described above can produce the heat-transfer enhancement effect even under low air flow velocity conditions. In comparison with a heat exchanger with the micro porous layers alone applied to the heat transfer tube outer surfaces, the embodiment can further increase the heat-transfer enhancement effect under an identical flow velocity condition. In comparison with a heat exchanger without the embodiment, the embodiment can achieve an improvement in heat-transfer performance, thereby reducing the number of heat transfer tubes and reducing costs of the heat exchanger.
A second embodiment is a shell and tube heat exchanger with the heat-transfer device applied. This embodiment is capable of improving the heat-transfer performance even under conditions of low flow velocities of a fluid used for heat exchange, in comparison with a conventional shell and tube heat exchanger. The embodiment can also curb vibration of heat transfer tubes that accompanies the condensation of vapor.
A micro porous layer 110 described in the first embodiment is formed on the outer surface of each heat transfer tube 101 to enhance heat transfer. A plurality of heat-transfer enhancing structures 112 is installed to obtain the heat-transfer enhancement effect of the micro porous layer 110 under low air flow velocity conditions. The heat-transfer enhancing structures 112 according to the embodiment are formed with rods. The heat-transfer enhancing structures 112 are made with a metal material, such as aluminum, copper, and SUS. Other materials, such as a heat resistant rubber and a heat resistant resin, may be used to improve manufacturability. The heat-transfer enhancing structures 112 may each have a section of any form, such as triangular, rectangular, and circular sections, as long as its height H [m] can be defined. Each of the heat-transfer enhancing structures 112 is secured at both ends to an inner surface of a shell 100 through welding or bonding. The heat-transfer enhancing structures 112 are arranged so that the heat transfer tubes 101 are interposed therebetween, thereby securing the heat transfer tubes 101. This can curb the vibration of the heat transfer tubes 101 due to reasons including vapor condensation within the tubes. The heat-transfer enhancing structures 112 cause turbulence to obtain the heat-transfer enhancement effect of the micro porous layer 110 even under low air flow velocity conditions. To allow the heat-transfer enhancing structures 112 to generate sufficient turbulence, the height H of the heat-transfer enhancing structures 112 desirably satisfies its relationship to the characteristic length D [m] of the flow of H/D≧0.01. The characteristic length D of the flow is a hydraulic equivalent diameter for the flow along the tubes in the embodiment. The characteristic length D will be a tube inner diameter for a flow inside the tube. The air flow turbulence caused by one of the heat-transfer enhancing structures 112 is dampened toward the downstream due to viscosity of the fluid. To maintain the turbulence, the plurality of heat-transfer enhancing structures 112 is installed in the flow direction. A clearance L between the heat-transfer enhancing structures 112 in the flow direction desirably satisfies L/H≦300 in consideration of the dampening effect of the fluid viscosity on the turbulence. Under high flow velocity conditions, in which the micro porous layer 110 used alone can yield the heat-transfer enhancement effect, the arrangement according to the embodiment with the use of the heat-transfer enhancing structures further reduces the thickness of the heat conduction layer, thereby further increasing the heat-transfer enhancement effect of the micro porous layer.
The embodiment described above can produce the heat-transfer enhancement effect even under low air flow velocity conditions. In comparison with a heat exchanger with the micro porous layers alone applied to the heat transfer tube outer surfaces, the embodiment can further increase the heat-transfer enhancement effect under an identical flow velocity condition. In comparison with a heat exchanger without the embodiment, the embodiment can achieve an improvement in heat-transfer performance, thereby reducing the number of heat transfer tubes and reducing costs of the heat exchanger. Additionally, the embodiment can curb the vibration of the heat transfer tubes that accompanies the condensation of vapor.
Number | Date | Country | Kind |
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2013-135740 | Jun 2013 | JP | national |