BACKGROUND
The disclosure relates to a heat dissipation device, more particularly to a heat dissipation device including wick structures in a heat pipe and a vapor chamber that are connected to each other.
DESCRIPTION OF THE PRIOR ART
Generally, a heat transfer device includes a heat transfer plate, a heat pipe and a heat dissipater (e.g., fins and fan) to dissipate heat generated by a heat source. In detail, the heat transfer plate contacts the heat source to absorb heat, and the heat pipe is disposed between the heat transfer plate and the heat dissipater to transfer the heat to the heat dissipater in order to dissipate the heat via the heat dissipater.
In conventional heat transfer devices, wick structures in both the heat transfer plate and the heat pipe are proximate with each other but not connected to each other, which causes the heat transfer plate and the heat pipe to work separately because the wick structures have a larger attraction force to the working fluid than gravity. This situation reduces the flow of the working fluid, causing a decrease in the heat dissipation efficiency of the heat transfer device.
BRIEF DESCRIPTION OF THE DRAWINGS
The following figures are included to illustrate certain aspects of the embodiments, and should not be viewed as exclusive embodiments. The subject matter disclosed is capable of considerable modifications, alterations, combinations, and equivalents in form and function, as will occur to those skilled in the art and having the benefit of this disclosure.
FIG. 1 is an exploded view illustrating an embodiment of a vapor chamber.
FIG. 2 is a perspective view of the vapor chamber of FIG. 1 without the cover board.
FIG. 3 is a perspective view of a third capillary structure included in the vapor chamber in FIG. 2.
FIG. 4 is a sectional view of the vapor chamber of FIG. 1 prior to the cover board being sunk.
FIG. 5 is a sectional view of the vapor chamber of FIG. 1 after the cover board is sunk.
FIG. 6 is a sectional view of the vapor chamber of FIG. 1, according to example embodiments.
FIG. 7 is a perspective of a vapor chamber, according to example embodiments.
FIG. 8 is a perspective view of a vapor chamber without a cover board, according to example embodiments.
FIG. 9 is a perspective view of a vapor chamber of FIG. 8 including the cover board and a capillary structure, according to example embodiments.
FIG. 10 is a sectional view of the vapor chamber of FIG. 9.
FIG. 11 is a perspective view of a heat dissipation device, according to example embodiments of the present disclosure.
FIG. 12 is an exploded view of FIG. 11.
FIG. 13 is a perspective view of a base part, a first wick structure, a heat pipe and a bonding layer in FIG. 11.
FIG. 14 is a cross-sectional view of FIG. 11.
FIG. 15 is a perspective view of the heat pipe in FIG. 12.
FIGS. 16-26 are perspective views of different configurations of heat pipes, according to example embodiments of the present disclosure.
FIG. 27 is a perspective view of another heat pipe, according to example embodiments.
FIG. 28 is a cross-sectional view of the heat pipe of FIG. 27.
FIG. 29 illustrates a cross-sectional view of an assembly including the heat pipe of FIG. 27 coupled to a vapor chamber.
FIG. 30 is a cross-sectional view of an assembly including a heat pipe coupled to a vapor chamber, according to example embodiments.
FIG. 31 is an exploded view of a heat dissipation device, according to an example embodiment of the present disclosure.
FIG. 32 is a cross-sectional view of the heat dissipation device in FIG. 31.
DETAILED DESCRIPTION
The detailed description and features of the example embodiments are depicted along with drawings in the following. However, the drawings are used for illustration purpose only, so the example embodiments are not limited to the drawings.
Example embodiments are directed to a communication-type thermal conduction device. FIGS. 1 to 7 illustrate an example embodiment of the communication-type thermal conduction device and FIGS. 8 to 10 illustrate another example embodiment of the communication-type thermal conduction device.
As shown in FIGS. 1 to 7, the communication-type thermal conduction device comprises a vapor chamber 1 and at least one heat pipe 2. The communication-type thermal conduction device further comprises a working fluid (not shown) flowing between the vapor chamber 1 and the heat pipe 2.
The vapor chamber 1 has a bottom board 11 and a cover board 12, wherein the bottom board 11 and the cover board 12 are opposite to each other. After assembling the bottom board 11 and the cover board 12, a chamber 10 (as shown in FIG. 6) is formed between the bottom board 11 and the cover board 12. The vapor chamber 1 may be a structure formed integrally or an assembled structure. In this embodiment, an assembled structure is used for illustrating the example embodiments. That is to say, the cover board 12 can be assembled with the bottom board 11, so as to form the vapor chamber 1 with the chamber 10 therein.
A first capillary structure 13 is disposed on an inner surface of the bottom board 11 and a fourth capillary structure 14 (as shown in FIG. 6) is disposed on an inner surface of the cover board 12, wherein the first and fourth capillary structures 13, 14 are opposite to each other. The first and fourth capillary structures 13, 14 may be powder sintered structures, ceramic sintered structures, metal mesh structures, fiber bundle structures, metal grooves and so on. The first and fourth capillary structures 13, 14 are not limited to any specific structures. The fiber bundle structure is a structure consisting of a plurality of fiber bundles adjacent to each other. However, in some embodiments, the inner surface of the cover board 12 does not have the fourth capillary structure 14 disposed thereon. In other words, only the inner surface of the bottom board 11 has the first capillary structure 13 disposed thereon.
The heat pipe 2 is a hollow tube and a second capillary structure 21 is disposed in the heat pipe 2. One end portion 20 of the heat pipe 2 is connected to the bottom board 11. The end portion 20 has an open portion 22 in communication with the hollow inside of the heat pipe 2 and the chamber 10 of the vapor chamber 1 and for vapor to flow. The second capillary structure 21 has a connected portion 211 exposed by means of the open portion 22.
The third capillary structure 3 (as shown in FIG. 3) is connected between the first capillary structure 13 and the connected portion 211 of the second capillary structure 21, so that the first and second capillary structures 13, 21 are in communication with each other. Therefore, the first capillary structure 13 disposed in the vapor chamber 1 and the second capillary structure 21 disposed in the heat pipe 2 can be connected and in communication with each other, so as to achieve holistic thermal conduction. Accordingly, the vapor chamber 1 incorporating the heat pipe 2 can fully provide the desired heat dissipation effect.
In this embodiment, a surrounding board 15 surrounds a periphery of the bottom board 11, and the end portion 20 of the heat pipe 2 may be inserted into and in communication with the surrounding board 15 (not shown), so that the heat pipe 2 is arranged with the vapor chamber 1 side by side. Alternatively, the surrounding board 15 may have a hole 151 formed therein, and the end portion 20 of the heat pipe 2 may be connected to an inner bottom surface of the bottom board 11 through the hole 151 (as shown in FIG. 2), so that the heat pipe 2 is arranged with the vapor chamber 1 side by side. In detail, for illustration purposes, the so-called “arranged side by side” means that the heat pipe 2 is substantially parallel to the vapor chamber 1. Accordingly, the connected portion 211 of the second capillary structure 21 is also arranged with the first capillary structure 13 side by side, so as to enhance the connection. After the third capillary structure 3 is connected to the first capillary structure 13 and the connected portion 211 of the second capillary structure 21, the first, second and third capillary structures 13, 21, 3 are arranged side by side, so as to be applied to the thin vapor chamber 1 and the flat heat pipe 2.
Furthermore, the open portion 22 of the heat pipe 2 may comprise an opening 221 formed on an end of the heat pipe 2 (i.e. one of both ends of the heat pipe 2) and the connected portion 211 is exposed by means of the opening 221. In detail, for illustration purposes, the so-called “exposed” means that the connected portion 211 does not protrude out of the opening 221. The opening 221 of the heat pipe 2 is in communication with the chamber 10 of the vapor chamber 1, wherein vapor can flow through the opening 221 and the opening 221 is contributive to connect the third capillary structure 3.
Moreover, the third capillary structure 3 may be formed by a powder sintering process manner or a ceramic sintering process and connected between the first capillary structure 13 and the connected portion 211 (as shown in FIGS. 3 to 6). Alternatively, the third capillary structure 3 may be a metal mesh structure or a fiber bundle structure (not shown). In other words, the example embodiments are not limited to any specific structure of the third capillary structure 3.
Still further, as shown in FIGS. 4, 5 and 7, the cover board 12 is sealed on an open edge of the surrounding board 15, so as to seal the vapor chamber 1 and form the chamber 10. A gap G is formed between a side of the end portion 20 and the surrounding board 15 corresponding to the hole 151. A filler 1211 is formed on the cover board 12 and corresponds to the gap G and the filler 1211 is filled in the gap G correspondingly. In this embodiment, the filler 1211 is formed by sinking the cover board 12 correspondingly. In detail, the cover board 12 has an inner surface 121 and an outer surface 122 corresponding to each other, and a position of the outer surface 122 of the cover board 12 is sunk to form a recess portion 1221, so that the filler 1211 extends from the inner surface 121 of the cover board 12 integrally. The filler 1211 is filled in the gap G correspondingly, so that the heat pipe 2 can be more suitable for the hole 151 of the vapor chamber 1 and the heat pipe 2 can be welded to the vapor chamber more easily. Needless to say, the filler 1211 may also be an individual object filled in the gap G. In other words, the filler 1211 is not limited to the structure corresponding to the recess portion 1211 and the filler 1211 may be an individual object.
FIGS. 8 to 10 illustrate a communication-type thermal conduction device, according to example embodiments. The communication-type thermal conduction device in FIGS. 8-10 is substantially similar to the communication-type thermal conduction device in FIGS. 1-7, and may be understood with reference thereto. The difference is that the end portion 20a of the heat pipe 2 of the second embodiment is different from the end portion 20 of the first embodiment and the vapor chamber 1 of the second embodiment is also different from the vapor chamber 1 of the first embodiment. The details are depicted in the following.
As illustrated, the end portion 20a further comprises a breach 222. The breach 222 is formed on a periphery of the end portion 20a (i.e. the body of the heat pipe 2), and the breach 222 is connected to and in communication with the aforesaid opening 221, so that the third capillary structure 3 can be connected more conveniently and easily. Accordingly, the end portion 20a may form a mandible portion 23 by means of the open portion 22, the connected portion 211 is located at an inner surface of the mandible portion 23, and the connected portion 211 is exposed through the open portion 22 including the opening 221 and the breach 222.
A surrounding board 15 surrounds a periphery of the bottom board 11a to form a recess space 111 and a communication neck 17 extends from the bottom board 11a and the surrounding board 15 outwardly, so that the communication neck 17 is in communication with the recess space 111 and an outside of the vapor chamber 1. The heat pipe 2 and the mandible portion 23 of the end portion 20a thereof are connected to an inner bottom surface 171 of the communication neck 17, so as to enhance the connection of the heat pipe 2.
Furthermore, as shown in FIGS. 1 to 3, a first support structure 16 is disposed in the vapor chamber 1. A plurality of support pillars 161 is used for illustration purposes, wherein the support pillars 161 support the bottom board 11 (11a) and the cover board 12 (12a), so as to prevent the vapor chamber 1 from deforming when the vapor chamber 1 is vacuumized.
Moreover, a second support structure (not shown) may be disposed in the heat pipe 2, so that the second support structure can support the flat heat pipe 2 therein, so as to prevent the heat pipe 2 from breaking when the heat pipe 2 is flatted. Still further, the third capillary structure 3 may be formed with the first capillary structure 13 or the second capillary structure 21 integrally. For example, the third capillary structure 3 and the first capillary structure 13 (or the third capillary structure 3 and the second capillary structure 21) both may be formed by a powder sintering process or a ceramic sintering process integrally.
As mentioned in above, compared to the prior art, example embodiments provide numerous advantages. According to example embodiments, the second capillary structure 21 of the heat pipe 2 is connected and in communication with the first capillary structure 13 of the vapor chamber 1, so as to achieve holistic thermal conduction. Accordingly, the vapor chamber 1 incorporating the heat pipe 2 can fully provide the desired heat dissipation effect.
Further, by arranging the first, second and third capillary structures 13, 21, 3 side by side, example embodiments can be used in the thin vapor chamber 1 and the flat heat pipe 2. The open portion 22 is contributive to connect the third capillary structure 3. Especially, when the open portion 22 comprises the opening 221 and the breach 222, the mandible portion 23 can be formed, so that the third capillary structure 3 can be connected more conveniently and easily. By means of sinking the cover board 12, 12a to form the recess portion 1221, the filler 1211 extending from the inner surface of the cover board can be filled in the gap G between the heat pipe 2 and the vapor chamber 1, so that the heat pipe 2 is more suitable for the hole 151 of the vapor chamber 1. Accordingly, the heat pipe 2 can be welded to the vapor chamber 1 more easily. Since the communication neck 17 extends from the vapor chamber 1 integrally, the heat pipe 2 can be connected to the vapor chamber 1 securely. Using the first support structure 16 and the second support structure, the vapor chamber 1, according to example embodiments, is prevented from deforming when the vapor chamber 1 is vacuumized and the heat pipe 2 is prevented from breaking when the heat pipe 2 is flatted.
FIG. 11 is a perspective view of a heat dissipation device, according to example embodiments of the present disclosure. FIG. 12 is an exploded view of FIG. 11. FIG. 13 is a perspective view of a base part, a first wick structure, a heat pipe and a bonding layer in FIG. 11 assembled together. FIG. 14 is a cross-sectional view of FIG. 11. FIG. 15 is a perspective view of the heat pipe in FIG. 12
According to example embodiments, a heat dissipation device 10a includes a vapor chamber 100a and a heat pipe 200a, and a working fluid (not shown in figures) flows through the vapor chamber 100a and the heat pipe 200a.
The vapor chamber 100a includes a heat conduction chamber 110a. The heat conduction chamber 110a includes a base part 111a and a cover part 112a. The base part 111a includes a base portion 1111a, a surrounding portion 1112a, and a recessed portion 1113a in the surrounding portion 1112a. The surrounding portion 1112a is disposed along the periphery of the base portion 1111a, and forms a rim of the base portion 1111a. The base portion 1111a and the surrounding portion 1112a cooperatively define a recessed space S1. The recessed portion 1113a may define an opening to the recessed space S1. The recessed portion 1113a defines a bearing surface 1114a and is sized and shaped (or otherwise configured) to receive the heat pipe 200a.
In an assembled state, the cover part 112a is disposed on and contacts the surrounding portion 1112a of the base part 111a so as to form a chamber C1 (FIG. 14) between the base part 111a and the cover part 112a. The chamber C1 is shaped and sized (or otherwise configured) to receive and accommodate the working fluid (not shown in figures) through the vapor chamber 100a and the heat pipe 200a. Although the base part 111a and the cover part 112a are disclosed as two individual pieces that are assembled together, example embodiments are not limited thereto. In other embodiments, the base part 111a and the cover part 112a may be made of a single piece.
A first wick structure 120a is included in the vapor chamber 100a, and is stacked on (and contacts) the base portion 1111a of the base part 111a and is between the base part 111a and the cover part 112a. The first wick structure 120a is or includes, for example, a ceramics sintered body, but the first wick structure 120a is not limited thereto. In other embodiments, the first wick structure 120a may be or include a micro slit, a metal mesh, a powder sintered body, a ceramics sintered body, combination thereof, and the like. For example, the first wick structure 120a may be a composite of ceramics powder sintered body and micro slit.
The vapor chamber 100a also includes a second wick structure 130a. The second wick structure 130a is stacked on (and contacts) the cover part 112a and is between the base part 111a and the cover part 112a. However, embodiments are not limited in this regard. In other embodiments, the second wick structure 130a may be omitted, and thus the vapor chamber 100a may only include the first wick structure 120a.
The cover part 112a defines a stamped portion 1121a corresponding to the recessed portion 1113a of the base part 111a. The stamped portion 1121a is shaped and sized (or otherwise configured) to fluidly couple the heat pipe 200a to the heat conduction chamber 110a, as illustrated in FIG. 13.
Referring to FIG. 15, the heat pipe 200a includes a pipe body 210a and a wick structure 220a. The pipe body 210a is a flat, tubular, elongated hollow pipe structure having a tubular inner surface 211a. The pipe body 210a has an open end 212a and a closed end 213a opposite to each other. The open end 212a of the pipe body 210a has an opening 214a and a side edge 215a which forms the opening 214a.
The wick structure 220a is annularly formed on and in contact with the tubular inner surface 211a of the pipe body 210a. The wick structure 220a extends between the open end 212a and the closed end 213a, and one end of the wick structure 220a contacts or is connected to the inner surface of the pipe body 210a at closed end 213a, and the other opposite end of the wick structure 220a is aligned (flush) with the side edge 215a. In an example, the length of the wick structure 220a is approximately the same as the length of the pipe body 210a.
The wick structure 220a includes, for example, a powder sintered body, but is not limited in this regard. In other embodiments, the wick structure 220a may be or include micro slits, metal mesh, powder sintered body, ceramics sintered body, a combination thereof, and the like. For example, the wick structure 220a may be a composite of powder sintered body and metal mesh.
The open end 212a of the heat pipe 200a is disposed in the recessed portion 1113a and contacts the bearing surface 1114a of the recessed portion 1113a, and the heat pipe 200a is clamped between the stamped portion 1121a and the recessed portion 1113a. The wick structure 220a is connected to (or linked to) the wick structures 120a and 130a via metallic bonding.
Referring to FIG. 14, the heat dissipation device 10a further includes two bonding layers 310a and 320a. The bonding layers 310a and 320a include Au, Ag, Cu or Fe powder. The bonding layers 310a and 320a are made into porous structures by sintering or other similar processes. As illustrated in FIG. 14, one end of the bonding layer 310a is connected to (or linked to) the wick structure 120a via metallic bonding, and the other opposite end of the bonding layer 310a is connected to (or linked to) the wick structure 220a via metallic bonding. Similarly, one end of the bonding layer 320a is connected to (or linked to) the wick structure 130a by metallic bonding, and the other opposite end of the bonding layer 320a is connected to (or linked to) the wick structure 220a via metallic bonding. In an embodiment and as illustrated, the wick structures 120a and 130a are axially separated (or spaced apart) from the wick structure 220a, and are connected (or otherwise coupled) to the wick structure 220a via the bonding layers 310a and 320a using metallic bonding. As illustrated in FIG. 14, the bonding layer 310a overlaps portions of the wick structure 120a and the wick structure 220a which are arranged adjacent each other (in parallel). Similarly, the bonding layer 320a overlaps portions of the wick structure 130a and the wick structure 220a which are arranged adjacent each other (in parallel). Such a configuration permits use of a vapor chamber 100a having a reduced vertical extent (e.g., with reference to FIG. 14) and a relatively flat heat pipe 200a. Although embodiments disclose metallic bonding between the wick structures 120a, 130a and wick structure 220a, other types of bonding can also be used without departing from the scope of the disclosure.
The base part 111a includes a plurality of supporting structures 1115a (e.g., FIGS. 12 and 13). Each of the supporting structures 1115a is, for example, a protrusion that extends vertically from the base portion 1111a of the base part 111a. The wick structure 120a includes a plurality of through holes 121a, and the wick structure 130a includes a plurality of through holes 131a. The through holes 121a and 131a correspond to the wick structures 120a and 130a. When the wick structures 120a and 130a are arranged in the chamber C1, and the supporting structures 1115a are respectively received in the through holes 121a and 131a. The supporting structures 1115a contact the cover part 112a and provide support to the cover part 112a to limit the vapor chamber 100a from deforming operation, for example, during a vacuuming process.
The wick structure 120a and the wick structure 220a are connected to each other via the bonding layer 310a. The working fluid flows between the wick structure 120a and the wick structure 220a, and the wick structure 120a and the wick structure 220a operate as a single unit to improve the flow of the working fluid from the wick structure 220a to the wick structure 120a. Similarly, the wick structure 130a and the wick structure 220a operate as a single unit to improve the flow of the working fluid from the wick structure 220a to the wick structure 130a. Thus, heat dissipation efficiency of the heat dissipation device 10a is improved.
In the embodiments illustrated in FIGS. 11-15, the heat dissipation device 10a includes a single heat pipe 200a. However, embodiments are not limited in this regard. In other embodiments, the heat dissipation device 10a may include more than one heat pipe 200a that are coupled to the vapor chamber 100a via a corresponding number of recessed portions 1113a.
Although the wick structure 220a of the heat pipe 200a is disclosed as being metallically bonded to the wick structures 120a and 130a, embodiments are not limited in this regard. In other embodiments, the wick structure 220a of the heat pipe 200a may be metallically bonded to either the wick structure 120a or the wick structure 130a, not both.
A method of manufacturing a heat dissipation device, includes providing a vapor chamber 100a having a first wick structure 120a, coupling a heat pipe 200a including a second wick structure 220 to the vapor chamber 100a, providing a metal powder to cover at least part of the first wick structure 120a and at least part of the second wick structure 220, and performing a sintering process to transform the metal powder into a bonding layer to metallically bond the first wick structure 120a and the second wick structure 220 to each other.
FIGS. 16-22 are perspective views of different configurations of heat pipes 200b-h according to example embodiments. The heat pipes 200b-h may be used in the heat dissipation device 10a, wherein the heat pipes 200b-h are coupled to the vapor chamber 100a.
As illustrated in FIG. 16, a heat pipe 200b includes a generally tubular pipe body 210b having a tubular inner surface 211b, an open end 212b and a closed end 213b axially opposite the open end 212b. A wick structure 220b is disposed annularly on and lines the tubular inner surface 211b. The open end 212b of the pipe body 210b has an opening 214b that is formed by a side edge 215b of the pipe body 210b at the open end 212b. As illustrated, the wick structure 220b does not contact the closed end 213b (or specifically, the inner surface of the pipe body 210a at the closed end 213b). One end of the wick structure 220b is spaced from the closed end 213b, and the opposite end of the wick structure 220b is aligned (or flush) with the side edge 215b of the pipe body 210b. In an embodiment, and as illustrated, the length (e.g., axial extent) of the wick structure 220b is half the length of the pipe body 210b. However, embodiments are not limited thereto. In other embodiments, the length of the wick structure 220b may be greater than or less than half the length of the pipe body 210b.
As illustrated in FIG. 17, a heat pipe 200c includes a generally tubular pipe body 210c having a tubular inner surface 211c, an open end 212c and a closed end 213c axially opposite the open end 212c. The open end 212c of the pipe body 210c has an opening 214c that is formed by a side edge 215c of the pipe body 210c. A wick structure 220c is disposed annularly on and lines the tubular inner surface 211c of the pipe body 210c. One end of the second wick structure 220c is connected to (or otherwise contacts) the inner surface of the pipe body 210a at the closed end 213c, and the other opposite end of the wick structure 220c protrudes a certain distance from the opening 214c. As illustrated, the wick structure 220c includes a protruding portion 221c that protrudes (or extends) from the side edge 215c of the pipe body 210c. Thus, as illustrated, the wick structure 220c has a length longer than the length of the pipe body 210c.
As illustrated in FIG. 18, a heat pipe 200d includes a generally tubular pipe body 210d having a tubular inner surface 211d, an open end 212d and a closed end 213d axially opposite to the open end 212d. The open end 212d of the pipe body 210d has an opening 214d that is formed by a side edge 215d of the pipe body 210b. A wick structure 220d is disposed annularly on and lines the tubular inner surface 211d of the pipe body 210d. One end of the wick structure 220d is axially spaced from the closed end 213d (more specifically, from the inner surface of the pipe body 210a at the closed end 213d), and the other opposite end of the wick structure 220d protrudes (or otherwise extends) a certain distance from the opening 214d. As illustrated, the wick structure 220d has a protruding portion 221d at a distal end thereof and that protrudes from the side edge 215d of the pipe body 210d. In an embodiment, the wick structure 220d may have a length greater than half the length of the pipe body 210d. However, embodiments are not limited thereto. In other embodiments, the wick structure 220d may have any desired length, while still protruding from the opening 214d.
As illustrated in FIG. 19, a heat pipe 200e includes a generally tubular pipe body 210e having a tubular inner surface 211e, an open end 212e and a closed end 213e axially opposite to the open end 212e. The open end 212e of the pipe body 210e has an opening 214e that is formed by a side edge 215e of the pipe body 210e. A wick structure 220e is disposed only on a portion of the tubular inner surface 211e. In other words, the wick structure 220e does not line the entire tubular inner surface 211e. As illustrated, the wick structure 220e is disposed on the entire bottom portion of the tubular inner surface 211e and does not line the top portion of the tubular inner surface 211e. One end of the wick structure 220e contacts the closed end 213e (more specifically, from the inner surface of the pipe body 210e at the closed end 213e), and the other opposite end of the wick structure 220e protrudes (or otherwise extends) a certain distance from the opening 214e. As illustrated, the wick structure 220e has a protruding portion 221e at a distal end thereof that protrudes from the side edge 215e of the pipe body 210e. In an embodiment, the axial length of the wick structure 220e is longer than the axial length of the pipe body 210e.
As illustrated in FIG. 20, a heat pipe 200f includes a generally tubular pipe body 210f having a tubular inner surface 211f, an open end 212f and a closed end 213f axially opposite to the open end 212f. The open end 212f of the pipe body 210f has an opening 214f that is formed by a side edge 215f of the pipe body 210f. A wick structure 220f is disposed on only a portion of the tubular inner surface 211f. Stated otherwise, the wick structure 220f does not line the entire tubular inner surface 211f. As illustrated, the wick structure 220f is disposed on only a portion of the tubular inner surface 211f at the bottom. One end of the wick structure 220f is axially spaced from the closed end 213f (more specifically, from the inner surface of the pipe body 210f at the closed end 213f), and the other opposite end of the second wick structure 220f protrudes (or otherwise extends) a certain distance from the opening 214f. As illustrated, the wick structure 220f has a protruding portion 221f at a distal end thereof that protrudes from the side edge 215f of the pipe body 210f. In an embodiment, the wick structure 220f may have a length greater than half the length of the pipe body 210f. However, embodiments are not limited thereto. In other embodiments, the wick structure 220f may be of any desired length, while still protruding from the opening 214f.
As illustrated in FIG. 21, a heat pipe 200g includes a generally tubular pipe body 210g having a tubular inner surface 211g, an open end 212g and a closed end 213g axially opposite to the open end 212g. The open end 212g of the pipe body 210g has an opening 214g that is formed by a side edge 215g. A wick structure 220g is disposed only on a portion of the tubular inner surface 211g. In other words, the wick structure 220g does not line the entire tubular inner surface 211g. As illustrated, the wick structure 220g is disposed on the entire bottom portion of the tubular inner surface 211g and does not line the top portion of the tubular inner surface 211g. One end of the wick structure 220g contacts the closed end 213g (more specifically, the inner surface of the pipe body 210g at the closed end 213g), and the other opposite end of the wick structure 220g is aligned or flush with the side edge 215g. A length of the wick structure 220g is approximately the same as the length of the pipe body 210g. In addition, the pipe body 210g includes a cut-off 216g. The cut-off 216g extends a certain distance axially (or longitudinally) along the pipe body 210g from the side edge 215g towards the closed end 213g. The cut-off 216g is indented on the side edge 215g and is fluidly coupled to the opening 214g. When the heat pipe 200g is coupled to the vapor chamber 100a, the wick structure 220g is metallically bonded to the wick structure 120a using the bonding layer 310a that is deposited on the wick structures 220g and 120a. The bonding layer 310a is formed by sintering metal powder. The cut-off 216g exposes the wick structures 220g and 120a, and this permits spreading the metal powder over wick structures 220g and 120a relatively easy. In an embodiment, the cut-off 216g may engage or couple to a protrusion of wick structures 120a and/or 130a (FIGS. 11-15).
FIG. 22 illustrates a heat pipe 200h includes a generally tubular pipe body 210h having a tubular inner surface 211h, an open end 212h and a closed end 213h axially opposite to the open end 212h. The open end 212h of the pipe body 210h has an opening 214h that is formed by a side edge 215h of the pipe body 210h. A wick structure 220h is disposed only on a portion of the tubular inner surface 211h. Stated otherwise, the wick structure 220h does not line the entire tubular inner surface 211h. As illustrated, the wick structure 220h is disposed on only a portion of the tubular inner surface 211h at the bottom. One end of the wick structure 220h is axially spaced from the closed end 213h (more specifically, from the inner surface of the pipe body 210h at the closed end 213h), and the other opposite end of the wick structure 220h is aligned (flush) with the side edge 215h. In an embodiment, the axial length of the wick structure 220h is the same as half the axial length of the pipe body 210h. However, embodiments are not limited thereto. In other embodiments, the wick structure 220h may be greater than or less than half the length of the pipe body 210h. The pipe body 210h includes a cut-off 216h that extends a certain distance axially along the pipe body 210h from the side edge 215h towards the closed end 213h. The cut-off 216h is indented from the side edge 215h and fluidly coupled to the opening 214h. As discussed above, the cut-off 216h makes spreading the metal powder over wick structures 220h and 120a relatively easy.
As discussed above, the heat pipes 200f-200h in FIGS. 19 to 22 only contain one wick structure 220f-220h. However, embodiments are not limited thereto. In other embodiments, a heat pipe may have include another wick structure, for instance, disposed opposite the corresponding wick structure 220f-h and on the corresponding tubular inner surfaces 211f-h. The two wick structures may be bonded (e.g., metallically) to one of the wick structures 120a and 130a (FIGS. 1-5).
FIGS. 23-26 are perspective views of different configurations of heat pipes 200i, 200j, 200k, and 200m, according to example embodiments.
As shown in FIG. 23, a heat pipe 200i includes a generally tubular pipe body 210i having an open end 212i and a closed end 213i axially opposite to each other. The open end 212i of the pipe body 210i has a side edge 215i. A wick structure 220i is disposed along the tubular inner surface 211i of the pipe body 210i and includes, for example, micro slits. As illustrated, the wick structure 220i lines the tubular inner surface 211i. One end of the wick structure 220i contacts the closed end 213i (more specifically, the inner surface of the pipe body), and the other opposite end of the wick structure 220i is aligned (flush) with the side edge 215i of the pipe body 210i. In an embodiment, the length of the wick structure 220i is equal to the axial length of the pipe body 210i.
As illustrated in FIG. 24, a heat pipe 200j includes a generally tubular pipe body 210j having an open end 212j and a closed end 213j axially opposite each other. The open end 212j of the pipe body 210j has a side edge 215j. A second wick structure 220j is disposed along and lines the tubular inner surface 211j of the pipe body 210j and includes, for example, micro slits. One end of the wick structure 220j is axially spaced from the closed end 213j, and the other opposite end of the second wick structure 220j is aligned (flush) with the side edge 215j of the pipe body 210j. In an embodiment, the axial length of the wick structure 220j is approximately half the length of the pipe body 210j. However, embodiments are not limited thereto. In other embodiments, the axial length of the wick structure 220j may be greater than or less than half the length of the pipe body 210j.
As illustrated in FIG. 25, a heat pipe 200k includes a pipe body 210k having an open end 212k and a closed end 213k axially opposite each other. The open end 212k of the pipe body 210k has a side edge 215k. Two wick structures 220k are disposed in the pipe body 210k and are vertically separated from each other. As illustrated, the wick structures 220k are disposed vertically opposite each other and line the tubular inner surface 211k of the pipe body 210k. The wick structures 220k include, for example, micro slits. One axial end of each wick structure 220k is connected to the closed end 213k (more specifically, the inner surface of the pipe body), and the other axially opposite side is aligned (flush) with the side edge 215k of the pipe body 210k. In an embodiment, the length of each wick structure 220k is approximately the same as the length of the pipe body 210k.
As illustrated in FIG. 26, a heat pipe 200m includes a pipe body 210m having an open end 212m and a closed end 213m. The open end 212m of the pipe body 210m has a side edge 215m. Two wick structures 220m are disposed in the pipe body 210m and are vertically separated from each other. As illustrated, the wick structures 220m are disposed vertically opposite each other and line the tubular inner surface 211m of the pipe body 210m. However, in an embodiment, and as illustrated, the wick structures 220m do not line the entire axial extent of the tubular inner surface 211m. The wick structures 220m include, for example, micro slits. One axial end of each wick structure 220m is axially spaced from the closed end 213m, and the other axially opposite end is aligned (flush) with the side edge 215m of the pipe body 210m. In an embodiment, the length of each wick structure 220m is approximately half the length of the pipe body 210m. However, embodiments are not limited in this regard, and the each wick structure 220m may have a length greater than or less than half the length of the pipe body 210m. In some other embodiments, each wick structure 220m may have different lengths.
The wick structures 220m include metal mesh, powder sintered body, ceramics sintered body, micro slits, combination thereof, and the like. However, the wick structures 220m are not limited in this regard.
FIG. 27 is a perspective view of a heat pipe 200n according to example embodiments, and FIG. 28 is a cross-sectional view of the heat pipe 200n taken along the 18-18 plane.
The heat pipe 200n includes a pipe body 210n having an open end 212n and a closed end 213n axially opposite each other. The open end 212n of the pipe body 210n has a side edge 215n. Two wick structures 220n are disposed in the pipe body 210n.
As illustrated, the wick structures 220n are composite wick structures. Each wick structure 220n includes a first layer 2201n and a second layer 2202n. The first layer 2201n is disposed on and contacts (e.g., lines) an inner surface 211n of the pipe body 210n. The inner surface 211n is an uneven (e.g., jagged or toothed) surface that may be formed using known methods like etching or button rifling. The first layer 2201n is correspondingly uneven. The second layer 2202n is exposed to the interior of the heat pipe 200n and defines an internal passageway 231 of the heat pipe 200n. The first layer 2201n includes, for example, micro slits. The second layer 2202n includes, for example, metal mesh, sintered metal powder, a molecular polymer, a combination thereof and the like. One end of the wick structure 220n contacts the closed end 213n, and the other axially opposite end of the wick structure 220n is aligned (flush) with the side edge 215n. In another embodiment, one end of the wick structure 220n is axially spaced from the closed end 213n, and the other axially opposite end is aligned (flush) with the side edge 215n. However, the present disclosure is not limited thereto. In another embodiment, one end of the wick structure 220n may be connected to the closed end, and the axially opposite end may be aligned with the side edge of the pipe body.
FIG. 29 illustrates a cross-sectional view of an assembly including the heat pipe 200n coupled to a vapor chamber. The vapor chamber may be the vapor chamber 100a in FIGS. 11-15.
The heat pipe 200n is disposed in the recessed portion 1113a of the base part 111a. The wick structure 220n is bonded (e.g., metallically) to the wick structures 120a via the second layer 2202n using bonding layers 310a. Similarly, the wick structure 220n is bonded (e.g., metallically) to the wick structures 130a via the second layer 2202n using bonding layers 310a.
FIG. 30 is a cross-sectional view of an assembly including a heat pipe 200o coupled to a vapor chamber, according to example embodiments. The vapor chamber may be the vapor chamber 100a in FIGS. 11-15. The vapor chamber 100a includes wick structure 120o which is also a composite wick structure (e.g., similar to the wick structure 220n). In detail, wick structure 120o includes a first layer 12010 and a second layer 1202o. The wick structure 130a has a similar structure. The first layer 12010 is disposed on and contacts (or lines) the inner side of the base part 111a, and the second layer 1202o defines the space S1 of the vapor chamber 100a. The first layer 12010 includes, for example, micro slits or metal mesh, and the second layer 1202n includes, for example, metal mesh, powder sintered body, ceramics sintered body. The pipe body 210o of the heat pipe 200o is disposed in the recessed portion 1113a of the base part 111a, The second layer 2202o of the wick structures 220o is metallically bonded to the second layer 1202o of the wick structure 120o via bonding layers 310o. Similarly, the second layer 2202o of the wick structures 220o is metallically bonded to the second layer 1202o of the wick structure 130o via bonding layers 310o.
FIG. 31 is an exploded view of a heat dissipation device 10p according to an example embodiment of the present disclosure, and FIG. 32 is a cross-sectional view of the heat dissipation device 10p in FIG. 31 when assembled.
The heat dissipation device 10p may be similar in certain aspects to the heat dissipation device 10a. The heat dissipation device 10p includes a heat conduction chamber including a base part 111p and a cover part 112p. The base part 111p includes a recessed portion 1113p.
A wick structure 120p is disposed in the base part 111p and a wick structure 130p is disposed in the cover part 112p opposite the base part 111p. The wick structures 120p and 130p each include a respective protrusion 122p and 132p.
The heat dissipation device 10p includes a heat pipe 200p having a pipe body 210p and a wick structure 220p. The wick structure 220p is disposed on and lines the tubular inner surface of the pipe body 210p. The protrusions 122p and 132p are received in the pipe body 210p and coupled to the second wick structure 220p. For instance, the heat pipe 200p may include a cut-out (similar to the cut-outs 216g and 216h in FIGS. 21 and 22) and the protrusions 122p and 132p are each received in the cut-out.
The heat dissipation device 10p further includes two bonding layers 310p and 320p. The bonding layers 310p and 320p include Au, Ag, Cu or Fe powder. The bonding layers 310p and 320p are made into porous structures by sintering or other processes. The bonding layer 310p couples the wick structure 120p and the wick structure 220p to each other via metallic bonding. Similarly, the bonding layer 320p couples the wick structure 130p and the wick structure 220p via metallic bonding.
In other embodiments, the wick structures 120p and 130p may not have a protrusion, and the wick structure 220p may include a protrusion that protrudes from a side edge of the open end of the pipe body and is coupled to the wick structure 120p and/or 130p.
A method of manufacturing a heat dissipation device includes providing a vapor chamber having a first wick structure, coupling a heat pipe including a second wick structure to the vapor chamber, providing a metal powder to cover at least part of the first wick structure and at least part of the second wick structure, and performing a sintering process to transform the metal powder into a porous structure to connect the first wick structure and the second wick structure to each other. The bonding between the first wick structure and the second wick structure improves the flow of working fluid through the first wick structure and the second wick structure and thereby improves the heat dissipation efficiency of the heat dissipating device at the desired level.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure. It is intended that the specification and examples be considered as exemplary embodiments only, with a scope of the disclosure being indicated by the following claims and their equivalents.
Patent Grant
11320211
