Claims
- 1. A heat-transfer material comprising a body of metal, said body including on a surface thereof a porous electroplated layer having re-entrant cavities of generally cylindrical shape, said re-entrant cavities having on an inner surface thereof at least one internal cavity smaller in size than said re-entrant cavity.
- 2. A heat-transfer material according to claim 1, in which said body is a tube having said surface internally thereof.
- 3. A heat-transfer material according to claim 1, in which said body is a tube having said surface externally thereof.
- 4. A heat-transfer material according to claim 1, in which said re-entrant cavities are inclined at prescribed inclination angles with respect to an axis of said body.
- 5. A heat-transfer material according to claim 1, in which a porosity of said porous layer by surface area is in the range of 10 to 50%.
- 6. A heat-transfer material according to claim 1, in which said body has one or more grooves formed in said surface.
- 7. A heat-transfer material according to claim 1, which is produced by the steps of:
- (a) preparing said body made of metal serving as a cathode and forming a hydrophobic film on a surface of said body;
- (b) subsequently keeping said surface of said body and an anode in contact with an aqueous plating solution; and
- (c) subsequently applying a direct electrical potential between said anode and said cathode to cause a plating current to flow through said plating solution to lay deposits of plating metal on said surface of said body and laying a number of particulate bubbles on said hydrophobic film on said surface of said body, so that said bubbles are enveloped by said metal deposits to form on said surface of said body a porous plated layer having generally cylindrically shaped re-entrant cavities, said re-entrant cavities having on an inner surface thereof at least one internal cavity smaller in size than said re-entrant cavity.
- 8. A heat-transfer material produced according to the process of claim 7, in which said anode is made of a substance insoluble to said plating solution, so that during electroplating oxygen gas is generated in the form of said particulate bubbles in the vicinity of said anode during the electroplating, said plating solution being moved relative to said body to cuase said particulate bubbles to flow to said surface of said body.
- 9. A heat-transfer material produced according to the process of claim 7, in which a gas-producing substance is mixed in said plating solution to produce gas generated in the form of said particulate bubbles when subjected to electroplating.
- 10. A heat-transfer material produced according to the process of claim 7, in which gas is blown into said plating solution to form said bubbles.
- 11. A heat-transfer material produced according to the process of claim 10, in which said gas is blown into said plating solution through porous filter means having openings the sizes of which range from 0.05 to 100 um.
- 12. A heat-transfer material produced according to the process of claim 7, in which said hydrophobic film has a thickness of 0.1 to 5 um.
- 13. A heat-transfer material produced according to the process of claim 7, in which said plating current is a pulsating current.
- 14. A heat-transfer material produced according to the process of claim 7, in which said metal body is made of copper, said plating solution being copper sulfate aqueous solution.
- 15. A heat-transfer material produced according to the process of claim 7, in which said plating solution is moved relative to said body so as to cause said re-entrant cavities to be inclined at prescribed inclination angles with respect to said surface of said body.
- 16. A heat-transfer material produced according to claim 7, in which a cathodic current density is not less than 15 A/dm.sup.2 while an anodic current density is not less than 20 A/dm.sup.2.
- 17. A heat-transfer material produced according to claim 7, in which lubricating oil is deposited on the surface of said body to serve as said hydrophobic film.
Priority Claims (6)
Number |
Date |
Country |
Kind |
60-252357 |
Nov 1985 |
JPX |
|
60-252358 |
Nov 1985 |
JPX |
|
60-253184 |
Nov 1985 |
JPX |
|
61-37736 |
Feb 1986 |
JPX |
|
61-221064 |
Sep 1986 |
JPX |
|
61-221065 |
Sep 1986 |
JPX |
|
Parent Case Info
This is a continuation of copending application Ser. No. 928,876, filed on Nov. 7, 1986, now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (4)
Number |
Date |
Country |
2510580 |
Sep 1975 |
DEX |
14259 |
Feb 1977 |
JPX |
26996 |
Feb 1983 |
JPX |
1375160 |
Nov 1974 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Chemical Abstracts, vol. 99, 1987, p. 440, Abstract No. 50578c, "Electroplating Printed Circuit Boards". |
Metal Finishing Abstracts, vol. 22, No. 2, Mar./Apr. 1980, p. 101, Letter D, "Reflective Siver Coated Strip". |
Continuations (1)
|
Number |
Date |
Country |
Parent |
928876 |
Nov 1986 |
|