Patent Application
20200315062
Electronic equipment can include receiving bays to receive electronic devices. Examples of electronic equipment include computer server equipment, communication equipment, or data storage equipment.
Some implementations of the present disclosure are described with respect to the following figures.
Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.
In the present disclosure, use of the term “a,” “an”, or “the” is intended to include the plural forms as well, unless the context clearly indicates otherwise. Also, the term “includes,” “including,” “comprises,” “comprising,” “have,” or “having” when used in this disclosure specifies the presence of the stated elements, but do not preclude the presence or addition of other elements.
Electronic devices can be inserted into receiving bays of a mounting structure, such as a rack or other similar structure, of electronic equipment. Examples of electronic devices include storage devices, memory devices, communication devices (e.g., signal transceiver devices, etc.), and so forth. During operation, the electronic devices can generate heat that is to be dissipated.
In some cases, liquid cooling can be used to transfer heat away from the electronic devices. In some cases, liquid cooling can result in a complex arrangement of cooling components that can take up valuable space in electronic equipment. If the electronic equipment has a relatively dense arrangement of electronic devices, the space taken up by the cooling components can lead to reduced space for accommodating the electronic devices. Moreover, complex cooling components can be costly, which can drive up the overall cost of the electronic equipment.
In accordance with some implementations of the present disclosure, receiving bays of electronic equipment can include moveable heat transfer members that are thermally coupled to a fluid conduit for carrying a cooling fluid (e.g., a cooling liquid). The moveable heat transfer members can be mounted using biasing members in the respective receiving bays, to allow the moveable heat transfer members to move along a first axis in the receiving bays.
The receiving bays 102-1 and 102-2 include respective guide brackets 104-1 and 104-2. The receiving bays 102-1 and 102-2 further include respective floating heat transfer members 106-1 and 106-2 that are moveably attached to the corresponding guide brackets 104-1 and 104-2.
A “heat transfer member” is formed of a thermally conductive material, such as a metal or other thermally conductive material, and is used to transfer heat away from another structure (discussed further below).
Each heat transfer member 106-1 or 106-2 is “floating” in the sense that the heat transfer member is moveable along a first axis that is generally parallel to a direction of insertion or removal of a pluggable electronic device module. In
As shown in
Movement of each of the heat transfer members 106-1 and 106-2 is restricted along a second axis 110, which is perpendicular to the first axis 108-1 or 108-2. In the orientation shown in
Additionally, movement of the floating heat transfer member 106-1 is also restricted in a third axis 109-1 that is perpendicular to both the first axis 108-1 and the second axis 110. Similarly, movement of the floating heat transfer member 106-2 is also restricted in a third axis 109-2 that is perpendicular to both the first axis 108-2 and the second axis 110. The third axes 109-1 and 109-2 are second horizontal axes.
Retainers for restricting movement of the floating heat transfer members 106-1 and 106-2 along the axes 110, 109-1, and 109-2 are discussed further below.
The guide bracket 104-1 includes a first guide bracket segment 104-11 and a second guide bracket segment 104-12. The first guide bracket segment 104-11 and the second guide bracket segment 104-12 are generally perpendicular to each other and are integrally connected to one another. In other words, the first and second guide bracket segments 104-11 and 104-12 of the guide bracket 104-1 are formed from a single plate (e.g., a metal plate) or other structure into a generally L-shape or other angled shape.
Each guide bracket 104-1 or 104-2 can be formed of a metal or other materials.
In the example of
The guide bracket 104-2 similarly includes a first guide bracket segment 104-21 and a second guide bracket segment 104-22, arranged in similar fashion as the first and second guide bracket segments 104-11 and 104-12 of the guide bracket 104-1.
In accordance with some implementations of the present disclosure, each heat transfer member 106-1 or 106-2 includes liquid conduits. The heat transfer member 106-1 includes a liquid conduits 112-1 and 114-1. Although two liquid conduits are shown, in other examples, a heat transfer member can include a different number (1 or greater than 2) of liquid conduits. The liquid conduits 112-1 and 114-1 can be used to transfer cooling liquid to the heat transfer member 104-1 from a source (not shown) of the cooling liquid (e.g., cooling liquid from source supply lines attached to first ends of the liquid conduits 112-1 and 114-1). Heat may be transferred from the device heat transfer member 128 into the cooling liquid, via the heat transfer member 106 and the walls of the liquid conduits 112-1 and 114-1. The liquid conduits 112-1 and 114-1 carry heated liquid to return lines (not shown) connected to second ends of the liquid conduits 112-1 and 114-1. The return lines can carry the heated liquid to a heat dissipation device, such as a heat exchanger, where the heated liquid can be cooled. The heat dissipation device can then provide the cooling liquid back to the supply lines that feed the first ends of the liquid conduits 112-1 and 114-1.
Each of the liquid conduits 112-1 and 114-1 can be formed of a tube, which can be a tube formed of a metal (e.g., copper, etc.) or another thermally conductive material. In a different example, the liquid conduits 112-1 and 114-1 can be formed as passages through the heat transfer member 104-1. In the illustrated example, the liquid conduits 112-1 and 114-1 have exposed surfaces, which are to make contact with the device heat transfer member 128-1 when the electronic device module 122 is installed in the receiving bay 102-1. In some circumstances, this direct contact between the liquid conduits 112-1 and 114-1 and the device heat transfer member 128 may improve the rate at which heat is transferred from the device heat transfer member 128-1 into the liquid coolant. In some examples, the exposed surfaces of the liquid conduits 112-1 and 114-1 are flush with and parallel to a sloped surface 107-1 of the floating heat transfer member 106-1, so that the exposed surfaces and the sloped surface 107-1 can both make thermal contact with a sloped surface 131-1 of a device heat transfer member 128-1 that is part of an electronic device module 122-1. This may increase the rate of heat transfer by allowing more paths for the heat to flow into the liquid coolant. In some examples (not illustrated), the liquid conduits 112-1 and 114-1 do not have exposed portions and do not contact the device heat transfer member 128-1. The provision of multiple liquid conduits allows for more evenly distributed heat extraction surfaces from the device heat transfer member 122-1. In other examples, one liquid conduit having a large contact surface can be used, or more than two liquid conduits can be used.
The heat transfer member 104-2 similarly includes liquid conduits 112-2 and 114-2.
As further shown in
Each of the flexible liquid conduits 118-2 and 120-2 is formed of a flexible material, such as plastic or other pliable material. A liquid conduit is considered to be “flexible” if it is capable of bending without breaking, such as due to movement of the floating heat transfer member 106-2 along the first axis 108-2.
In the ensuing discussion, liquid conduits (e.g., 112-1, 114-1, 112-2, 114-2) that are part of respective heat transfer members can be formed of a material that is more rigid than the material of respective flexible liquid conduits. As a result, the liquid conduits that are part of respective heat transfer members are referred to as “rigid” liquid conduits.
Rigid liquid conduits are fluidically interconnected to one another by a flexible liquid conduit. A flexible liquid conduit is to pass cooling liquid between rigid liquid conduits.
Examples of the flexible materials include a fluorinated ethylene propylene (FEP) material, or other flexible material.
Although not shown, the liquid conduits 112-1 and 114-1 of the heat transfer member 106-1 are similarly fluidically connected to flexible liquid conduits.
Rigid liquid conduits are nested into a respective floating heat transfer member and brazed, soldered, or otherwise attached. Once the rigid liquid conduits are installed in the respective floating heat transfer member, the rigid liquid conduits cannot bend as the rigid liquid conduits are resting inside cavities of the respective floating heat transfer member. The flexible liquid tubing in between floating heat transfer members is flexible enough to allow biasing members (e.g., spring-loaded plungers 202 discussed further below) to operate freely and without any binding or restriction, and to allow the heat transfer member to move along its full range of motion without breaking or permanently bending the flexible liquid conduit. Each of the floating heat transfer members is allowed to move independent of its neighboring (or flanking) floating heat transfer member.
In some examples, a liquid conduit can be considered rigid if its modulus of elasticity is greater than 20 gigapascal (GPa), or alternatively, greater than 50 GPa, or alternatively, greater than 75 GPa. For example, copper or a copper alloy has a modulus of elasticity in the range between 90-130 GPa, aluminum or an aluminum alloy has a modulus of elasticity in the range between 60-75 GPa, and so forth.
A liquid conduit can be considered flexible if its modulus of elasticity is less than 20 GPa, or alternatively, less than 10 GPa, or alternatively, less than 5 GPa. For example, FEP has a modulus of elasticity of about 0.34 GPa.
Each receiving bay 102-1 or 102-2 includes a respective communication connector 116-1 or 116-2. In some examples, the communication connector 116-1 or 116-2 can include an electrical connector. In other examples, the communication connector 116-1 or 116-2 can include an optical connector, or both an electrical connector and an optical connector.
In the example of
In the example of
The electronic device module 124-1 further includes the device heat transfer member 128-1 that is attached to the circuit board 126-1 using attachment mechanisms 130-1. The attachment mechanisms 130-1 can include a screw or other fastener to attach the device heat transfer member 128-1 to the circuit board 126-1.
The device heat transfer member 128-1 is thermally contacted to an electronic device (or multiple electronic devices) (not visible in
The device heat transfer member 128-1 has the sloped surface 131-1 that is sloped with respect to the upper surface of the circuit board 126-1 (the upper surface of the circuit board 126-1 is generally parallel to the first axis 108-1 in the example shown). The sloped surface 131-1 of the device heat transfer member 128-1 is to make thermal contact with the complementary sloped surface 107-1 of the floating heat transfer member 106-1 of the receiving bay 104-1. The sloped surface 107-1 is sloped (angled) with respect to the first axis 108-1. The angle of the sloped surface 107-1 or sloped surface 131-1 with respect to the first axis 108-1 does not include a right angle (e.g., 90° or 270°) and does not include a zero angle or a 180° angle, but includes sloped angles (e.g., in a range larger than 0° and less than 90°, or in a range larger than 90° and less than 180°, or in a range larger than 180° or less than 270°, or in a range larger than 270° and less than 360°). In some examples, the sloped angles are in a range between 10° and 80°, or in a range between 100° and 170°, or in a range between 190° and 260°, or in a range between 280° and 350°.
Providing sloped surfaces 107-1 and 131-1 on the respective heat transfer members 106-1 and 128-1 increases the surface area of heat contact between the heat transfer members 106-1 and 128-1, as compared to an example where the surface 107-1 and the surface 131-1 are each perpendicular to the first axis 108-1. The increased contact area between the device heat transfer member 128-1 and a floating heat transfer member 106-1 allows for a larger heat transfer rate, to allow for increased heat dissipation capacity. In addition, the floating nature of the floating heat transfer member 106-1 (that is moveable along the first axis 108-1 in response to insertion of the electronic device module 122-1) allows for a reliable thermal contact to be made between the device heat transfer member 128-1 and the floating heat transfer member 106-1.
The floating heat transfer member 106-2 similarly has a sloped surface 107-2 that is sloped (angled) with respect to the first axis 108-2.
Thermally engaging the device heat transfer member 128-1 with the floating heat transfer member 106-1 allows for a “dry connection” between the electronic device module 122-1 and the receiving bay 102-1. In other words, thermal engagement can be accomplished between the electronic device module 122-1 and the receiving bay 102-1 without the use of a connection at which liquid is exchanged between the electronic device module 122-1 and the receiving bay 102-1. In some examples, the floating heat transfer member 106-1 may also allow for a connection that is free of a thermal-interface-material (TIM), such as a thermal paste or thermal grease. This ability to avoid using a TIM may be beneficial, for example, in applications in which the electronic device module 122-1 may be expected to be inserted in and removed from the receiving bay 102-1 multiple times, as a TIM may need to be reapplied every time the electronic device module 122-1 is inserted into the bay 102.
Once the electronic device module 122-1 is fully inserted in the receiving bay 102-1, the device heat transfer member 128-1 is thermally engaged with the floating heat transfer member 106-1, which allows for heat generated by the electronic device(s) in thermal contact with the device heat transfer member 128-1 to be dissipated to the floating heat transfer member 106-1. The heat transferred from the device heat transfer member 128-1 to the floating heat transfer member 106-1 can then be carried away by cooling liquid in the liquid conduit 112-1.
As the electronic device module 122-1 is inserted into the receiving bay 104-1, a mating communication connector (e.g., an edge connector) of the electronic device module 122-1 (which is communicatively connected to the circuit board 126-1) makes a connection (electrical and/or optical connection) with the communication connector 116-1.
After the device and floating heat transfer members and the communication connectors are engaged due to the electronic device module 122-1 being fully inserted in place, a device latch (not shown) may be used to maintain positive mating pressure between the heat transfer members and the communication connectors.
As further shown in
The spring-loaded plunger 202 is partially received in an inner bore 206 of a spring 208. A thread lock 210 of the spring-loaded plunger 202 protrudes into an opening of the spring 208 to prevent the spring-loaded plunger 202 from losing its last position inside the inner bore 206 of the spring 208 over time as a result of use. In examples where multiple (e.g., a pair of) spring-loaded plungers 202 are engaged to each floating heat transfer member (such as shown in
A portion of the spring 208 is housed in a retention housing 212 that is attached to the first receiving bay segment 104-11. The retention housing 212 maintains the spring 208 in a fixed position relative to the first receiving bay segment 104-11.
In response to a force applied against the floating heat transfer member 106-1 by engagement of the device heat transfer member 128-1 when the electronic device module 122-1 is inserted into the receiving bay 102-1, the spring 208 is compressed such that the spring-loaded plunger 202 and the floating heat transfer member 106-1 engaged to the spring-loaded plunger 202 can move in a direction of the axis 108-1.
The engagement of the spring-loaded plunger 202 with the dimple 204 in the floating heat transfer member 106-1 allows for the floating heat transfer member 106-1 to be moveable along the first axis 108-1.
The force applied by the spring 208 through the spring-loaded plunger 202 against the rear surface of the floating heat transfer member 106-1 allows a biasing force to be applied against the floating heat transfer member 106-1 when the device heat transfer member 128-1 is engaged to the floating heat transfer member 106-1. The biasing force applied by the spring-loaded plunger 202 allows for more reliable thermal contact between the device heat transfer member 128-1 and the floating heat transfer member 106-1.
The assembly of the spring-loaded plunger 202 and the spring 208 is an example of a biasing member to apply a resisting force against the rear surface of the floating heat transfer member 106-1 when the floating heat transfer member 106-1 moves along the first axis 108-1 in response to an opposing force applied against the floating heat transfer member 106-1 by the device heat transfer member 128-1.
In other examples, other types of biasing members can be used.
In some examples, the spring-loaded plunger 202 restricts movement of the floating heat transfer member 106-1 along the second axis 110 and the third axis 109-1 (
In addition to the second guide bracket segment 104-12, the shoulder screw 220 with the enlarged head 224 that extends through the elongated opening 222 also aids in restricting movement of the floating heat transfer member 106-1 along the second axis 110. The shoulder screw 220 also restricts movement of the floating heat transfer member 106-1 along the third axis 109-1.
The elongated opening 222 in the second guide bracket segment 104-12 allows for motion of the floating heat transfer member 106-1 along the first axis 108-1.
Elongated openings 222 are provided through the second guide bracket segment 104-12. Shoulder screws 220 as shown in
In the example of
As further shown in
Similarly, the flexible liquid conduit 118-3 fluidically connects a rigid liquid conduit 112-5 and the rigid liquid conduit 112-3, and a flexible liquid conduit 120-3 fluidically connects a rigid liquid conduit 114-5 and the rigid liquid conduit 114-3.
As further shown in
The receiving bay 600 further includes a retainer 608 (e.g., the second guide bracket portion 104-12 or 104-22, the combination of the spring-loaded plunger 202 and the dimple 204, the shoulder screw 220, etc.) to restrict movement of the first heat transfer member along a second axis (e.g., 110 or 109-1 or 109-2) different from the first axis 606.
The first heat transfer member 604 is to contact a second heat transfer member 610 of the device 602 when inserted in the receiving bay 600, the first heat transfer member 604 moveable along the first axis 606 by the contact with the second heat transfer member 610 as the device 602 is inserted in the receiving bay 600.
The first heat transfer member 704 is to contact a second heat transfer member 710 of a device 712 when inserted in the receiving bay 702. The first heat transfer member 704 is moveable along the first axis 706 by the contact with the second heat transfer member 710 as the device is inserted in the receiving bay 702.
A liquid conduit 714 carries cooling fluid to the first heat transfer members 704 of the plurality of receiving bays 700.
The electronic equipment 800 includes a receiving bay 802 to receive an electronic device module 804. The receiving bay 802 includes a communication connector 806. The receiving bay 802 further includes a first heat transfer member 808 movably mounted in the receiving bay using a biasing member 810, the first heat transfer member 808 moveable along a first axis 812.
The receiving bay 802 further includes a retainer 814 to restrict movement of the first heat transfer member 808 along a second axis different from the first axis 812.
The electronic device module 804 received in the receiving bay 802 includes a second heat transfer member 816 to thermally contact the first heat transfer member 808 when the electronic device module 804 is inserted in the receiving bay 802. The first heat transfer member 808 is moveable along the first axis 810 by the contact with the second heat transfer member 816 as the electronic device module 804 is inserted in the receiving bay 802. The electronic device module 804 includes a complementary communication connector 818 to mate with the communication connector 806 of the receiving bay 802 when the electronic device module 804 is inserted in the receiving bay 802.
In the foregoing description, numerous details are set forth to provide an understanding of the subject disclosed herein. However, implementations may be practiced without some of these details. Other implementations may include modifications and variations from the details discussed above. It is intended that the appended claims cover such modifications and variations.
