Claims
- 1. A method for slicing a material ingot comprising the steps of:
- mounting said material ingot on a mounting face of a mounting block of a slicing apparatus with a thermally softenable adhesive to form a mounting block/material ingot combination;
- inserting said mounting block/material ingot combination into said slicing apparatus for slicing of said material ingot, wherein a residue of said material ingot remains attached to said mounting block after a portion of said material ingot has been sliced; and
- removing said residue of said material ingot from said mounting block by energizing a heating element mounted on said mounting block to heat only a localized portion of said mounting block near said mounting face to soften the adhesive between the material ingot and the mounting face.
- 2. A method for slicing a material ingot comprising the steps of:
- providing a mounting means having a mounting face for mounting a semiconductor containing ingot thereto, wherein the mounting means comprises a cavity located behind the mounting face so that the mounting face is partially thermally isolated from another part of the mounting means by which the mounting means is attached to a sawing means for sawing the ingot;
- using a heater attached to the mounting means, heating the mounting face to a predetermined temperature for softening an adhesive for attaching the semiconductor containing ingot to the mounting face, while the other part of the mounting means remains below the predetermined temperature;
- attaching a portion of the semiconductor containing ingot to the mounting face with the heat softened adhesive; and
- cooling the mounting face to below the predetermined temperature.
- 3. A method for slicing a material ingot in accordance with claim 2 wherein said mounting means includes a heating element mounted in said cavity adjacent to said mounting face.
- 4. A method for slicing a material ingot in accordance with claim 3 further comprising the steps of:
- sawing a portion of said semiconductor ingot leaving a remaining portion attached to said mounting means; and
- re-heating the mounting face to said predetermined temperature for softening said adhesive to remove said remaining portion, while the other part of the mounting means remains below the predetermined temperature.
Parent Case Info
This application is a continuation of prior application Ser. No. 07,428,568 filed Oct. 30, 1989 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4652135 |
Ono |
Mar 1987 |
|
4667650 |
Girard et al. |
May 1987 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
428568 |
Oct 1989 |
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