Patent Application
20060181856
1. Field of the Invention
The present invention relates to a heatsink device of video graphics array (VGA) and chipset, and in particular relates to a heatsink device of VGA and chipset to dissipate heat generated from computer, such as VGA and chipset, more effectively.
2. Description of the Related Art
Regarding to heatsink devices of computer elements, the heatsink device commonly designs on each computer element, such as central processing unit (CPU), video graphics array (VGA), or chipset. The conventional heatsink device not only occupies inside space of computer case but also cannot save cost. In addition, in a single computer element, the heat dissipation area of heatsink device has a limitation, so the heat dissipation on a computer element will also be affected. Relatively, when heat dissipation is not functioning well, the operate effect of each computer element is getting decreasing. After a long time use, the elements will have problems of motion harmful and life decreasing.
Above situation will persecute users, therefore; it is necessary to provide a heatsink structure for dissipating heat generated from VGA and chipset, when VGA and chipset are in action. To be effectively heat dissipating, the important issues need to be solved are increasing heat dissipation area and saving space and cost.
In view of above prior art questions, the main purpose of this invention is to provide a heatsink device for dissipating heat generated from VGA and chipset simultaneously in order to solve a drawback of occupying too many space for traditional heatsink device in a computer element, to overcome the poor heat dissipation problem, and to provide a new heatsink for cost saving.
To fulfill the above-mentioned objects, this invention provides a heatsink device for VGA and chipset. The main characteristic is making an integrated design for heatsink devices. The new heatsink design relies on increasing heat dissipation area on a heatsink plate and put the heatsink plate on VGA and chipset. Also, it integrates other heat generated elements stacking below the heatsink plate to dissipate more heat, so as to increase heat dissipation effect of the heatsink plate.
For better knowledge and understanding of characteristics, purposes and functions of the disclosed invention, the detailed descriptions are as follows:
The invention is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is to integrate different heatsink devices into a heatsink plate stacked on VGA and chipset. The heatsink plate has more heat dissipation area than that of the conventional heatsink, and it also integrates other heat generated elements stacking below the heatsink plate to dissipate more heat, so as to increase heat dissipation effect of the heatsink plate and replace the traditional heatsink devices set up on CPU, VGA, and chipset individually, from predicaments of occupying many space, poor heat dissipation function, and higher cost.
For better knowledge and understanding of characteristics, purposes, and functions of the disclosed invention, the detailed descriptions are as follows.
As shown in
The heatsink plate 10 has a protruding shape. Its lower surface 11 set up a heatsink pedestal 13 which contacts with VGA and a chipset heatsink pedestal 14 which contacts with chipset heatsink flat-top. In addition, the floating leaf spring 20 is a floating spring. The upper surface of the floating leaf spring 20 including at least two holes 21, at least two fixtures 22, and at least two heat dissipation tubes 30. The sliding block 40 is an angle rotatable and adjustable sliding block which comprises at least two through holes 42. The two through holes 42 are used for accommodating at least two heat dissipation tubes 30. The two heat dissipation tubes 30 inside contain fiber and heat conduction medium.
About the forming method of the present heatsink device 1 for VGA and chipset, it takes a one-body forming method for making the heatsink plate 10 of a heatsink device 1 for VGA and chipset as its characteristics.
According to
As shown in
For better knowledge and understanding of characteristics of a heatsink device of video graphics array (VGA) and chipset disclosed in the present invention have the detailed descriptions with drawings. Firstly, according to
According to
While finished above fabricating motions, it means a heatsink device 1 of VGA and chipset has set up at a motherboard and finished all fabricating motions. According to
As shown in
During the heatsink devices of VGA and chipset of the present invention fabricating, when a heatsink pad 50 and a sliding block 40 are going to connect closely, one can pave a layer of insulator between them to isolate the electric conductivity between the heatsink pad 50 and the sliding block 40.
After the heatsink devices of VGA and chipset of the present invention have been fabricated, owing to a heatsink plate set up on a motherboard, the heatsink plate can be the crutch of keyboard in a notebook computer. It means that the keyboard can be set up at the heatsink plate and supported by the heatsink plate to achieve the goal of saving element and decreasing cost.
The heatsink plate of present invention is designed for main thermal source such as VGA and chipset, but it is not used to limit present invention. Therefore, the heatsink plate of present invention can have different designs. The heatsink can change its sharp and size and having different heatsink pedestal designs corresponding to main thermal source of computer elements. The present invention can increase effect and save cost comparing to the prior art. To operate present invention can also solve the heat problem of thermal source of computer in heatsink device. Besides, it does not occupy more space inside the computer for heatsink device, and it can provide higher function of heat dissipation to conquer the problems of heat dissipation.
The present invention has integrated many years' design experiences to design a heatsink device for dissipating the heat generated by VGA and chipset. It provides advantages of higher efficiency of heat dissipation and decreased cost and it also can be seen that the present invention has more effect increasing than that of past.
Although the invention has been explained in relation to its preferred embodiment, it is not used to limit the invention. It is to be understood that many other possible modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the invention as hereinafter claimed.
