Claims
- 1. A hermetic case for encasing an electronic circuit board having an electronic element thereon comprising:
- a case body defining a hermetically sealed space for encasing an electronic circuit board;
- a vent hole disposed in said case body communicating said sealed space with ambient atmosphere; and
- a freely flexible cover means, exclusively attached to said case body and not in contact with either the electronic circuit board or the electronic element, for protecting the electronic element from moisture and absorbing a pressure fluctuation of said sealed space to prevent flexure of the electronic circuit board, wherein said cover means comprises: a mounting flange extending from said case body and surrounding said vent hole; a flexible diaphragm sealingly attached to said case body around said vent hole having a circumferential bulge integrally formed at its edge sealingly contacting said mounting flange to seal said vent hole, said circumferential bulge being an outcropping of said flexible diaphragm; and fastening means pressing said circumferential bulge of said flexible diaphragm against said mounting flange to provide a hermetic seal therebetween, said fastening means comprising an elastic ring having a U-shaped cross section which is press-fit onto said mounting flange, wherein the electronic element is exclusively mounted on a first side of the electronic circuit board, and said cover means faces a second side of the electronic circuit board, opposite the first side, no other electronic elements being mounted on the second side of the electronic circuit board.
- 2. A hermetic case as claimed in claim 1, wherein
- said flexible diaphragm has said circumferential bulge if said flexible diaphragm is in a free uncompressed state.
- 3. An electronic circuit apparatus comprising:
- a case body defining a hermetically sealed space therein;
- a circuit board having an electronic element exclusively mounted on a first side of said electronic circuit board, said circuit board fixedly mounted to said case body in said sealed space;
- a vent hole disposed in said case main body communicating said sealed space with ambient atmosphere; and
- a freely flexible cover means, exclusively attached to said case body and not in contact with said electronic element, for protecting said electronic element from moisture and absorbing a pressure fluctuation of said sealed space to prevent flexure of said circuit board, wherein said cover means comprises: a mounting flange extending from said case body and surrounding said vent hole; a flexible diaphragm sealingly attached to said case body around said vent hole having a circumferential bulge integrally formed at its edge sealingly contacting said mounting flange to seal said vent hole said circumferential bulge being an outcropping of said flexible diaphragm; and fastening means pressing said circumferential bulge of said flexible diaphragm against said mounting flange to provide a hermetic seal therebetween, said fastening means comprising an elastic ring having a U-shaped cross section which is press-fit onto said mounting flange, said cover means facing a second side of said electronic circuit board, opposite said first side, no other electronic elements being mounted on the second side of the electronic circuit board.
- 4. An electronic circuit apparatus as claimed in claim 3, wherein
- said flexible diaphragm has said circumferential bulge if said flexible diaphragm is in a free uncompressed state.
- 5. An electronic circuit equipment as claimed in claim 3, wherein said cover means are disposed inside of said case body.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-038586 U |
May 1991 |
JPX |
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Parent Case Info
This is a continuation of application Ser. No. 08/124,857 filed Sep. 22, 1993, now abandoned, which is a Continuation of application Ser. No. 07/889,432, filed May 28, 1992, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (4)
Number |
Date |
Country |
3107694 |
Sep 1982 |
DEX |
3248715 |
Jul 1984 |
DEX |
3436300 |
May 1985 |
DEX |
1580599 |
Jul 1990 |
SUX |
Non-Patent Literature Citations (2)
Entry |
German Office Action, File No. P 42 17 837.1-34, dated Apr. 23, 1993 with English Translation. |
IBM Technical Disclosure Bulletin, "Chip Joining Both Sides of Substrates Simultaneously", C. T. Rogers, vol. 13, No. 2, p. 396, Jul., 1970. |
Continuations (2)
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Number |
Date |
Country |
Parent |
124857 |
Sep 1993 |
|
Parent |
889432 |
May 1992 |
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