Claims
- 1. A hermetic package for an electronic device, said hermetic package comprising:
- a sintered glass ceramic body having first and second opposite surfaces and an axis extending from the first surface to the second surface, said glass ceramic body having a thickness in the direction of the axis, said glass ceramic body being substantially electrically insulating; and
- an electrically conductive sintered via in the glass ceramic body, said via extending from the first surface to the second surface, said via being hermetically bonded to the glass ceramic body, said via comprising a mixture of an electrically conductive material and a glass ceramic material, said electrically conductive material forming at most 50 volume percent of the via.
- 2. A hermetic package as claimed in claim 1, characterized in that the sintered via has an electrical resistivity less than 1000 micro-ohm-centimeters.
- 3. A hermetic package as claimed in claim 2, characterized in that the via consists essentially of:
- 20 to 50 volume percent copper; and
- 80 to 50 volume percent glass ceramic material.
- 4. A hermetic package for an electronic device, said hermetic package comprising:
- a first sintered glass ceramic layer having first and second opposite surfaces and an axis extending from the first surface to the second surface, said first glass ceramic layer having a thickness in the direction of the axis, said first glass ceramic layer being substantially electrically insulating;
- a first electrically conductive sintered via in the first glass ceramic layer, said via extending from the first surface to the second surface, said via being hermetically bonded to the glass ceramic body, said via comprising a mixture of an electrically conductive material and a glass ceramic material, said electrically conductive material forming at most 50 volume percent of the via;
- a second sintered glass ceramic layer having first and second opposite surfaces and an axis extending from the first surface to the second surface, said second glass ceramic layer having a thickness in the direction of the axis, said second glass ceramic layer being substantially electrically insulating, the first surface of the second glass ceramic layer being in contact with the first surface of the first glass ceramic layer;
- a second electrically conductive sintered via in the second glass ceramic layer, said via extending from the first surface to the second surface, said via comprising more than 50 volume percent of an electrically conductive material.
- 5. A hermetic package as claimed in claim 4, characterized in that the second electrically conductive via consists essentially of copper.
Parent Case Info
This is a division of Ser. No. 07/418,435 filed Oct. 6, 1989, now U.S. Pat. No. 5,194,196 and is related to Ser. No. 07/757,863 filed Sep. 11, 1991 entitled "A SINTERING FIXTURE FOR PRESSURE SINTERING AN HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE".
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
418435 |
Oct 1989 |
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