Via connections through the substrate with or without pins

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H01L21/486

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/486Via connections through the substrate with or without pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor apparatus and semiconductor appa...
- Patent number 12,368,107
- Issue date Jul 22, 2025
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for providing through-openings in a substrate and...
- Patent number 12,365,051
- Issue date Jul 22, 2025
- LPKF LASER & ELECTRONICS SE
- Robin Alexander Krueger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with glass core having vertical power planes for...
- Patent number 12,368,091
- Issue date Jul 22, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure for semiconductor package including peripheral...
- Patent number 12,368,109
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,362,270
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kris Lipu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,362,196
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including stepped surfaces and methods of forming the same
- Patent number 12,362,246
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 12,354,965
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 12,354,962
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization for raster scanning
- Patent number 12,354,931
- Issue date Jul 8, 2025
- Intel Corporation
- Vinith Bejugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure with support features and methods
- Patent number 12,354,940
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with step feature
- Patent number 12,347,784
- Issue date Jul 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with an alignment moat
- Patent number 12,347,713
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Andrew D. Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic planar spiral and high aspect ratio inductors for power de...
- Patent number 12,347,761
- Issue date Jul 1, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrates having signal shielding for use with semiconductor...
- Patent number 12,347,788
- Issue date Jul 1, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,341,104
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,334,446
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias filled with liquid metal fill
- Patent number 12,336,112
- Issue date Jun 17, 2025
- Samtec, Inc.
- Christopher David Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,334,424
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, and fabrication and packaging methods thereof
- Patent number 12,334,361
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE
- Publication number 20250239510
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES, INC.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239511
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250239517
- Publication date Jul 24, 2025
- MEDIATEK INC.
- Yi-Chieh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239515
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Dohyuk YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...
- Publication number 20250233059
- Publication date Jul 17, 2025
- Kyocera Corporation
- Akihiko FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226306
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...
- Publication number 20250226337
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR PACKAGING SUBSTRATE
- Publication number 20250218797
- Publication date Jul 3, 2025
- ABSOLICS INC.
- Jong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210467
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...
- Publication number 20250210485
- Publication date Jun 26, 2025
- AUO Corporation
- Shih-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210489
- Publication date Jun 26, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE
- Publication number 20250210583
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250210488
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED UTILITY PATCH FOR SEMICONDUCTOR PACKAGES
- Publication number 20250210491
- Publication date Jun 26, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210534
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Yoichi NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Module
- Publication number 20250201723
- Publication date Jun 19, 2025
- Graphcore Limited
- Stephen FELIX
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrate with or without pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing semiconductor apparatus and semiconductor appa...

Method and device for providing through-openings in a substrate and...

Package substrate with glass core having vertical power planes for...

Semiconductor package and method comprising formation of redistribu...

Methods of forming semiconductor packages

Interposer structure for semiconductor package including peripheral...

Methods of packaging semiconductor devices and packaged semiconduct...

Package structure and method of fabricating the same

Basin-shaped underbump plates and methods of forming the same

Package structure

Package structure with underfill

Interposer including stepped surfaces and methods of forming the same

Semiconductor device with redistribution structure and method for f...

Standard cell layout for better routability

Reconstituted substrate structure and fabrication methods for heter...

Electronic package, electronic structure and manufacturing method t...

Optimization for raster scanning

Redistribution layer structure with support features and methods

Interposer with step feature

Semiconductor apparatus with an alignment moat

Magnetic planar spiral and high aspect ratio inductors for power de...

Semiconductor packages

Glass substrates having signal shielding for use with semiconductor...

Microdevice integration into system substrate

Package structure

Methods of manufacturing semiconductor devices

Semiconductor package and method

High aspect ratio vias filled with liquid metal fill

Package structure and manufacturing method thereof

Substrate structure, and fabrication and packaging methods thereof

Patents Applicationslast 30 patents

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

SEMICONDUCTOR PACKAGE

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...

Semiconductor Packages and Methods of Forming Same

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

MANUFACTURING METHOD FOR PACKAGING SUBSTRATE

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

SEMICONDUCTOR DEVICE

COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...

SEMICONDUCTOR DEVICE AND METHOD

VERTICALLY EMBEDDED UTILITY PATCH FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

A Module