Via connections through the substrate with or without pins

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/486Via connections through the substrate with or without pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,274,079
- Issue date Apr 8, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 12,266,610
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Yencheng Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold shelf package design and process flow for advanced package arc...
- Patent number 12,261,150
- Issue date Mar 25, 2025
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,824
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including cavity-mounted device
- Patent number 12,243,829
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with CTE matching barrier ring around microvias
- Patent number 12,243,835
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 12,243,856
- Issue date Mar 4, 2025
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,241
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250132238
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250133652
- Publication date Apr 24, 2025
- Cisco Technology, Inc.
- Yuqing Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133653
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Tsung-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250133656
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Sang Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PLUG RESISTOR
- Publication number 20250125242
- Publication date Apr 17, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
- Publication number 20250125247
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS
- Publication number 20250125293
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE BONDING STRUCTURE
- Publication number 20250118619
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20250118645
- Publication date Apr 10, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...
- Publication number 20250112139
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...
- Publication number 20250112141
- Publication date Apr 3, 2025
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBST...
- Publication number 20250105120
- Publication date Mar 27, 2025
- Innolux Corporation
- Po-Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20250105121
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Mihoko MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20250105122
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250105130
- Publication date Mar 27, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SUBSTRATE
- Publication number 20250100081
- Publication date Mar 27, 2025
- Nichia Corporation.
- Norifumi SASAOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Publication number 20250105119
- Publication date Mar 27, 2025
- Intel Corporation
- Yuqin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...
- Publication number 20250096091
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Chiao-Yi TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Stiffener Interposers
- Publication number 20250096154
- Publication date Mar 20, 2025
- Intel Corporation
- Chin Mian CHOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrate with or without pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnection using fanout interposer chiplet

Method of fabricating semiconductor package including sub-interpose...

Heterogeneous nested interposer package for IC chips

Deep trench capacitors embedded in package substrate

Semiconductor device package with conductive pillars and reinforcin...

Antenna apparatus and fabrication method

Dense via pitch interconnect to increase wiring density

Semiconductor package device and method for manufacturing the same

Integrated devices in semiconductor packages and methods of forming...

Embedded component package structure and manufacturing method thereof

Method of forming semiconductor device having at least one via incl...

Method of manufacturing component carrier and component carrier int...

Semiconductor package having an encapulant comprising conductive fi...

Mold shelf package design and process flow for advanced package arc...

Secure semiconductor integration and method for making thereof

Package-on-package type semiconductor package

Chip package structure

Die-group package having a deep trench device

Integrated structure with bifunctional routing and assembly compris...

Package structure, RDL structure comprising redistribution layer ha...

Manufacturing method of integrated substrate structure

Semiconductor devices and methods of manufacture

Semiconductor device with electromagnetic interference film and met...

Interconnect structure having conductor extending along dielectric...

Semiconductor package including cavity-mounted device

Package substrate with CTE matching barrier ring around microvias

Fan out packaging pop mechanical attach method

Waferscale physiological characteristic sensor package with integra...

Semiconductor package

Deep trench capacitors embedded in package substrate

Patents Applicationslast 30 patents

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

PRINTED CIRCUIT BOARD ASSEMBLY

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

Semiconductor Package And Method Of Fabricating The Same

VIA PLUG RESISTOR

PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

THERMAL CONDUCTIVE BONDING STRUCTURE

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Method for Forming Semiconductor Package and Semiconductor Package

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...

WIRING BOARD AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBST...

SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...

NANOTWIN LINER FOR THROUGH GLASS VIAS

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...

Electronic Device and Manufacturing Method Thereof

METHOD OF PRODUCING SUBSTRATE

SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY

PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...

Package Substrates with Stiffener Interposers

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF