Via connections through the substrate with or without pins

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H01L21/486

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/486Via connections through the substrate with or without pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Strip substrate having protection pattern on sidewall of conductive...
- Patent number 12,211,783
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
- Patent number 12,205,880
- Issue date Jan 21, 2025
- Eagle Technology, LLC
- Matt Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 12,205,878
- Issue date Jan 21, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging structure, preparation method thereof, and termi...
- Patent number 12,205,876
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dimensional integrated circuits having semiconductors mounted...
- Patent number 12,199,196
- Issue date Jan 14, 2025
- GBT Tokenize Corp.
- Danny Rittman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,191,201
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Masahiro Totsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with recessed memory
- Patent number 12,191,281
- Issue date Jan 7, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 12,183,700
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 12,183,594
- Issue date Dec 31, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging methods
- Patent number 12,183,684
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Mukhles Sowwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,183,704
- Issue date Dec 31, 2024
- Nepes Co., Ltd.
- Byung Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method and transfer mold manufacturing method
- Patent number 12,181,796
- Issue date Dec 31, 2024
- CONNECTEC JAPAN CORPORATION
- Hiroshi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,176,256
- Issue date Dec 24, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate and method of making interconnect substrate
- Patent number 12,176,280
- Issue date Dec 24, 2024
- Shinko Electric Industries Co., Ltd.
- Yuta Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,176,279
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
- Publication number 20250037923
- Publication date Jan 30, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN TRANSFER PRINTING METHODS FOR PRINTING ULTRAFINE LINES
- Publication number 20250031479
- Publication date Jan 23, 2025
- Wuhan DR Laser Technology Corp,. LTD
- Eyal COHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20250029929
- Publication date Jan 23, 2025
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE
- Publication number 20250029911
- Publication date Jan 23, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029935
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyuil Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022803
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...
- Publication number 20250022859
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014977
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20250015054
- Publication date Jan 9, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME
- Publication number 20250014983
- Publication date Jan 9, 2025
- SAMTEC, INC.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION
- Publication number 20250006614
- Publication date Jan 2, 2025
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...
- Publication number 20250006646
- Publication date Jan 2, 2025
- Intel Corporation
- Xing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND FUNCT...
- Publication number 20250006509
- Publication date Jan 2, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jingshu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT...
- Publication number 20250006643
- Publication date Jan 2, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
- Publication number 20240429172
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Ruei Ying Sheng
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrate with or without pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Strip substrate having protection pattern on sidewall of conductive...

Stiffener package and method of fabricating stiffener package

Chip package and method of forming the same

Electronic device and multi-level interposer with RF sloped via and...

Continuous interconnects between heterogeneous materials

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Embedded packaging structure, preparation method thereof, and termi...

Multi-die package structures including redistribution layers

Packaging structure and method for preparing same

Packaging substrate and method for manufacturing same

Integrated fan-out package, package-on-package structure, and manuf...

Electrical devices and methods of manufacture

Heterogeneous nested interposer package for IC chips

Multi-dimensional integrated circuits having semiconductors mounted...

Semiconductor device and method of manufacture

Package structure

Semiconductor device assembly with pillar array

Semiconductor device and method for manufacturing semiconductor device

Multi-chip package with recessed memory

Embedded inductors and integrated voltage regulators for packaged s...

Semiconductor device package and method of manufacture

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor device packaging methods

Semiconductor package and method for manufacturing the same

Method of manufacturing a ceramic structure with metal traces

Wiring formation method and transfer mold manufacturing method

Semiconductor devices and methods of manufacturing semiconductor de...

Interconnect substrate and method of making interconnect substrate

Package structure and manufacturing method thereof

Patents Applicationslast 30 patents

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

Heterogeneous Fan-Out Structure and Method of Manufacture

ELECTRICAL INTERCONNECT BRIDGE

MANUFACTURING METHOD OF PACKAGE CARRIER

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

PATTERN TRANSFER PRINTING METHODS FOR PRINTING ULTRAFINE LINES

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR PACKAGE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE

INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...

Cooling Methodology for Package-on-Package Structures

ENCAPSULATION SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND FUNCT...

METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT...

SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...