“Feasibility of Surface Activated Bonding for Ultra-fine Pitch Interconnection—a New Concept of Bump-less Direct Bonding for System Level Packaging” by T. Suga; 2000 IEEE; 4 pages. |
“A Novel Temperature Compensation Method for SAW Devices Using Direct Bonding Techniques” by K. Onishi, A Namba, H. Sato, T. Ogura, S. Seki, Y. Taguchi, Y. Tomita, O. Kawasaki and K. Eda; 1997 IEEE; pp. 227-230. |
“Silicon Wafer Bonding for MEMS Manufacturing” by A. A. Ayon; Solid State Technology Publication; Aug. 1999; 6 pages. |
“Direct Bonding of Piezoelectric Materials Onto Si” by Kazuo Eda, Yoshihiro Tomita, Masato Sugimoto, Tetsuyoshi Ogura, Akihiko Nanba, Yutaka Taguchi and Osamu Kawasaki; 1996 IEEE; pp. 719-722. |
“Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation” by H. Takagi, R. Maeda, N. Hosoda and T. Suga; 1999; pp. 341-344. |
“Even-Order Thickness-Shear Mode Resonators Using X-Cut Lita03 Plates Realized by a Direct Bonding Technique” by M. Sugimoto, K. Takeda, T. Ohtsuchi, Y. Tomita and O. Kawasaki 1998-IEEE; pp. 919-923. |