the bump connector being embedded into the layer connector

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H01L2224/73204

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73204the bump connector being embedded into the layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,249,563
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
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- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
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Information Patent Grant
Semiconductor device and methods of manufacture
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- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
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Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
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Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
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Information Patent Grant
Semiconductor package and method for fabricating the same
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor package and method of fabricating the same
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Information Patent Grant
Chip-on-film package and display apparatus including the same
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Aleksandar Aleksov
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Information Patent Grant
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Information Patent Grant
Electronic package structure and method for manufacturing the same
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- Wei-Jen Wang
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Information Patent Grant
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- Issue date Feb 4, 2025
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- Shin-Puu Jeng
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Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication date Mar 13, 2025
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Information Patent Application
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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
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LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
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DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
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ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
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WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
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ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
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Advanced Substrates for Large, High Performance Power Packages
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Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087638
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE
- Publication number 20250087652
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
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- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
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METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fine Pitch Organic Inte...
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SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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SEMICONDUCTOR PACKAGE
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- Samsung Electronics Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
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- Publication date Mar 6, 2025
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Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
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- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
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- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
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LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
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- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
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- Kosuke TSUKAMOTO
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Information Patent Application
SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...
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- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079250
- Publication date Mar 6, 2025
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- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
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- Samsung Electronics Co., Ltd.
- Eunsil Kang
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Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250079426
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079319
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongseok KIM
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being embedded into the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package and method manufacturing the same

Semiconductor device and methods of manufacture

Package structure, RDL structure comprising redistribution layer ha...

Wirebondable interposer for flip chip packaged integrated circuit die

Integrated circuit package and method of forming same

Microelectronic structures including bridges

3D semiconductor device and structure with metal layers and memory...

Semiconductor package

Package structure and method

Semiconductor package

Circuit board with bridge chiplets

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Semiconductor package and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

Semiconductor package and method of fabricating the same

Chip-on-film package and display apparatus including the same

Semiconductor package

Display device using micro-LED, and manufacturing method therefor

Printed circuit board and electronic component package including th...

Electronic device

Mixed hybrid bonding structures and methods of forming the same

Semiconductor package including adhesive layer and method for manuf...

Multi-chip package with high density interconnects

Semiconductor die connection system and method

Electronic package structure and method for manufacturing the same

Chip package structure having molding layer

Semiconductor package and method of manufacturing semiconductor pac...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Advanced Substrates for Large, High Performance Power Packages

PACKAGE STRUCTURE

STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

METHOD FOR FORMING PACKAGE STRUCTURE

Semiconductor Device and Method of Making a Fine Pitch Organic Inte...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR PACKAGE

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME