Claims
- 1. A system for processing a semiconductor substrate comprising:
- a double sided scrubber, wherein said double sided scrubber includes a roller to rotate said semiconductor substrate, said roller having
- an outer wall, and;
- a v-shaped groove, said v-shaped groove being perpendicular to a central axis of rotation and in a circular position substantially around the circumference of said outer wall of said roller, said v-shaped groove having a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate,
- wherein said roller rotates and positions said semiconductor substrate such that both sides of the semiconductor may be scrubbed in said double sided scrubber.
- 2. The system as described in claim 1 wherein said v-shaped groove contacts said edge of said substrate on at least two points.
- 3. The system as described in claim 1 wherein said v-shaped groove has an opening in the range of approximately 0.005-0.040 inch.
- 4. The system as described in claim 1 wherein said roller comprises a flexible material.
- 5. The system as described in claim 4 wherein said flexible material comprises urethane.
- 6. The system as described in claim 5 wherein said urethane comprises 70 Durometer natural urethane.
- 7. A system for processing a semiconductor substrate comprising:
- a double sided scrubber, wherein said double sided scrubber includes a roller to rotate said substrate, said roller having
- an outer wall;
- a v-shaped groove in said outer wall, said v-shaped groove having an opening in the range of approximately 0.005-0.040 inch with a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate; and
- a central axis.
- 8. The system as described in claim 7 wherein said roller comprises a flexible material.
- 9. The system as described in claim 8 wherein said flexible material comprises urethane.
- 10. The system as described in claim 9 wherein said urethane comprises 70 Durometer natural urethane.
- 11. A system for processing a semiconductor substrate comprising:
- a double sided scrubber, wherein said double sided scrubber includes a roller to rotate said semiconductor substrate, said roller having
- a central axis;
- a top portion;
- a bottom portion;
- an outer wall; and
- a v-shaped groove, said v-shaped groove being in a position substantially around said outer wall of said roller and substantially between said top portion and said bottom portion of said roller, said v-shaped groove having a thickness of approximately 0.005-0.040 inch at the outer opening of said groove, and a depth of approximately 0.067 inch, and wherein said v-shaped groove has a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate.
- 12. The system as described in claim 11 wherein said top portion comprises a top flat portion and a top indented portion and said bottom portion comprises a bottom flat portion and a bottom indented portion.
- 13. The system as described in claim 11 wherein said top flat portion and said bottom flat portion have thicknesses of approximately 0.062 inch.
- 14. The system as described in claim 11 wherein said roller has a thickness of approximately 0.433 inch.
- 15. The system as described in claim 11 wherein said roller has a diameter of approximately 1.625 inches.
- 16. The system as described in claim 11 wherein said roller comprises a flexible material.
- 17. The system as described in claim 16 wherein said flexible material comprises urethane.
- 18. The system as described in claim 17 wherein said urethane comprises 70 Durometer natural urethane.
- 19. The system as described in claim 11 wherein said v-shaped groove further comprises a groove angle of approximately 24.degree..
- 20. An apparatus for use in a semiconductor fabrication system comprising:
- a roller, said roller for rotating a semiconductor substrate in a double sided scrubber, said roller having
- an outer wall, and;
- a v-shaped groove, said v-shaped groove being perpendicular to a central axis of rotation and in a circular position substantially around the circumference of said outer wall of said roller, said v-shaped groove having a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate.
- 21. The apparatus as described in claim 20 wherein said groove contacts said edge of said substrate on at least two points.
- 22. The apparatus as described in claim 20 wherein said groove has an opening in the range of approximately 0.005-0.040 inch.
- 23. The apparatus as described in claim 20 wherein said roller comprises a flexible material.
- 24. The apparatus as described in claim 23 wherein said flexible material comprises urethane.
- 25. The apparatus as described in claim 24 wherein said urethane comprises 70 Durometer natural urethane.
- 26. An apparatus for use in a semiconductor fabrication system comprising:
- a roller, said roller for rotating a semiconductor substrate in a double sided scrubber, said roller having
- an outer wall;
- a v-shaped groove in said outer wall, said v-shaped groove having an opening in the range of approximately 0.005-0.040 inch with a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate; and
- a central axis.
- 27. The apparatus as described in claim 26 wherein said roller comprises a flexible material.
- 28. The apparatus as described in claim 27 wherein said flexible material comprises urethane.
- 29. The apparatus as described in claim 28 wherein said urethane comprises 70 Durometer natural urethane.
- 30. An apparatus for rotating a substrate in a semiconductor fabrication system comprising:
- a roller, said roller for rotating a semiconductor substrate in a double sided scrubber, said roller having
- a central axis;
- a top portion;
- a bottom portion;
- an outer wall; and
- a v-shaped groove, said v-shaped groove being in a position substantially around said outer wall of said roller and substantially between said top portion and said bottom portion of said roller, said v-shaped groove having a thickness of approximately 0.005-0.040 inch at the outer opening of said groove, and a depth of approximately 0.067 inch, and wherein said v-shaped groove has a v-shape operable to pinch an edge of said semiconductor substrate when said roller contacts the edge of said semiconductor substrate.
- 31. The apparatus as described in claim 30 wherein said top portion comprises a top flat portion and a top indented portion and said bottom portion comprises a bottom flat portion and a bottom indented portion.
- 32. The apparatus as described in claim 30 wherein said top flat portion and said bottom flat portion have thicknesses of approximately 0.062 inch.
- 33. The apparatus as described in claim 30 wherein said roller has a thickness of approximately 0.433 inch.
- 34. The apparatus as described in claim 30 wherein said roller has a diameter of approximately 1.625 inches.
- 35. The apparatus as described in claim 30 wherein said roller comprises a flexible material.
- 36. The apparatus as described in claim 35 wherein said flexible material comprises urethane.
- 37. The apparatus as described in claim 36 wherein said urethane comprises 70 Durometer natural urethane.
- 38. The apparatus as described in claim 30 wherein said v-shaped groove further comprises a groove angle of approximately 24.degree..
Parent Case Info
This is a continuation of application Ser. No. 08/275,639, filed Jul. 15, 1994, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2488157 |
Feb 1982 |
FRX |
0143634 |
Jul 1985 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
275639 |
Jul 1994 |
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