Patent Application
20220359118
Embodiments of the present principles generally relate to semiconductor manufacturing.
Inductors are used along with other electronic elements such as capacitors to help tune loads for high power frequency generators used to provide power for processing chambers in the production of semiconductors. Matching networks allow for maximum power transfer between the generators and the processing chambers by maintaining an optimum load as seen by the generators. By automatically adjusting matching impedances between the generators and the processing chambers, a matching network ensures maximum power transfer for different frequencies and different chamber loads. The inventors have observed that during operation the inductor in the match network becomes very hot when subjected to high current loads causing heat/melting damage to surrounding materials.
Accordingly, the inventors have provided methods and apparatus for forming an inductor with superior current handling capabilities.
Methods and apparatus for forming a high current inductor are provided herein.
In some embodiments, a method for forming a high current inductor may comprise forming a central opening lengthwise through a solid core conductive material, wherein the solid core conductive material has an outer diameter, the central opening forms an inner diameter of the solid core conductive material, and a difference between the outer diameter and the inner diameter is a thickness of a ribbon conductor of the high current inductor and removing a spiral portion of the solid core conductive material to form the ribbon conductor of the high current inductor, wherein a width of the spiral portion forms a gap spacing between windings of the ribbon conductor.
In some embodiments, the method may further include wherein the thickness of the ribbon conductor of the high current inductor is approximately 0.060 inches to approximately 0.250 inches, wherein the gap spacing is approximately 0.250 inches to approximately 1.0 inches, wherein the high current inductor has an inductance of approximately 50 nH to approximately 1000 nH, wherein the high current inductor has a length of approximately 2 inches to approximately 20 inches, wherein the inner diameter is approximately 0.5 inches to approximately 5.0 inches, wherein the outer diameter is approximately 0.55 inches to approximately 5.25 inches, wherein the solid core conductive material is copper, wherein the copper is silver plated, positioning an insert inside the high current inductor, wherein the insert has a second outer diameter approximately equal to the inner diameter, wherein the insert is hollow and is formed of a material with a high thermal conductivity and a low dielectric constant, the insert is configured to extract heat from the high current inductor to an inner surface of the insert that is configured to allow coolant to flow across the inner surfaces, wherein the high current inductor operates from greater than zero kilowatts to approximately 10 kilowatts of power, wherein the high current inductor operates at a frequency of 1 MHz to approximately 300 MHz, and/or wherein the high current inductor has an inductive tolerance of less than 5%.
In some embodiments, a non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for forming a high current inductor to be performed, the method may comprise forming a central opening lengthwise through a solid core conductive material, wherein the solid core conductive material has an outer diameter, the central opening forms an inner diameter of the solid core conductive material, and a difference between the outer diameter and the inner diameter is a thickness of a ribbon conductor of the high current inductor and removing a spiral portion of the solid core conductive material to form the ribbon conductor of the high current inductor, wherein a width of the spiral portion forms a gap spacing between windings of the ribbon conductor. In some embodiments, the non-transitory, computer readable medium may further include wherein the high current inductor has an inductance of approximately 50 nH to approximately 1000 nH with an inductive tolerance of less than approximately 5%.
In some embodiments, an apparatus for providing inductance may comprise a high current inductor having a monolithic ribbon conductor formed from a solid core conductive material by removing a center portion and a spiral portion, wherein the monolithic ribbon conductor has a helix shape and one or more electrical connection points on a first end of the monolithic ribbon conductor and on a second end of the monolithic ribbon conductor, wherein the high current inductor is configured to operate with up to 200 amps of current or more and has an inductive tolerance of less than approximately 5%. In some embodiments, the apparatus may further include wherein the solid core conductive material is copper, wherein the high current inductor is configured to operate from zero kilowatts to approximately 10 kilowatts of power or more, and/or wherein an inductive value of the high current inductor is in a range of approximately 50 nH to approximately 1000 nH.
Other and further embodiments are disclosed below.
Embodiments of the present principles, briefly summarized above and discussed in greater detail below, can be understood by reference to the illustrative embodiments of the principles depicted in the appended drawings. However, the appended drawings illustrate only typical embodiments of the principles and are thus not to be considered limiting of scope, for the principles may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
The methods and apparatus enable formation of ribbon inductors for high power and high current applications that can be produced with small inductance variations. The inductor is a critical circuit component in high power RF impedance matching networks used in semiconductor processing chambers and other high-power applications. The techniques of the present principles produce a ribbon inductor that enables the design of high power 10 kW RF matching networks. Instead of fabricating an inductor using magnet wires on a lathe or coil winder, the ribbon inductor of the present principles can be machined from a solid cylinder of conductive material. The resulting ribbon inductor can handle very high power (approximately 10 kW or more) and high current (approximately 200 A or more) with small inductance variations from one inductor to another inductor which is critical in RF impedance matching network applications for filtering and impedance tuning purposes. The small inductance variation allows a manufacturer to produce products with tighter tolerances and reproducible performance from product to product. Another advantage of the present principles is an inductor with an operating temperature that is up to 50% or more lower than traditionally wound inductors.
Traditional inductors are fabricated by using magnet wires or tubes and rolled on a lathe or coil winder. A traditional inductor cannot be used for high current and high-power applications because the size of the wire or tube used in the windings has a small cross-sectional area which increases the wires or tubes resistivity to high levels of current. When high levels of current are applied to traditional inductors, the electrical resistance causes substantial heat within the winding which leads to failures such as insulation breakdown (wire-to-wire shorting) and heat damage to surrounding components. The inventors have found that with traditionally wound inductors, the turn-to-turn windings always have some variations which cause overall inductance value variations as the inductors are manufactured. The inventors have also found that the traditionally wound inductors were unable to conduct large currents due to the small surface areas of the wires or tubing used in the traditionally wound inductors. The inventors have discovered that the ribbon inductors of the present principles allow for a much higher power and higher current inductor to be produced within the same geometric volume as the lower power and lower current traditionally wound inductor while dramatically increasing the power handling and performance. The ribbon inductors of the present principles can also be produced with very low inductor-to-inductor inductance variations which enable tight tolerance products to be manufactured for repeatable performance across a line of products or within a productor (e.g., process chamber with multiple RF impedance match networks).
In block 104, a spiral portion 402 of the solid core conductive material 202 is removed to form a ribbon conductor 512 (see
The coil pitch 416 can be well controlled during manufacturing, which greatly reduces inductance variations. The coil pitch 416 is the distance between turns measured between ribbon conductor winding centers. The coil pitch 416 may be adjusted to yield more or less turns for an inductor for a given length. Higher operating frequencies require less turns in the inductor. In some embodiments, the resulting ribbon inductor may operate from 1 MHz to 300 MHz. In some embodiments, the resulting ribbon inductor may operate from 27 MHz to 200 MHz. The spiral portion 402 may be removed via a milling process or via an automated computer-controlled process such as a computer numerical control (CNC) process and the like. A ribbon conductor width 406 may be from approximately 0.5 inches to approximately 4.0 inches and adjusted based on a desired current value running through the ribbon conductor (wider ribbon width allows higher current flow).
Embodiments in accordance with the present principles may be implemented in hardware, firmware, software, or any combination thereof. Embodiments may also be implemented as instructions stored using one or more computer readable media, which may be read and executed by one or more processors. A computer readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing platform or a “virtual machine” running on one or more computing platforms). For example, a computer readable medium may include any suitable form of volatile or non-volatile memory. In some embodiments, the computer readable media may include a non-transitory computer readable medium.
The large surface area of the ribbon conductor 512 allows very high current (e.g., 200 A or more) to flow through the ribbon conductor 512 and also affords better heat dissipation. After removal of the spiral portion 402, the ribbon conductor 512 is formed which also forms the basis of a ribbon inductor 516. The ribbon conductor 512 is formed from the solid core conductive material 202 in the shape of a helix. The ribbon conductor 512 is a “monolithic ribbon conductor” in that the ribbon conductor 512 is rigid and is formed from a single piece of material. In the view 500 of
The machining processes used in the present principles to form a ribbon inductor allow for high precision which translates to reproducible inductance values over an inductor production run which is not obtainable with traditionally wound inductors. By using a solid core material to form a ribbon inductor, the ribbon inductor is more structurally rigid which translates to less inductance value changes over a given current range and/or temperature range than with traditionally wound inductors. Manufacturing tolerances of less 5% for inductance values may be obtained using the formation methods of the present principles. The inventors have also found that machining an inductor from a solid core material eliminates internal stresses due to the winding of wires or tubes as found in traditionally wound inductors, reducing failures caused by fatigue or increased resistivity produced by the added internal stresses.
In optional block 106, one or more electrical connection points at one or more ends of the ribbon inductor 516 may be formed. In some embodiments, one or more fastening points 506 may be formed in the first end 504A and/or the second end 504B. The one or more fastening points 506 may be holes or other implementations that allow electrical connections (electrical connection points) to be made to the ends of the ribbon inductor 516 in order to flow current through the ribbon inductor 516. In optional block 108, an insert 602, such as a tube-like structure, may be positioned inside the ribbon inductor 516 as depicted in a view 600 of
For example, as depicted in a view 700 of
In some embodiments, a ribbon inductor 916 may be used in a semiconductor processing system 900 of
In some embodiments, a controller 908 may be used in the semiconductor processing system 900. The controller 908 controls the operation of the semiconductor processing system 900 using direct control or alternatively, by controlling the computers (or controllers) associated with the apparatus of the semiconductor processing system 900. In operation, the controller 908 enables data collection and feedback from the respective apparatus and systems to optimize performance of the semiconductor processing system 900. The controller 908 permits monitoring of, for example, the impedance matching processes to collect data. With the ribbon inductor of the present principles, the controller 908 will see less parameter variations and impedance matching process drifts. The controller 908 generally includes a Central Processing Unit (CPU) 910, a memory 912, and a support circuit 914. The CPU 910 may be any form of a general-purpose computer processor that can be used in an industrial setting. The support circuit 914 is conventionally coupled to the CPU 910 and may comprise a cache, clock circuits, input/output subsystems, power supplies, and the like. Software routines, such as a method as described below may be stored in the memory 912 and, when executed by the CPU 910, transform the CPU 910 into a specific purpose computer (controller 908). The software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the semiconductor processing system 900.
The memory 912 is in the form of computer-readable storage media that contains instructions, when executed by the CPU 910, to facilitate the operation of the semiconductor processes and equipment. The instructions in the memory 912 are in the form of a program product such as a program that implements process recipes, power transfer optimization, impedance matching control, etc. The program code may conform to any one of a number of different programming languages. In one example, the disclosure may be implemented as a program product stored on a computer-readable storage media for use with a computer system. The program(s) of the program product define functions of the aspects (including the methods described herein). Illustrative computer-readable storage media include, but are not limited to: non-writable storage media (e.g., read-only memory devices within a computer such as CD-ROM disks readable by a CD-ROM drive, flash memory, ROM chips, or any type of solid-state non-volatile semiconductor memory) on which information is permanently stored; and writable storage media (e.g., floppy disks within a diskette drive or hard-disk drive or any type of solid-state random access semiconductor memory) on which alterable information is stored. Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are aspects of the present principles.
While the foregoing is directed to embodiments of the present principles, other and further embodiments of the principles may be devised without departing from the basic scope thereof.
