This is a continuation of application Ser. No. 08/744,377 filed on Nov. 7, 1996, now U.S. Pat. No. 5,967,850; which is a continuation of application Ser. No. 08/381,142 filed on Jan. 31, 1995, now U.S. Pat. No. 5,575,688; which is a continuation of application Ser. No. 07/983,083 filed on Dec. 1, 1992, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3337838 | Damiano et al. | Aug 1967 | |
3366915 | Miller | Jan 1968 | |
3444506 | Wedekind | May 1969 | |
3848221 | Lee, Jr. | Nov 1974 | |
4274700 | Keglewitsch et al. | Jun 1981 | |
4373764 | Ulrich | Feb 1983 | |
4487463 | Tillotson | Dec 1984 | |
4572604 | Ammon et al. | Feb 1986 | |
4616406 | Brown | Oct 1986 | |
4654472 | Goldfarb | Mar 1987 | |
4655526 | Shaffer | Apr 1987 | |
4698663 | Sugimoto et al. | Oct 1987 | |
4734042 | Martens et al. | Mar 1988 | |
4897055 | Jurista et al. | Jan 1990 | |
4943846 | Shirling | Jul 1990 | |
4959750 | Cnyrim et al. | Sep 1990 | |
4975066 | Sucheski et al. | Dec 1990 | |
4997376 | Buck et al. | Mar 1991 | |
5015207 | Koepke | May 1991 | |
5037311 | Frankeny et al. | Aug 1991 | |
5071363 | Reylek et al. | Dec 1991 | |
5081563 | Feng et al. | Jan 1992 | |
5117069 | Higgins, III | May 1992 | |
5123164 | Shaheen et al. | Jun 1992 | |
5137456 | Desai et al. | Aug 1992 | |
5140659 | Minds | Aug 1992 | |
5281151 | Arima et al. | Jan 1994 | |
5309024 | Hirano | May 1994 | |
5326936 | Taniuchi et al. | Jul 1994 | |
5330372 | Pope et al. | Jul 1994 | |
5334279 | Gregoire | Aug 1994 | |
5342999 | Frei et al. | Aug 1994 | |
5351393 | Gregoire | Oct 1994 | |
5371404 | Juskey et al. | Dec 1994 | |
5376825 | Tukamoto et al. | Dec 1994 | |
5390412 | Gregoire | Feb 1995 |
Number | Date | Country |
---|---|---|
3737819 A1 | May 1988 | DE |
0 321 212 | Jun 1989 | EP |
0 405 454 A2 | Jan 1991 | EP |
0 467 698 | Jan 1992 | EP |
1129608 | Oct 1968 | GB |
WO 9413034 | Jun 1994 | WO |
WO 9427345 | Nov 1994 | WO |
Entry |
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AMP Product Guide, Printed Circuited Board Connectors 3, pp. 3008, 3067-3068, 3102-3103, 3122-3123. |
George D. Gregoire, “3-Dimensional Circuitry Solves Fine Pitch SMT Device Assembly Problem;” Connection Technology. |
Dimensional Circuits Corporation, “Dimensional Circuits Corp. Awarded Two U.S. Patents,” D.C.C. News, Apr. 5, 1994. |
George D. Gregoire, “Very Fine Line Recessed Circuitry—A New PCB Fabrication Process”. |
Robert Barnhouse, “Bifurcated Through-Hole Technology—An Innovative Solution to Circuit Density,” Connection Technology, pp. 33-35 (Feb., 1992). |
AMP Product Information Bulletin, “AMP-ASC Interconnection Systems,” pp. 1-4 (1991). |
AMP Product Guide, “Micro-Strip Interconnection System,” pp. 3413-3414 (Jun., 1991). |
Du Pont Connector Systems Product Catalog A, “Rib-Cage II Through-Mount Shrouded Headers” and “Micropax Board-to-board Interconnect System,” pp. 2-6, 3-0, 3-1 (Feb., 1992). |
R.R. Tummala et al., “Microelectronics Packaging Handbook,” Van Nostrand Reinhold, 1989, pp. 38-43, 398-403, 779-791, 853-859, and 900-905. |
Intel Corporation, “Packing,” pp. 2-36, 2-96, 2-97, 2-100, 3-2, 3-24, and 3-25; (1993). |
Number | Date | Country | |
---|---|---|---|
Parent | 08/744377 | Nov 1996 | US |
Child | 09/407955 | US | |
Parent | 08/381142 | Jan 1995 | US |
Child | 08/744377 | US | |
Parent | 07/983083 | Dec 1992 | US |
Child | 08/381142 | US |