Silicon Bandwidth, Inc.

Organization

Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip carrier affording a high-density external interface
- Patent number 7,183,646
- Issue date Feb 27, 2007
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic seal
- Patent number 7,135,768
- Issue date Nov 14, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor for an integrated circuit and method of manufa...
- Patent number 7,123,465
- Issue date Oct 17, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance optoelectronic packaging assembly
- Patent number 7,070,340
- Issue date Jul 4, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular coaxial electrical interconnect system having a modular fra...
- Patent number 6,905,367
- Issue date Jun 14, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,857,173
- Issue date Feb 22, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device for radio frequency shielding
- Patent number 6,847,115
- Issue date Jan 25, 2005
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated semiconductor chip carrier
- Patent number 6,828,511
- Issue date Dec 7, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package having mesh power and ground planes
- Patent number 6,803,650
- Issue date Oct 12, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package for connection to a substrate
- Patent number 6,797,882
- Issue date Sep 28, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro grid array semiconductor die package
- Patent number 6,734,546
- Issue date May 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,709,891
- Issue date Mar 23, 2004
- Silicon Bandwidth Inc.
- Sanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor die package and method of manufacturing thereof
- Patent number 6,700,138
- Issue date Mar 2, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Grant
Electrical connector having electrically conductive shielding
- Patent number 6,679,733
- Issue date Jan 20, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic packaging assembly
- Patent number 6,663,294
- Issue date Dec 16, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,603,193
- Issue date Aug 5, 2003
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrier affording a high-density external interface
- Patent number 6,577,003
- Issue date Jun 10, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular architecture for high bandwidth computers
- Patent number 6,574,726
- Issue date Jun 3, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,475,832
- Issue date Nov 5, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Female contact pin including flexible contact portion
- Patent number 6,461,197
- Issue date Oct 8, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,421,254
- Issue date Jul 16, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated semiconductor chip carrier
- Patent number 6,339,191
- Issue date Jan 15, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having staggered hold-down tabs
- Patent number 6,334,794
- Issue date Jan 1, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,307,258
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated connector and semiconductor die package
- Patent number 6,305,987
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer cabinet
- Patent number D447143
- Issue date Aug 28, 2001
- Silicon Bandwidth
- Stanford W. Crane
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,266,246
- Issue date Jul 24, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly with a female electrical connector ha...
- Patent number 6,247,972
- Issue date Jun 19, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density electrical interconnect system
- Patent number 6,203,347
- Issue date Mar 20, 2001
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,141,869
- Issue date Nov 7, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backplane system having high-density electrical connectors
- Publication number 20080005442
- Publication date Jan 3, 2008
- The Panda Project
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Backplane system having high-density electrical connectors
- Publication number 20060282593
- Publication date Dec 14, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060279904
- Publication date Dec 14, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060067031
- Publication date Mar 30, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20050280158
- Publication date Dec 22, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die package for connection to a substrate
- Publication number 20040232447
- Publication date Nov 25, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20040222514
- Publication date Nov 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector having staggered hold-down tabs
- Publication number 20040203281
- Publication date Oct 14, 2004
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20040140542
- Publication date Jul 22, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular semiconductor die package and method of manufacturing thereof
- Publication number 20040026757
- Publication date Feb 12, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Semiconductor chip carrier affording a high-density external interface
- Publication number 20040007774
- Publication date Jan 15, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular architecture for high bandwidth computers
- Publication number 20040010638
- Publication date Jan 15, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Micro grid array semiconductor die package
- Publication number 20030162319
- Publication date Aug 28, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-cavity semiconductor die package
- Publication number 20030003626
- Publication date Jan 2, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20020117751
- Publication date Aug 29, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20020053455
- Publication date May 9, 2002
- SILICON BANDWIDTH INC.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated connector and semiconductor die package
- Publication number 20020019174
- Publication date Feb 14, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-cavity semiconductor die package
- Publication number 20020008308
- Publication date Jan 24, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connector assembly
- Publication number 20010034164
- Publication date Oct 25, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
78395809 - CAPCORE
- Serial number 78395809
- Filing date Apr 2, 2004
- Silicon Bandwidth, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78101796 - OPTOTOP
- Serial number 78101796
- Filing date Jan 9, 2002
- SILICON BANDWIDTH, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76324803 - OPTOSPYDER
- Serial number 76324803
- Filing date Oct 12, 2001
- Silicon Bandwidth Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Silicon Bandwidth, Inc.

Organization

Patents Grantslast 30 patents

Semiconductor chip carrier affording a high-density external interface

Hermetic seal

Decoupling capacitor for an integrated circuit and method of manufa...

High performance optoelectronic packaging assembly

Modular coaxial electrical interconnect system having a modular fra...

Apparatus for and method of manufacturing a semiconductor die carrier

Packaged semiconductor device for radio frequency shielding

Prefabricated semiconductor chip carrier

Semiconductor die package having mesh power and ground planes

Die package for connection to a substrate

Micro grid array semiconductor die package

Open-cavity semiconductor die package

Modular semiconductor die package and method of manufacturing thereof

Electrical connector having electrically conductive shielding

Optoelectronic packaging assembly

Semiconductor package

Semiconductor chip carrier affording a high-density external interface

Modular architecture for high bandwidth computers

Open-cavity semiconductor die package

Female contact pin including flexible contact portion

Multi-chip module having interconnect dies

Prefabricated semiconductor chip carrier

Electrical connector having staggered hold-down tabs

Open-cavity semiconductor die package

Integrated connector and semiconductor die package

Computer cabinet

Multi-chip module having interconnect dies

Electrical connector assembly with a female electrical connector ha...

High-density electrical interconnect system

Apparatus for and method of manufacturing a semiconductor die carrier

Patents Applicationslast 30 patents

Backplane system having high-density electrical connectors

Backplane system having high-density electrical connectors

Decoupling capacitor for an integrated circuit and method of manufa...

Decoupling capacitor for an integrated circuit and method of manufa...

Prefabricated semiconductor chip carrier

Die package for connection to a substrate

Semiconductor die package having mesh power and ground planes

Electrical connector having staggered hold-down tabs

Prefabricated semiconductor chip carrier

Modular semiconductor die package and method of manufacturing thereof

Semiconductor chip carrier affording a high-density external interface

Modular architecture for high bandwidth computers

Micro grid array semiconductor die package

Open-cavity semiconductor die package

Semiconductor die package having mesh power and ground planes

Prefabricated semiconductor chip carrier

Integrated connector and semiconductor die package

Open-cavity semiconductor die package

Electrical connector assembly

Trademarklast 30 trademarks

78395809 - CAPCORE

78101796 - OPTOTOP

76324803 - OPTOSPYDER